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STM32G0B1CCT7

STMicroelectronics

STM32G0B1CCT7 by STMicroelectronics

STM32G0B1CCT7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 14 ADC channels. Ideal for industrial applications, it supports various connectivity options like CAN and USB. Its low power mode enhances efficiency in embedded systems.

Median Price

$4.510

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 100 parts In-Stock

1+ parts

$4.510

100+ parts

$2.851

1k+ parts

$2.623

10k+ parts

$2.465

100

$4.510

$2.851

$2.623

$2.465

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,660

-

-

-

-

Digiode

USA . 2,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,756

-

-

-

-

Anansix

USA . 2,338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,338

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 605 parts In-Stock

1+ parts

$19.850

100+ parts

-

1k+ parts

-

10k+ parts

-

605

$19.850

-

-

-

IDEA Electronic Components Group

UK . 721 parts In-Stock

1+ parts

$38.434

100+ parts

-

1k+ parts

$34.591

10k+ parts

-

721

$38.434

-

$34.591

-

MKK Technologies

India . 739 parts In-Stock

1+ parts

$72.272

100+ parts

-

1k+ parts

-

10k+ parts

-

739

$72.272

-

-

-

DigiPath Technology Company

USA . 739 parts In-Stock

1+ parts

$72.272

100+ parts

-

1k+ parts

-

10k+ parts

-

739

$72.272

-

-

-

Corphita

USA . 2,699 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,699

-

-

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Parana Technologies

USA . 1,988 parts In-Stock

1+ parts

-

100+ parts

$45.954

1k+ parts

-

10k+ parts

-

1,988

-

$45.954

-

-

Overview

Unlock limitless possibilities with the STM32G0B1CCT7 microcontroller from STMicroelectronics! Renowned for its exceptional quality and reliability, this versatile chip excels in a variety of applications—from industrial automation to IoT devices. With low power consumption and robust performance, it empowers developers to create innovative solutions that stand out in the market. Elevate your projects today and experience the advantages of choosing an industry leader!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable materials ensure longevity and resilience in various applications.

Integrated Cache: YES

The presence of an integrated cache enhances performance by speeding up data access times.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and ease of manufacturing.

Maximum Supply Voltage: 3.6 V

Supports a range of supply voltages, making it versatile for different power requirements.

On Chip Data RAM Width: 8

Allows for efficient processing and storage of data within the microcontroller.

Package Shape: SQUARE

A square shape optimizes space on the PCB, facilitating tighter layouts.

Bit Size: 32

32-bit architecture provides a significant processing capability, enabling more complex applications.

DAC Channels: YES

Built-in Digital-to-Analog Conversion capabilities allow for more versatile output options.

No. of Terminals: 48

A higher number of terminals provide more I/O options for connecting various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is ideal for high-density applications and reduces the overall footprint.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage allows for battery-powered applications, enhancing energy efficiency.

Maximum Operating Temperature: 105 °C

High temperature tolerance enables operation in harsh industrial environments.

CPU Family: CORTEX-M0

The Cortex-M0 core is optimized for low power and high performance, perfect for embedded applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes this microcontroller suitable for extreme conditions.

ADC Channels: YES

Integrated Analog-to-Digital Converters allow for precise measurement of analog signals.

DMA Channels: YES

Direct Memory Access capabilities improve data transfer efficiency and CPU resource management.

Terminal Position: QUAD

Quad terminal positioning provides flexibility in circuit design and ensures better stability.

ROM Words: 262144

Generous ROM capacity accommodates complex firmware and applications.

Maximum Seated Height: 1.6 mm

Low profile design suitable for compact and space-constrained designs.

Digital To Analog Convertors: 2-Ch 12-Bit

High-resolution DACs enable accurate analog output, enhancing performance in audio and control systems.

Width: 7 mm

Compact width allows for versatile mounting options in various setups.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Rich peripheral set offers extensive functionalities for diverse applications.

Maximum Clock Frequency: 48 MHz

A high clock frequency ensures quick processing and responsiveness in applications.

Length: 7 mm

Compact length contributes to space-saving designs, facilitating easier integration.

Temperature Grade: INDUSTRIAL

Industrial-grade specifications ensure reliability and performance in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances efficiency and speed, making it ideal for various tasks.

No. of Timers: 13

Multiple timers offer precise timing control for real-time applications.

RAM Bytes: 147456

Generous RAM allocation supports complex processing and multitasking capabilities.

Technology: CMOS

CMOS technology provides low power consumption, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate easier handling and improve soldering quality.

Analog To Digital Convertors: 14-Ch 12-Bit

High-channel ADC capability enables multiple simultaneous analog signal readings.

Maximum Supply Current: 100 mA

Optimized power management within the device supports low-power applications.

Nominal Supply Voltage: 3 V

Standard operating voltage enhances compatibility with common power sources.

No. of DMA Channels: 12

Multiple DMA channels improve data handling and system performance.

No. of Serial I/Os: 10

Offers ample serial communication options for integrating various components.

PWM Channels: YES

Pulse Width Modulation support enables precise control in applications like motor control.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Versatile connectivity options facilitate integration into various networks and devices.

ROM Programmability: FLASH

Flash memory allows for easy firmware updates, providing flexibility for developers.

Terminal Pitch: 0.5 mm

Fine terminal pitch is ideal for modern, high-density PCB designs.

Format: FIXED-POINT

Fixed-point format aids in efficient arithmetic operations essential for embedded applications.

Speed: 64 rpm

Provides sufficient speed for many control applications.

Low Power Mode: YES

Low power modes extend battery life in portable applications and reduce energy costs.

On Chip Program ROM Width: 8

8-bit program ROM width supports compatibility with existing software libraries.

No. of I/O Lines: 44

A high number of I/O lines allows for extensive interfacing options with external devices.

Technical Specifications

Microcontrollers STM32G0B1CCT7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

44

No. of Serial I/Os:

10

No. of Terminals:

48

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1CCT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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