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STM32G081RBT3

STMicroelectronics

STM32G081RBT3 by STMicroelectronics

STM32G081RBT3 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 125 °C, and supports up to 48 MHz clock speed. With 64 terminals, it includes ADC/DAC channels for versatile applications in automotive and industrial sectors. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 10,725 parts In-Stock

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10,725

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Anansix

USA . 998 parts In-Stock

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998

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Digiode

USA . 795 parts In-Stock

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795

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Distributors (Availability)

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AZTECH Wire

Italy . 235 parts In-Stock

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$18.290

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235

$18.290

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Component Stockers USA

USA . 1,980 parts In-Stock

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$46.840

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1,980

$46.840

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IDEA Electronic Components Group

UK . 359 parts In-Stock

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$69.880

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$62.892

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359

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$62.892

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MKK Technologies

India . 262 parts In-Stock

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$131.406

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262

$131.406

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DigiPath Technology Company

USA . 262 parts In-Stock

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$131.406

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262

$131.406

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,871 parts In-Stock

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$83.553

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1,871

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$83.553

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Corphita

USA . 227 parts In-Stock

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Overview

Unlock the potential of your projects with the STM32G081RBT3 microcontroller from STMicroelectronics! Renowned for their innovation and quality, STMicroelectronics ensures robust performance in automotive and industrial applications. With low power consumption, versatile connectivity options, and a compact design, this 32-bit powerhouse enhances efficiency and reliability. Experience seamless integration and unleash creativity in your designs, driving your success forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, enhancing the reliability of the microcontroller in various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and enables automation in manufacturing, leading to cost-effective production.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power electronic devices.

Package Shape: SQUARE

The square package shape enables uniform PCB layout and efficient thermal management, which is beneficial for high-density applications.

Bit Size: 32

The 32-bit architecture enhances processing power and supports complex applications and algorithms, making it versatile for various tasks.

DAC Channels: YES

Having DAC channels allows the microcontroller to produce analog signals, making it suitable for audio and control applications.

No. of Terminals: 64

A higher number of terminals allows for more I/O connections, providing greater flexibility for interfacing with sensors and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile and fine pitch design facilitates compact board designs and high-density layouts, ideal for modern electronic devices.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage enables operation in battery-powered applications, extending device life and reducing power consumption.

Maximum Operating Temperature: 125 °C

Withstanding high temperatures makes this microcontroller suitable for automotive and industrial applications where thermal conditions may vary.

CPU Family: CORTEX-M0

The Cortex-M0 core offers an energy-efficient architecture, optimizing performance for low-power applications while maintaining high execution speed.

Minimum Operating Temperature: -40 °C

This microcontroller can function in extreme low-temperature conditions, broadening its application range in harsh environments.

ADC Channels: YES

Including ADC channels enhances its ability to interface with analog sensors, making it suitable for data acquisition tasks.

DMA Channels: YES

DMA channels allow efficient data transfer without CPU intervention, freeing up processing resources for other tasks and improving overall efficiency.

Terminal Position: QUAD

The quad terminal configuration ensures reliability in soldering and connection, providing robust support for PCB designs.

ROM Words: 131072

With a substantial amount of flash memory, this microcontroller can support complex applications and firmware updates.

Maximum Seated Height: 1.6 mm

The low seated height supports space-saving designs, which is essential for compact electronic devices.

Digital To Analog Converters: 2-Ch 12-Bit

The presence of dual 12-bit DACs supports precise analog output, making this microcontroller suitable for high-quality audio and control applications.

Width: 10 mm

The compact width enables it to be integrated into various space-constrained environments.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, RTC, TIMER(12), WDT(2)

A rich set of peripherals enhances versatility, allowing it to handle multiple functions and tasks needed in complex applications.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides sufficient speed for most control and processing tasks, ensuring responsive performance.

Length: 10 mm

The compact length contributes to the overall small footprint of the device, suitable for tight PCB layouts.

Temperature Grade: AUTOMOTIVE

This automotive-grade microcontroller meets rigorous standards for reliability and performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides a simplified instruction set that enhances execution efficiency, making this microcontroller ideal for a variety of applications.

No. of Timers: 12

Multiple timers allow for precise time-based operations and multi-tasking capabilities, beneficial for time-sensitive applications.

RAM Bytes: 36864

A decent amount of RAM supports fast data processing and handling of multiple tasks, enhancing the microcontroller's performance.

Technology: CMOS

CMOS technology ensures low power consumption and enables integration of multiple functions on a single chip.

Terminal Form: GULL WING

The gull wing terminal form is beneficial for accessible soldering and provides strong mechanical support for connections.

Analog To Digital Converters: 19-Ch 12-Bit

With a high number of 12-bit ADC channels, this microcontroller is ideal for applications requiring detailed data acquisition from multiple analog sources.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V is optimal for battery-powered devices, ensuring extended operational efficiency.

No. of DMA Channels: 7

Having seven DMA channels allows for efficient data handling and processing, significantly improving performance in data-intensive applications.

PWM Channels: YES

With PWM channels, the microcontroller can effectively control motors and other devices needing variable signal strength, enhancing its application range.

Connectivity: I2C(2), I2S, SPI(2), UART, USART(4), USB

A rich array of connectivity options supports various communicating protocols, making the microcontroller versatile for numerous interfaces and modules.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming and updates, essential for developing and maintaining software applications.

Terminal Pitch: 0.5 mm

A fine terminal pitch supports high-density connections, suitable for advanced microcontroller applications.

Speed: 64 rpm

The operational speed can cater to devices requiring specific performance levels, ensuring versatility in applications.

On Chip Program ROM Width: 8

An 8-bit instruction width optimizes instruction set efficiency and allows simplified processing capabilities.

No. of I/O Lines: 60

Having 60 I/O lines provides extensive interfacing options for external devices, sensors, and connectors, making it highly adaptable.

Technical Specifications

Microcontrollers STM32G081RBT3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

SRAM 32KBYTE WITH PARITY

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of DMA Channels:

7

No. of I/O Lines:

60

No. of Terminals:

64

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S, SPI(2), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, RTC, TIMER(12), WDT(2)

Analog To Digital Convertors:

19-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G081RBT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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