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STM32G0B1CCU6NTR

STMicroelectronics

STM32G0B1CCU6NTR by STMicroelectronics

STM32G0B1CCU6NTR by STMicroelectronics is a 32-bit microcontroller with Cortex-M0 CPU, 48 MHz clock frequency, and 147456 bytes of RAM. It features 12 ADC channels, 2 DAC channels, and low power mode ideal for industrial applications requiring high-speed processing and low energy consumption. With various connectivity options like CAN, I2C, SPI, and USB, it offers versatile peripheral support for diverse IoT and embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,875 parts In-Stock

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4,875

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Vyrian

USA . 2,659 parts In-Stock

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2,659

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Anansix

USA . 2,649 parts In-Stock

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2,649

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 761 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

10k+ parts

-

761

$5.000

$4.875

$4.850

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AZTECH Wire

Italy . 565 parts In-Stock

1+ parts

$12.209

100+ parts

-

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565

$12.209

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Microchip USA

USA . 5,838 parts In-Stock

1+ parts

$21.899

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5,838

$21.899

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Ampacity Inc.

Singapore . 420 parts In-Stock

1+ parts

$28.000

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420

$28.000

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IDEA Electronic Components Group

UK . 994 parts In-Stock

1+ parts

$41.178

100+ parts

-

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$37.060

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994

$41.178

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$37.060

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Aztec Data Supply Inc.

USA . 2,953 parts In-Stock

1+ parts

$45.100

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2,953

$45.100

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Corohmni

South Africa . 1,021 parts In-Stock

1+ parts

$63.373

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1,021

$63.373

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MKK Technologies

India . 747 parts In-Stock

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$77.433

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747

$77.433

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DigiPath Technology Company

USA . 747 parts In-Stock

1+ parts

$77.433

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747

$77.433

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Argo Parts USA

USA . 3,803 parts In-Stock

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3,803

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Continental Prestige Electronics

USA . 718 parts In-Stock

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718

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Corphita

USA . 469 parts In-Stock

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469

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Parana Technologies

USA . 153 parts In-Stock

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$49.235

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153

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$49.235

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Overview

Unleash the power of innovation with the STM32G0B1CCU6NTR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers high-quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this microcontroller offers integrated cache, low power consumption, and a maximum clock frequency of 48 MHz. With features like DAC and ADC channels, DMA support, and various connectivity options, the STM32G0B1CCU6NTR provides exceptional value and performance to customers looking to elevate their projects to the next level. Upgrade your designs today with the STM32G0B1CCU6NTR and experience the difference in quality and efficiency.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache helps in reducing memory access times and improving overall performance of the microcontroller.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of peripherals.

Bit Size: 32

A 32-bit microcontroller offers higher processing power and efficiency compared to lower bit sizes, making it suitable for complex embedded applications.

ADC Channels: YES

Having Analog to Digital Converter (ADC) channels built into the microcontroller enables easy integration of analog sensors and data acquisition capabilities.

No. of Timers: 13

Having multiple timers allows for accurate timing control and synchronization of various functions in the system, making it suitable for applications requiring precise timekeeping.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

The wide range of connectivity options provides flexibility in interfacing with different devices and communication protocols, enhancing the versatility of the microcontroller.

Speed: 64 rpm

The high speed capability of 64 rpm allows for fast data processing and real-time responsiveness in applications that require quick decision-making.

Low Power Mode: YES

The availability of a low power mode helps in reducing power consumption during idle or low activity periods, extending battery life in portable devices.

Technical Specifications

Microcontrollers STM32G0B1CCU6NTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of I/O Lines:

42

No. of Serial I/Os:

10

No. of Terminals:

48

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1CCU6NTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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