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STM32G031K8T6TR

STMicroelectronics

STM32G031K8T6TR by STMicroelectronics

STM32G031K8T6TR from STMicroelectronics is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 48 MHz clock speed, and 16 ADC channels. It operates in extreme temperatures (-40 °C to 85 °C) and is ideal for low-power applications like IoT devices. Its compact design and versatile connectivity options make it suitable for various embedded systems.

Median Price

$3.330

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 667 parts In-Stock

1+ parts

$3.330

100+ parts

$1.760

1k+ parts

$1.260

10k+ parts

-

667

$3.330

$1.760

$1.260

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,679

-

-

-

-

Digiode

USA . 4,453 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,453

-

-

-

-

Anansix

USA . 2,130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,130

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 509 parts In-Stock

1+ parts

$8.810

100+ parts

-

1k+ parts

-

10k+ parts

-

509

$8.810

-

-

-

IDEA Electronic Components Group

UK . 146 parts In-Stock

1+ parts

$70.836

100+ parts

-

1k+ parts

$63.753

10k+ parts

-

146

$70.836

-

$63.753

-

MKK Technologies

India . 2,015 parts In-Stock

1+ parts

$133.203

100+ parts

-

1k+ parts

-

10k+ parts

-

2,015

$133.203

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-

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DigiPath Technology Company

USA . 2,015 parts In-Stock

1+ parts

$133.203

100+ parts

-

1k+ parts

-

10k+ parts

-

2,015

$133.203

-

-

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Corphita

USA . 4,649 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,649

-

-

-

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Parana Technologies

USA . 815 parts In-Stock

1+ parts

-

100+ parts

$84.696

1k+ parts

-

10k+ parts

-

815

-

$84.696

-

-

Overview

Unlock limitless potential with the STM32G031K8T6TR microcontroller from STMicroelectronics—a leader in innovation and reliability. Designed for diverse applications, this compact powerhouse excels in low-power environments while delivering robust performance. Enjoy seamless connectivity options and versatile peripherals that empower your designs, ensuring efficient energy use and enhanced functionality. Elevate your projects with ST’s commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing durable plastic/epoxy materials ensures a robust and lightweight design, enhancing reliability in various applications.

Surface Mount: YES

The surface mount design allows for a compact PCB layout, making it suitable for space-constrained designs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V supports compatibility with a wide range of power supplies while ensuring energy efficiency.

On Chip Data RAM Width: 8

The 8-bit RAM width optimizes data processing for simpler applications, offering effective resource utilization.

Package Shape: SQUARE

The square package shape facilitates easier PCB layout and component placement, improving manufacturability.

Bit Size: 32

The 32-bit architecture provides enhanced computational power and efficiency, making it ideal for complex applications.

No. of Terminals: 32

Having 32 terminals allows for extensive connectivity options and greater flexibility in circuit design.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile flatpack ensures minimal space usage while offering excellent thermal performance and ease of mounting.

Minimum Supply Voltage: 1.7 V

The lower minimum supply voltage aids in energy savings and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

With an operational temperature up to 85 °C, the microcontroller is suitable for a variety of environments, including industrial applications.

CPU Family: CORTEX-M0

The ARM Cortex-M0 core is known for its energy efficiency and performance, making it ideal for low-power applications.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes this microcontroller suitable for extreme conditions, such as automotive and industrial uses.

Terminal Finish: TIN

The tin finish on terminals provides good solderability and prevents oxidation, ensuring long-term reliability.

ADC Channels: YES

Inclusion of ADC channels enables precise analog signal processing, perfect for sensor integration in embedded systems.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory, freeing up the CPU to perform other tasks.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity and improves layout flexibility on PCBs.

ROM Words: 65536

With 65536 ROM words, there's ample programmable memory available for user applications, allowing for complex algorithms.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous for low-profile designs, contributing to overall compactness.

Width: 7 mm

The 7 mm width is ideal for designs requiring smaller footprints while still offering sufficient I/O options.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

A rich set of peripherals enhances functionality and integration capabilities, enabling a wide range of applications.

Maximum Clock Frequency: 48 MHz

The 48 MHz clock frequency allows for fast processing speeds, making it suitable for real-time applications.

Peak Reflow Temperature °C: 260

Resilience to high peak reflow temperatures ensures compatibility with standard soldering processes in manufacturing.

Length: 7 mm

The compact 7 mm length supports space-saving designs without compromising functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, this product achieves higher performance with less processing energy, making it efficient for embedded applications.

No. of Timers: 9

Having 9 timers allows for precise timing operations in applications requiring extensive control mechanisms.

RAM Bytes: 8192

The available 8192 bytes of RAM enable adequate memory allocation for tasks, improving overall performance.

Technology: CMOS

CMOS technology provides low power consumption, making it perfect for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide enhanced mechanical stability and solderability, ensuring a solid electrical connection.

Analog To Digital Convertors: 16-Ch 12-Bit

The 16-channel 12-bit ADC supports high-resolution sensor data capture, vital for precision applications.

Maximum Supply Current: 6.9 mA

A maximum supply current of 6.9 mA enhances power efficiency, extending battery life in portable designs.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V is suitable for low-power applications, optimizing energy consumption.

No. of DMA Channels: 5

Five DMA channels enhance data handling efficiency, allowing simultaneous operations and improving performance.

No. of Serial I/Os: 3

Three serial I/Os provide flexibility in communication options, essential for integrating multiple devices.

PWM Channels: YES

PWM channels support motor control and signal generation, broadening the application areas for this microcontroller.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Diverse connectivity options allow for easy integration with various sensors and modules, enhancing design flexibility.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and modifications to firmware, providing long-term versatility.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is ideal for high-density applications, aiding in compact designs.

Format: FIXED POINT

The fixed-point format ensures efficient mathematical operations, particularly beneficial in digital signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, requiring proper storage conditions but is suitable for automated assembly processes.

Speed: 64 rpm

A speed of 64 rpm is indicative of good performance in applications like motors or timers, ensuring responsive operations.

Low Power Mode: YES

The inclusion of low power modes enhances energy efficiency, making this microcontroller excellent for battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides appropriate storage capacity for program instructions in smaller applications.

No. of I/O Lines: 30

With 30 I/O lines, this microcontroller supports a high degree of interfacing capabilities with external devices.

Technical Specifications

Microcontrollers STM32G031K8T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

5

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Current:

6.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32G031K8T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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