Loading...

STM32G061G8U6TR

STMicroelectronics

STM32G061G8U6TR by STMicroelectronics

STM32G061G8U6TR from STMicroelectronics is a versatile 32-bit microcontroller featuring a max supply voltage of 3.6V, 28 terminals, and dual 12-bit DAC channels. It operates efficiently in industrial applications with a temp range of -40 °C to 85 °C. Ideal for low-power designs, it supports multiple connectivity options like I2C and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,289 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,289

-

-

-

-

Anansix

USA . 2,566 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,566

-

-

-

-

Digiode

USA . 232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

232

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 991 parts In-Stock

1+ parts

$17.250

100+ parts

-

1k+ parts

-

10k+ parts

-

991

$17.250

-

-

-

IDEA Electronic Components Group

UK . 1,550 parts In-Stock

1+ parts

$62.084

100+ parts

-

1k+ parts

$55.876

10k+ parts

-

1,550

$62.084

-

$55.876

-

MKK Technologies

India . 1,816 parts In-Stock

1+ parts

$116.746

100+ parts

-

1k+ parts

-

10k+ parts

-

1,816

$116.746

-

-

-

DigiPath Technology Company

USA . 1,816 parts In-Stock

1+ parts

$116.746

100+ parts

-

1k+ parts

-

10k+ parts

-

1,816

$116.746

-

-

-

Corphita

USA . 2,198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,198

-

-

-

-

Parana Technologies

USA . 788 parts In-Stock

1+ parts

-

100+ parts

$74.231

1k+ parts

-

10k+ parts

-

788

-

$74.231

-

-

Overview

Unlock innovation with the STM32G061G8U6TR microcontroller from STMicroelectronics, a leader in semiconductor solutions. Designed for efficiency and versatility, this compact chip empowers your next project with advanced features perfect for IoT devices, industrial applications, and smart electronics. Experience seamless connectivity, low power consumption, and robust performance in varied environments, ensuring your designs stand out with reliability and precision. Elevate your creations today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient space utilization and is suitable for compact applications.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage makes it compatible with a wide range of battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit RAM width supports efficient data processing for applications requiring moderate data handling.

Package Shape: SQUARE

The square package shape helps simplify PCB layout and improves thermal performance.

Bit Size: 32

The 32-bit architecture offers higher computational power and supports advanced applications.

DAC Channels: YES

With DAC channels available, this microcontroller can handle analog outputs for various applications.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for interfacing with other components.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile makes it suitable for integration into space-constrained designs.

Minimum Supply Voltage: 1.7 V

The minimum voltage requirement enables operation in low-power modes, enhancing battery life.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures increases reliability in industrial environments.

CPU Family: Cortex-M0+

The Cortex-M0+ family is known for its energy efficiency, making it suitable for power-sensitive applications.

No. of External Interrupts: 26

Having 26 external interrupts allows the microcontroller to respond rapidly to various events, improving real-time performance.

Minimum Operating Temperature: -40 °C

Designed for extreme conditions, this microcontroller is perfect for harsh environmental applications.

ADC Channels: YES

With built-in ADC channels, it supports digital readings from analog sensors for diverse applications.

DMA Channels: YES

The presence of DMA channels facilitates high-speed data transfer, reducing CPU workload and enhancing performance.

Terminal Position: QUAD

Quad terminal positioning allows for better signal integrity and easier PCB layout.

ROM Words: 65536

Sufficient ROM words provide adequate space for program storage, supporting complex applications.

Maximum Seated Height: 0.6 mm

A low seated height ensures compatibility with slim designs and systems with height restrictions.

Digital To Analog Converters: 2 Ch 12-Bit

The dual 12-bit DACs enhance analog output precision, suitable for applications demanding high-quality signals.

Width: 4 mm

The compact width allows for integration into small form factor designs.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PDR, PVD, RTC, TIMER(12), WDT(2)

A rich set of peripherals enhances versatility, allowing for enhanced functionality in embedded systems.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz enables efficient processing for real-time applications.

Length: 4 mm

The small length of the package supports compact system designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller offers reliability and stability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

This RISC architecture delivers efficient processing capabilities, making it ideal for embedded applications.

No. of Timers: 12

Having 12 timers supports various timing operations, enhancing control capabilities for real-time applications.

RAM Bytes: 18432

Adequate RAM allows for smooth operation and processing of multiple tasks in embedded systems.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation.

Terminal Form: NO LEAD

No-lead terminals allow for reduced electromagnetic interference, which is crucial in sensitive applications.

Analog To Digital Converters: 17-Ch 12-Bit

The 17-channel 12-bit ADCs enable high-resolution readings from multiple sensors simultaneously.

Maximum Supply Current: 7.3 mA

A low maximum supply current is beneficial for power-sensitive applications, ensuring longer battery life.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V aligns well with common battery voltages, enhancing compatibility.

No. of DMA Channels: 7

The 7 DMA channels provide advanced data handling capabilities, reducing CPU intervention and increasing efficiency.

No. of Serial I/Os: 3

Three serial I/O lines enable flexible communication with various peripherals and devices.

PWM Channels: YES

PWM support is essential for motor control applications, providing the necessary control signals.

Connectivity: I2C(2), I2S, LPUART, SPI(2), USART(2)

Diverse connectivity options improve system integration and data exchange between components.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications, extending the product's lifecycle.

Terminal Pitch: 0.5 mm

The small terminal pitch offers high-density connectivity, vital for modern compact designs.

Format: FIXED POINT

Fixed-point format allows for fast arithmetic operations, beneficial in real-time processing scenarios.

Speed: 64 rpm

A speed of 64 rpm indicates capability in control applications, such as robotics and automation.

Low Power Mode: YES

Low power mode extends battery life and enhances functionality in portable devices.

On Chip Program ROM Width: 8

An 8-bit ROM width supports efficient instruction processing for embedded applications.

No. of I/O Lines: 26

Having 26 I/O lines provides great flexibility for interfacing with multiple components.

Technical Specifications

Microcontrollers STM32G061G8U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

7

No. of External Interrupts:

26

No. of I/O Lines:

26

No. of Serial I/Os:

3

No. of Terminals:

28

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

RAM Bytes:

18432

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S, LPUART, SPI(2), USART(2)

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PDR, PVD, RTC, TIMER(12), WDT(2)

Analog To Digital Convertors:

17-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32G061G8U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20