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STM32G031K4U6

STMicroelectronics

STM32G031K4U6 by STMicroelectronics

STM32G031K4U6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 8KB RAM. Ideal for low-power applications, it supports multiple connectivity options like I2C and SPI. Its compact design makes it suitable for space-constrained devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 980 parts In-Stock

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980

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Vyrian

USA . 4,970 parts In-Stock

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4,970

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Digiode

USA . 2,093 parts In-Stock

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2,093

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Anansix

USA . 332 parts In-Stock

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332

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Distributors (Availability)

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Vigor

Singapore . 7,500 parts In-Stock

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$1.200

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7,500

$1.200

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Microchip USA

USA . 7,559 parts In-Stock

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$9.325

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7,559

$9.325

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AZTECH Wire

Italy . 1,204 parts In-Stock

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$16.290

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1,204

$16.290

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IDEA Electronic Components Group

UK . 1,359 parts In-Stock

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$17.696

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$15.927

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1,359

$17.696

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$15.927

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MKK Technologies

India . 915 parts In-Stock

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$33.277

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915

$33.277

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DigiPath Technology Company

USA . 915 parts In-Stock

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$33.277

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915

$33.277

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Corphita

USA . 3,599 parts In-Stock

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3,599

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Eastek

USA . 1,470 parts In-Stock

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$1.670

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1,470

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$1.670

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GreenTree Electronics

Israel . 1,470 parts In-Stock

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1,470

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Parana Technologies

USA . 349 parts In-Stock

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$21.158

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349

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$21.158

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Overview

Elevate your projects with the STM32G031K4U6 microcontroller from STMicroelectronics, renowned for its exceptional quality and reliability. With a compact design and low power consumption, this versatile chip is perfect for applications in IoT, automotive, and industrial automation. Experience unparalleled performance and flexibility, backed by ST's industry-leading expertise, ensuring you bring innovative ideas to life effortlessly and efficiently!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration onto PCBs, saving space and enabling easier assembly.

Maximum Supply Voltage: 3.6 V

This voltage limit ensures compatibility with low-power applications, making it ideal for battery-operated devices.

On Chip Data RAM Width: 8

The 8-bit data width provides flexibility in handling data while maintaining efficient memory usage.

Package Shape: SQUARE

The square package shape allows for greater layout options in design and better thermal management.

Bit Size: 32

A 32-bit architecture enhances processing power and allows for better handling of complex calculations.

No. of Terminals: 32

With 32 terminals, the microcontroller offers multiple connectivity options for various peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This specific packaging style is optimized for heat dissipation and compact form factors.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage ensures operation in energy-sensitive applications, extending battery life.

Maximum Operating Temperature: 85 °C

The high temperature tolerance makes this microcontroller suitable for applications in harsh environments.

CPU Family: CORTEX-M0

The efficient Cortex-M0 core is well-suited for low-power, high-performance applications.

Minimum Operating Temperature: -40 °C

The capability to function in extremely low temperatures expands usability in varied weather conditions.

ADC Channels: YES

Built-in ADC channels enhance the microcontroller’s ability to interface with analog signals.

DMA Channels: YES

DMA support improves data transfer efficiency, freeing up CPU bandwidth for other tasks.

Terminal Position: QUAD

Quad terminal positioning allows for easy integration into circuit boards, promoting better signal integrity.

ROM Words: 16384

The substantial ROM provides ample storage for complex codebases, supporting a variety of applications.

Maximum Seated Height: 0.6 mm

The low profile ensures compatibility with compact designs and applications requiring minimal space.

Width: 5 mm

A narrow width helps developers save space in their designs, facilitating compact product development.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

The available peripherals enhance functionality, greatly expanding possible applications for the microcontroller.

Maximum Clock Frequency: 48 MHz

Operating at 48 MHz supports efficient processing for most embedded applications.

Length: 5 mm

The compact length ensures that this microcontroller can fit in tight spaces, ideal for miniaturized devices.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it is optimized for high performance and energy efficiency, making it a smart choice for resource-constrained applications.

No. of Timers: 9

Having 9 timers allows for versatile timing applications, such as PWM generation and scheduling tasks.

RAM Bytes: 8192

The generous RAM size provides sufficient space for data handling and temporary variable storage.

Technology: CMOS

CMOS technology ensures low power consumption, making the microcontroller ideal for portable devices.

Terminal Form: NO LEAD

No lead terminals improve the product’s environmental compatibility and facilitate automated assembly processes.

Analog To Digital Convertors: 6-Ch 12-Bit

This ADC capability ensures high-resolution data acquisition from various sensors.

Maximum Supply Current: 6.9 mA

Low supply current ensures efficient power usage, extending battery life in portable applications.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V is ideal for low-power designs, helping to reduce overall energy consumption.

No. of DMA Channels: 5

With 5 DMA channels, data transfers can be offloaded from the CPU, improving overall system performance.

No. of Serial I/Os: 3

The presence of multiple serial I/Os facilitates connectivity with various external devices, enhancing versatility.

PWM Channels: YES

The inclusion of PWM channels allows for efficient modulation and control of motors and other applications.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Robust connectivity options ensure integration with various sensors and peripherals, enhancing functionality.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in application development.

Terminal Pitch: 0.5 mm

A small terminal pitch enables high-density layouts, making it suitable for space-constrained designs.

Format: FIXED POINT

Fixed point format offers simplicity and efficiency in applications that do not require floating-point calculations.

Speed: 64 rpm

A speed rating of 64 rpm indicates suitability for low-speed applications, enhancing safety and control.

Low Power Mode: YES

The availability of a low power mode extends battery life during periods of inactivity.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides adequate space for firmware while ensuring efficient memory use.

No. of I/O Lines: 30

With 30 I/O lines available, the microcontroller can interact with numerous external components, enhancing its application range.

Technical Specifications

Microcontrollers STM32G031K4U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

6.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

STM32G031K4U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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