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STM32G031K4U3TR

STMicroelectronics

STM32G031K4U3TR by STMicroelectronics

STM32G031K4U3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 8KB RAM. With low power modes and multiple connectivity options, it's ideal for IoT applications. Its compact design supports efficient thermal management in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,557 parts In-Stock

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3,557

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Anansix

USA . 1,220 parts In-Stock

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1,220

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Digiode

USA . 113 parts In-Stock

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113

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Distributors (Availability)

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Microchip USA

USA . 4,845 parts In-Stock

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$10.723

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4,845

$10.723

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AZTECH Wire

Italy . 53 parts In-Stock

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$12.620

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53

$12.620

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IDEA Electronic Components Group

UK . 1,794 parts In-Stock

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$56.111

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$50.500

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1,794

$56.111

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$50.500

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MKK Technologies

India . 1,930 parts In-Stock

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$105.513

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1,930

$105.513

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DigiPath Technology Company

USA . 1,930 parts In-Stock

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$105.513

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1,930

$105.513

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Corphita

USA . 3,798 parts In-Stock

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Parana Technologies

USA . 306 parts In-Stock

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$67.089

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306

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$67.089

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Overview

Unlock the potential of your next project with the STM32G031K4U3TR microcontroller from STMicroelectronics! Renowned for their innovation and reliability, STMicroelectronics delivers top-tier quality that meets the demands of various applications—from IoT devices to industrial automation. With its low power consumption, robust performance, and versatile connectivity options, this compact powerhouse enhances efficiency while reducing costs. Elevate your designs with ST's trusted technology and experience the difference!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact designs and efficient PCB layouts, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with various low-power applications, enhancing versatility.

On Chip Data RAM Width: 8

An 8-bit data RAM width is efficient for handling small data loads, ideal for many embedded applications.

Package Shape: SQUARE

The square package shape provides a balanced footprint, making it easier to integrate into various designs.

Bit Size: 32

A 32-bit bit size allows for more complex calculations and better performance in demanding applications.

No. of Terminals: 32

With 32 terminals, the microcontroller offers sufficient I/O options for a wide range of projects.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile enhances thermal performance, making it suitable for high-density devices.

Minimum Supply Voltage: 1.7 V

Support for a low minimum supply voltage provides flexibility for battery-operated and low-power systems.

Maximum Operating Temperature: 125 °C

Having a high maximum operating temperature means this microcontroller can function in harsh environments.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family is known for its efficiency and low power consumption, making it ideal for battery-powered devices.

Minimum Operating Temperature: -40 °C

A wide temperature range allows the microcontroller to be used in extreme environments, increasing its application scope.

ADC Channels: YES

Integrated ADC channels enable analog signal processing directly within the microcontroller, simplifying designs.

DMA Channels: YES

DMA channels enhance data transfer efficiency and reduce CPU load, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning provides better electrical performance and heat management compared to other configurations.

ROM Words: 16384

With 16K words of ROM, this microcontroller can handle moderately complex applications without external memory.

Maximum Seated Height: 0.6 mm

A low seated height facilitates integration into compact devices, offering design flexibility.

Width: 5 mm

At a width of 5 mm, the microcontroller fits easily into tight spaces, making it ideal for portable applications.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Rich peripheral support allows developers to implement a wide range of features without additional components.

Maximum Clock Frequency: 48 MHz

A high clock frequency enables faster processing capabilities, improving performance in time-sensitive applications.

Length: 5 mm

With a slim length, the microcontroller is suitable for small form factor designs, increasing versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution, leading to lower power consumption and higher performance.

No. of Timers: 9

Multiple timers support various timing applications, aiding in tasks like event scheduling and PWM generation.

RAM Bytes: 8192

With 8 KB of RAM, the microcontroller can effectively handle temporary data storage for increasingly complex projects.

Technology: CMOS

Utilizing CMOS technology results in low power consumption and high noise immunity, enhancing reliability.

Terminal Form: NO LEAD

No-lead terminals provide superior thermal performance and are more compatible with modern assembly techniques.

Analog To Digital Converters: 6-Ch 12-Bit

Multiple 12-bit ADC channels enable high-resolution data acquisition, making it perfect for sensor applications.

Maximum Supply Current: 7.6 mA

A low maximum supply current facilitates usage in battery-powered applications, maximizing battery life.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V is optimal for low-power applications, enhancing energy efficiency.

No. of DMA Channels: 5

Having 5 DMA channels provides great data handling capability, which is essential for performance-critical applications.

No. of Serial I/Os: 3

Three serial I/O channels enable integration with multiple communication protocols, increasing versatility.

PWM Channels: YES

Support for PWM channels allows effective motor control and signal modulation, enhancing the applications of this microcontroller.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Diverse connectivity options increase compatibility with various peripherals, making it a flexible choice for developers.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming, supporting dynamic development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch facilitates greater packing density on PCBs, useful for modern compact design.

Format: FIXED POINT

The fixed-point format allows for efficient arithmetic operations, aiding in performance-critical applications.

Speed: 64 rpm

Speed of 64 rpm indicates the capability to handle moderate real-time computations, relevant in many embedded tasks.

Low Power Mode: YES

Support for low power modes enhances battery efficiency, making the microcontroller ideal for portable and IoT applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows effective instruction execution, optimizing performance in various applications.

No. of I/O Lines: 30

With 30 I/O lines, the microcontroller offers abundant interface options, ensuring scalability for applications.

Technical Specifications

Microcontrollers STM32G031K4U3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

STM32G031K4U3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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