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STM32G0B1KEU3N

STMicroelectronics

STM32G0B1KEU3N by STMicroelectronics

STM32G0B1KEU3N microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 125 °C, and supports up to 48 MHz clock speed. It includes integrated DAC and ADC channels for versatile applications. Ideal for automotive use, it offers low power modes and extensive connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,256 parts In-Stock

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3,256

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Vyrian

USA . 2,777 parts In-Stock

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2,777

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Anansix

USA . 974 parts In-Stock

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974

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Distributors (Availability)

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AZTECH Wire

Italy . 550 parts In-Stock

1+ parts

$8.100

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550

$8.100

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IDEA Electronic Components Group

UK . 1,886 parts In-Stock

1+ parts

$71.722

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$64.550

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1,886

$71.722

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$64.550

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MKK Technologies

India . 383 parts In-Stock

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$134.869

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383

$134.869

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DigiPath Technology Company

USA . 383 parts In-Stock

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$134.869

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383

$134.869

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Parana Technologies

USA . 1,928 parts In-Stock

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$85.755

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1,928

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$85.755

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Corphita

USA . 288 parts In-Stock

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Overview

Unlock the potential of your next project with the STM32G0B1KEU3N microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a powerhouse that combines efficiency, versatility, and reliability. Perfect for automotive applications, this 32-bit controller offers seamless connectivity and advanced features, ensuring exceptional performance in any environment. Experience the advantages of cutting-edge technology designed to elevate your designs and drive success!

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache improves the speed and efficiency of the microcontroller, making it suitable for performance-critical applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy automation in manufacturing processes.

Maximum Supply Voltage: 3.6 V

A moderate maximum supply voltage allows for compatibility with a wide range of power sources and devices.

On Chip Data RAM Width: 8

8-bit RAM width can efficiently handle data processing for various applications, particularly in embedded systems.

Package Shape: SQUARE

A square package shape offers design flexibility and uniform thermal performance.

Bit Size: 32

The 32-bit architecture provides increased computational power and larger address spaces for complex applications.

DAC Channels: YES

Having Digital-to-Analog Converter channels allows for direct conversion of digital signals to analog, useful in audio and control applications.

No. of Terminals: 32

A total of 32 terminals enhances the connectivity options for interfacing with various sensors and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style promotes efficient heat dissipation while maintaining a compact form factor.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage enhances the energy efficiency, making it apt for battery-powered devices.

Maximum Operating Temperature: 125 °C

Wide temperature endurance ensures reliability and performance in demanding automotive environments.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family delivers low power consumption while providing high performance, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Extreme low-temperature operation supports its application in harsh environmental conditions.

ADC Channels: YES

Analog-to-Digital Converter channels are essential for interfacing with sensors and acquiring real-world data.

DMA Channels: YES

Direct Memory Access allows for efficient data transfer, reducing CPU load and improving performance in data-intensive tasks.

Terminal Position: QUAD

Quad terminal positioning provides better stability and easier layout in PCB designs.

ROM Words: 524288

A large ROM capacity allows for extensive firmware storage, accommodating complex application logic.

Maximum Seated Height: 0.6 mm

A low seated height aids in compact designs and minimizes the overall height of the final product.

Digital To Analog Converters: 2-Ch 12-Bit

Having two 12-bit DACs offers high resolution for precise analog signal generation, suitable for high-fidelity audio applications.

Width: 5 mm

Compact width facilitates its integration into space-constrained designs.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

A rich set of peripherals enhances functionality and allows for diverse application implementations.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz enables quick data processing and responsiveness in real-time applications.

Length: 5 mm

The short length contributes to the compact design, essential in portable and embedded systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive standards, ensuring reliability and safety in vehicle applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient instruction execution and lower power consumption.

No. of Timers: 13

Multiple timers enable precise time management and scheduling in various applications.

RAM Bytes: 147456

Ample RAM size supports complex applications and data handling without performance degradation.

Technology: CMOS

CMOS technology ensures low power consumption and high integration density, beneficial for portable applications.

Terminal Form: NO LEAD

No-lead terminals facilitate easier soldering and smaller PCB designs.

Analog To Digital Converters: 10-Ch 12-Bit

Ten 12-bit ADC channels allow for extensive analog signal acquisition from multiple sources, enhancing versatility.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA covers a range of operational needs while maintaining power efficiency.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V is favorable for battery-operated applications, optimizing power usage.

No. of DMA Channels: 12

The presence of 12 DMA channels supports complex multitasking and data handling, improving overall system performance.

No. of Serial I/Os: 10

Ten serial I/O lines enhance communication capabilities, essential for modern interconnected applications.

PWM Channels: YES

Pulse Width Modulation channels allow for effective control of motors and other variable systems.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Diverse connectivity options ensure compatibility with various peripherals and facilitate ease of integration.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming of the microcontroller's firmware.

Terminal Pitch: 0.5 mm

A fine terminal pitch is conducive for high-density PCB layouts, optimizing space utilization.

Format: FIXED-POINT

Fixed-point format processing supports efficient mathematical computations, particularly in control applications.

Speed: 64 rpm

Operating at a speed of 64 rpm indicates suitability for applications in sensitive or controlled environments.

Low Power Mode: YES

Low power mode capability is crucial for energy-sensitive applications, extending battery life in portable devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates compatibility with a broad range of control applications.

No. of I/O Lines: 29

With 29 I/O lines, this microcontroller provides ample interfacing options for diverse applications and sensor connectivity.

Technical Specifications

Microcontrollers STM32G0B1KEU3N attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

2-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

29

No. of Serial I/Os:

10

No. of Terminals:

32

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

147456

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1KEU3N Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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