Loading...

STM32G061F6P6

STMicroelectronics

STM32G061F6P6 by STMicroelectronics

STM32G061F6P6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0+ CPU, operates b/w -40 °C to 85 °C, and supports up to 48 MHz clock speed. With 16 ADC channels and dual DACs, it's ideal for industrial applications requiring low power consumption. Its compact design (4.4x6.5 mm) ensures versatility in embedded systems.

Median Price

$3.350

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 17 parts In-Stock

1+ parts

$2.830

100+ parts

$1.450

1k+ parts

$1.000

10k+ parts

$0.980

17

$2.830

$1.450

$1.000

$0.980

Mouser Electronics

USA . 1,266 parts In-Stock

1+ parts

$3.350

100+ parts

$1.720

1k+ parts

$1.190

10k+ parts

$1.120

1,266

$3.350

$1.720

$1.190

$1.120

Element14

Singapore . 17 parts In-Stock

1+ parts

$4.840

100+ parts

$2.480

1k+ parts

$1.720

10k+ parts

$1.600

17

$4.840

$2.480

$1.720

$1.600

Avnet

USA . 1,036 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,036

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,477 parts In-Stock

1+ parts

$2.318

100+ parts

-

1k+ parts

-

10k+ parts

-

3,477

$2.318

-

-

-

Vyrian

USA . 7,043 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,043

-

-

-

-

Anansix

USA . 332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

332

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,968 parts In-Stock

1+ parts

$2.196

100+ parts

-

1k+ parts

-

10k+ parts

-

4,968

$2.196

-

-

-

Component Stockers USA

USA . 184 parts In-Stock

1+ parts

$3.000

100+ parts

$2.140

1k+ parts

-

10k+ parts

-

184

$3.000

$2.140

-

-

IDEA Electronic Components Group

UK . 1,812 parts In-Stock

1+ parts

$36.034

100+ parts

-

1k+ parts

$32.430

10k+ parts

-

1,812

$36.034

-

$32.430

-

MKK Technologies

India . 1,702 parts In-Stock

1+ parts

$67.759

100+ parts

-

1k+ parts

-

10k+ parts

-

1,702

$67.759

-

-

-

DigiPath Technology Company

USA . 1,702 parts In-Stock

1+ parts

$67.759

100+ parts

-

1k+ parts

-

10k+ parts

-

1,702

$67.759

-

-

-

Parana Technologies

USA . 1,692 parts In-Stock

1+ parts

-

100+ parts

$43.084

1k+ parts

-

10k+ parts

-

1,692

-

$43.084

-

-

Eastek

USA . 1,332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,332

-

-

-

-

Overview

Boost your next project with the STM32G061F6P6 microcontroller from STMicroelectronics, a trusted leader in innovation and quality. This compact powerhouse delivers exceptional performance for low-power applications, making it ideal for IoT devices, industrial automation, and consumer electronics. Experience seamless connectivity, advanced features, and unmatched reliability – everything you need to elevate your designs and accelerate time-to-market while optimizing energy efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage applications, enhancing flexibility in various circuits.

On Chip Data RAM Width: 8

An 8-bit RAM width enables efficient data handling operations, suitable for many applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into various designs and layouts.

Bit Size: 32

32-bit processing allows for more complex calculations and improved performance in applications.

DAC Channels: YES

Inclusion of DAC channels enables precise analog signal generation, expanding applications in audio and control systems.

No. of Terminals: 20

20 terminals provide ample connectivity options for peripherals and other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile and small footprint make it ideal for space-constrained applications.

Minimum Supply Voltage: 1.7 V

Low voltage operation enhances battery efficiency and makes it suitable for portable devices.

Maximum Operating Temperature: 85 °C

High-temperature tolerance ensures reliable operation in industrial and harsh environments.

CPU Family: Cortex-M0+

Cortex-M0+ is designed for low power applications, offering a balance of performance and efficiency.

No. of External Interrupts: 18

The high number of interrupts allows for responsive and real-time processing of events.

Minimum Operating Temperature: -40 °C

Extreme low-temperature operation makes this microcontroller suitable for outdoor and industrial environments.

ADC Channels: YES

Integrated ADC channels allow for direct sensing and data acquisition from analog sources.

DMA Channels: YES

DMA capabilities enhance data transfer efficiency, reducing CPU load and improving performance.

Terminal Position: DUAL

Dual terminal positioning supports flexible layout design, accommodating various PCB configurations.

ROM Words: 32768

A substantial amount of ROM offers significant storage for program code and other data.

Maximum Seated Height: 1.2 mm

Low seated height supports integration into slim designs without compromising performance.

Digital To Analog Convertors: 2 Ch 12-Bit

12-bit resolution in DACs allows for high-quality analog signal outputs for precise applications.

Width: 4.4 mm

Compact width optimizes space usage for portable and space-sensitive designs.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PDR, PVD, RTC, TIMER(12), WDT(2)

A rich set of peripherals supports extensive functionality for diverse applications.

Maximum Clock Frequency: 48 MHz

The 48 MHz clock allows for fast processing speeds suitable for time-critical applications.

Length: 6.5 mm

The compact length enables space-efficient designs in various applications.

Temperature Grade: INDUSTRIAL

Industrial grade ensures robustness and reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing efficiency, making it ideal for resource-constrained environments.

No. of Timers: 12

A wide array of timers supports complex timing and control applications with ease.

RAM Bytes: 18432

Adequate RAM supports complex algorithms and larger data sets for processing applications.

Technology: CMOS

CMOS technology offers low power consumption, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals provide ease of soldering and better mechanical stability on PCBs.

Analog To Digital Convertors: 16-Ch 12-Bit

16-channel ADC with 12-bit resolution supports versatile and high-precision analog input applications.

Maximum Supply Current: 7.3 mA

Low supply current optimizes energy consumption, extending battery life in portable applications.

Nominal Supply Voltage: 3 V

Operational at a standard nominal voltage simplifies power supply design considerations.

No. of DMA Channels: 7

Seven DMA channels enhance data handling efficiency and overall system performance.

No. of Serial I/Os: 3

Multiple serial I/Os provide flexible connectivity for various peripherals.

PWM Channels: YES

Inclusion of PWM channels enables control of motors and other devices requiring variable speed.

Connectivity: I2C(2), I2S, LPUART, SPI(2), USART(2)

Versatile connectivity options enhance integration with various sensors and communication devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware.

Terminal Pitch: 0.65 mm

The 0.65 mm pitch supports high-density designs, making it suitable for advanced applications.

Format: FIXED POINT

Fixed point format facilitates efficient arithmetic operations in control applications.

Speed: 64 rpm

This speed specification can optimize performance in specific control applications, like motor control.

Low Power Mode: YES

Low power mode extends battery life and reduces heat generation in portable devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width optimizes efficiency for simpler programs and applications.

No. of I/O Lines: 18

Eighteen I/O lines provide extensive interaction with various external components and modules.

Technical Specifications

Microcontrollers STM32G061F6P6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Low Power Mode:

YES

No. of DMA Channels:

7

No. of External Interrupts:

18

No. of I/O Lines:

18

No. of Serial I/Os:

3

No. of Terminals:

20

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

RAM Bytes:

18432

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

64 rpm

Maximum Supply Current:

7.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S, LPUART, SPI(2), USART(2)

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PDR, PVD, RTC, TIMER(12), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32G061F6P6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20