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STM32G061K6U6

STMicroelectronics

STM32G061K6U6 by STMicroelectronics

STM32G061K6U6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0+ CPU, operates b/w -40 °C to 85 °C, and supports up to 48 MHz clock speed. With 18 ADC channels and dual DACs, it's ideal for low-power applications in industrial settings. Its compact design includes 32 terminals and various connectivity options like I2C and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,735 parts In-Stock

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4,735

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Anansix

USA . 1,700 parts In-Stock

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1,700

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Digiode

USA . 1,055 parts In-Stock

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1,055

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 591 parts In-Stock

1+ parts

$8.440

100+ parts

-

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591

$8.440

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Microchip USA

USA . 5,405 parts In-Stock

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$11.763

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5,405

$11.763

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IDEA Electronic Components Group

UK . 1,156 parts In-Stock

1+ parts

$16.152

100+ parts

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$14.536

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1,156

$16.152

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$14.536

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Component Stockers USA

USA . 5,625 parts In-Stock

1+ parts

$24.540

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5,625

$24.540

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MKK Technologies

India . 131 parts In-Stock

1+ parts

$30.372

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131

$30.372

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DigiPath Technology Company

USA . 131 parts In-Stock

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$30.372

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131

$30.372

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Corphita

USA . 1,528 parts In-Stock

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1,528

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Parana Technologies

USA . 961 parts In-Stock

1+ parts

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$19.312

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961

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$19.312

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Overview

Unlock limitless possibilities with the STM32G061K6U6 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for efficiency and versatility, this compact powerhouse is perfect for industrial applications, IoT devices, and more. With its low power consumption and robust performance, it ensures reliable operation even in challenging conditions. Embrace advanced features that drive success, making your projects smarter and more efficient than ever before!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact electronic systems.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a wide range of low-voltage applications.

On Chip Data RAM Width: 8

The 8-bit RAM width facilitates efficient data processing and management, enhancing performance.

Package Shape: SQUARE

The square package shape optimizes board space, making it suitable for compact devices.

Bit Size: 32

A 32-bit architecture allows for more advanced processing capabilities and larger memory addressing.

DAC Channels: YES

Inclusion of digital-to-analog converters (DAC) expands application possibilities, such as audio and signal processing.

No. of Terminals: 32

With 32 terminals, there's ample I/O availability for interfacing with various peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures effective heat dissipation while maintaining a slim profile for space-constrained applications.

Minimum Supply Voltage: 1.7 V

A minimum supply voltage of 1.7V enables operation in low-power applications, promoting energy efficiency.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C makes this microcontroller suitable for various industrial applications.

CPU Family: Cortex-M0+

The Cortex-M0+ family offers enhanced performance and energy efficiency, ideal for low-power applications.

No. of External Interrupts: 30

30 external interrupts provide robust event-driven programming capabilities, essential for responsive designs.

Minimum Operating Temperature: -40 °C

A wide temperature range (-40 °C to 85 °C) allows the microcontroller to work in extreme conditions.

ADC Channels: YES

Built-in Analog-to-Digital Converters (ADC) enhance functionality for sensing and monitoring applications.

DMA Channels: YES

DMA support improves data transfer efficiency, reducing CPU load and increasing overall system performance.

Terminal Position: QUAD

Quad terminal arrangement enhances connectivity options and improves board layout flexibility.

ROM Words: 32768

With 32k ROM words, there's ample storage for complex programs, suitable for a variety of applications.

Maximum Seated Height: 0.6 mm

The low seated height is beneficial for space-limited designs, ensuring a sleek device profile.

Digital To Analog Converters: 2 Ch 12-Bit

Having 2 channels of 12-bit DAC improves the precision of analog outputs, critical for accurate signal generation.

Width: 5 mm

The compact width allows for placement in tight spaces within electronic assemblies.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PDR, PVD, RTC, TIMER(12), WDT(2)

An extensive peripheral set enhances versatility, making it suitable for diverse applications across various fields.

Maximum Clock Frequency: 48 MHz

Operating at a maximum clock frequency of 48 MHz provides fast processing speeds for real-time applications.

Length: 5 mm

Minimal length promotes design flexibility in compact devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in demanding environments, increasing lifespan and performance.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient processing and reduced power consumption, making it a reliable choice.

No. of Timers: 12

12 timers empower the microcontroller to handle multiple timing tasks simultaneously, optimizing system efficiency.

RAM Bytes: 18432

With 18KB of RAM, it supports complex operations and data management.

Technology: CMOS

CMOS technology contributes to low power consumption and high noise immunity, essential for portable applications.

Terminal Form: NO LEAD

No lead terminal form factor improves environmental friendliness and reduces the footprint on PCB.

Analog To Digital Convertors: 18-Ch 12-Bit

The presence of 18 channels of 12-bit ADCs provides extensive analog signal processing capabilities.

Maximum Supply Current: 7.3 mA

Low maximum supply current indicates energy efficiency, beneficial for battery-powered devices.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3V, this microcontroller is well-suited for standard electronics.

No. of DMA Channels: 7

7 DMA channels enable high-speed data transfers, enhancing overall system performance.

No. of Serial I/Os: 3

Having 3 serial I/O lines facilitates easy communication with various external devices.

PWM Channels: YES

Provided PWM channels expand the microcontroller's capabilities in motor control and signal modulation.

Connectivity: I2C(2), I2S, LPUART, SPI(2), USART(2)

Diverse connectivity options ensure robust interfacing capabilities across various protocols, enhancing versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, offering flexibility for product enhancements.

Terminal Pitch: 0.5 mm

A 0.5 mm pitch allows for tight packing of components, benefiting dense circuit designs.

Format: FIXED POINT

The fixed-point format is beneficial for efficient processing in applications requiring real-time calculations.

Speed: 64 rpm

Operating speed of 64 rpm is sufficient for applications requiring moderate output performance.

Low Power Mode: YES

The availability of a low power mode is advantageous for battery-operated devices, boosting longevity.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for simpler instruction processing, enhancing system efficiency.

No. of I/O Lines: 30

30 I/O lines provide significant flexibility for interfacing with various sensors and actuators in diverse applications.

Technical Specifications

Microcontrollers STM32G061K6U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

7

No. of External Interrupts:

30

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

18432

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S, LPUART, SPI(2), USART(2)

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PDR, PVD, RTC, TIMER(12), WDT(2)

Analog To Digital Convertors:

18-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32G061K6U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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