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STM32G061K8U6

STMicroelectronics

STM32G061K8U6 by STMicroelectronics

STM32G061K8U6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0+ CPU, operates b/w -40 °C to 85 °C, and supports up to 30 external interrupts. With 18 ADC channels and dual DACs, it's ideal for industrial applications requiring low power consumption. Its compact design and versatile connectivity options make it suitable for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,227 parts In-Stock

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8,227

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Digiode

USA . 4,563 parts In-Stock

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4,563

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Anansix

USA . 1,671 parts In-Stock

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1,671

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 540 parts In-Stock

1+ parts

$12.890

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540

$12.890

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IDEA Electronic Components Group

UK . 700 parts In-Stock

1+ parts

$24.880

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$22.392

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700

$24.880

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$22.392

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MKK Technologies

India . 644 parts In-Stock

1+ parts

$46.784

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644

$46.784

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DigiPath Technology Company

USA . 644 parts In-Stock

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$46.784

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644

$46.784

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Corphita

USA . 4,190 parts In-Stock

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4,190

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Parana Technologies

USA . 933 parts In-Stock

1+ parts

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$29.747

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933

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$29.747

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Overview

Unlock limitless possibilities with the STM32G061K8U6 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for efficiency and versatility, this ultra-low-power 32-bit controller empowers applications in IoT, industrial automation, and consumer electronics. With robust features like advanced ADCs and DACs, it ensures superior performance while maintaining reliability. Choose STM32G061K8U6 for unparalleled value and elevate your projects to the next level!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier and more compact PCB layout, making it suitable for modern electronic applications.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-voltage systems.

On Chip Data RAM Width: 8

The 8-bit RAM width allows for efficient handling of a variety of data, optimizing the microcontroller's performance.

Package Shape: SQUARE

The square package shape supports better thermal performance and uniform distribution on the PCB.

Bit Size: 32

Being a 32-bit microcontroller enhances computational efficiency and allows handling of larger data types.

DAC Channels: YES

The inclusion of DAC channels allows for high-quality analog signal generation, making it ideal for applications requiring precise control.

No. of Terminals: 32

With 32 terminals, this microcontroller provides ample I/O connectivity options for diverse applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style allows for efficient thermal dissipation and compact integration into products.

Minimum Supply Voltage: 1.7 V

Operating with a low minimum supply voltage enables use in battery-powered applications, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85 °C ensures reliable performance in high-temperature environments.

CPU Family: Cortex-M0+

The Cortex-M0+ CPU family offers low power consumption and efficient processing, making it ideal for embedded applications.

No. of External Interrupts: 30

Having 30 external interrupts allows for responsive designs, vital for applications requiring real-time system response.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this microcontroller suitable for use in harsh and industrial environments.

ADC Channels: YES

The presence of ADC channels facilitates analog signal processing, making this microcontroller versatile for various sensor applications.

DMA Channels: YES

DMA channels improve data handling efficiency, allowing the microcontroller to perform tasks without CPU intervention.

Terminal Position: QUAD

Quad terminal positions provide flexible mounting options, increasing the adaptability of the microcontroller on the PCB.

ROM Words: 65536

With 65536 ROM words, there's ample space for program storage, supporting complex applications.

Maximum Seated Height: 0.6 mm

A maximum seated height of 0.6 mm contributes to a low-profile design, ideal for compact devices.

Digital To Analog Converters: 2 Ch 12-Bit

Dual 12-Bit DACs enable high-resolution analog outputs, suitable for applications such as audio and control systems.

Width: 5 mm

A compact width of 5 mm is advantageous in space-constrained applications.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PDR, PVD, RTC, TIMER(12), WDT(2)

A rich set of peripherals enhances functionality and integration, reducing the need for additional components.

Maximum Clock Frequency: 48 MHz

A clock frequency of 48 MHz allows for fast processing and responsiveness in applications.

Length: 5 mm

The 5 mm length supports miniaturized designs, making it a suitable fit for modern electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and stability in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides efficient instruction execution and lower power consumption.

No. of Timers: 12

Having 12 timers allows for various time-related functions and tasks, increasing the microcontroller's versatility.

RAM Bytes: 18432

The substantial RAM size of 18432 bytes supports complex applications and data processing.

Technology: CMOS

CMOS technology leads to low power consumption and high noise immunity, suitable for portable devices.

Terminal Form: NO LEAD

No-lead terminals streamline the mounting process and reduce the footprint on the PCB.

Analog To Digital Converters: 18-Ch 12-Bit

18 channels of 12-bit ADCs allow for simultaneous monitoring of multiple analog signals, enhancing the flexibility of sensor designs.

Maximum Supply Current: 7.3 mA

A maximum supply current of 7.3 mA indicates efficient power usage, making it ideal for battery-operated devices.

Nominal Supply Voltage: 3 V

The nominal voltage of 3 V optimizes performance and power efficiency for general use.

No. of DMA Channels: 7

Offering 7 DMA channels enhances data transfer efficiency, freeing the CPU for other processing tasks.

No. of Serial I/Os: 3

Three serial I/O interfaces provide flexible communication options for connecting with various peripheral devices.

PWM Channels: YES

Included PWM channels are essential for applications requiring motor control or signal modulation.

Connectivity: I2C(2), I2S, LPUART, SPI(2), USART(2)

Diverse connectivity options facilitate easy integration into various systems, enhancing communication capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and modifications, enhancing the product's longevity and adaptability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch improves layout density and design flexibility on PCBs.

Format: FIXED POINT

The fixed-point format provides efficient processing for specific applications needing consistent numerical representations.

Speed: 64 rpm

A speed rating of 64 rpm offers suitability for low-speed, power-efficient applications such as sensor readouts.

Low Power Mode: YES

The availability of a low power mode significantly extends battery life in portable applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width optimizes the microcontroller for various programming applications.

No. of I/O Lines: 30

Thirty I/O lines provide extensive control and communication possibilities for diverse applications.

Technical Specifications

Microcontrollers STM32G061K8U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

7

No. of External Interrupts:

30

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

18432

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S, LPUART, SPI(2), USART(2)

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PDR, PVD, RTC, TIMER(12), WDT(2)

Analog To Digital Convertors:

18-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32G061K8U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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