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STM32G031K4U3

STMicroelectronics

STM32G031K4U3 by STMicroelectronics

STM32G031K4U3 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 6 ADC channels. With low power modes and extensive connectivity options, it's ideal for IoT applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,693 parts In-Stock

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6,693

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Digiode

USA . 4,944 parts In-Stock

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4,944

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Anansix

USA . 2,672 parts In-Stock

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2,672

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 5,711 parts In-Stock

1+ parts

$10.723

100+ parts

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5,711

$10.723

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AZTECH Wire

Italy . 428 parts In-Stock

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$17.490

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428

$17.490

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IDEA Electronic Components Group

UK . 1,037 parts In-Stock

1+ parts

$20.177

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$18.159

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1,037

$20.177

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$18.159

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Component Stockers USA

USA . 4,067 parts In-Stock

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$25.620

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4,067

$25.620

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MKK Technologies

India . 1,007 parts In-Stock

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$37.941

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1,007

$37.941

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DigiPath Technology Company

USA . 1,007 parts In-Stock

1+ parts

$37.941

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1,007

$37.941

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Parana Technologies

USA . 1,455 parts In-Stock

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$24.124

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1,455

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$24.124

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Corphita

USA . 809 parts In-Stock

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809

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Overview

Unlock limitless possibilities with the STM32G031K4U3 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for efficiency and versatility, this high-quality chip excels in various applications—from IoT devices to industrial automation—while ensuring reliable performance in extreme conditions. Benefit from ST's renowned expertise, low power consumption, and robust connectivity options, empowering your projects with unmatched value and efficiency.

Feature Benefit Bullets

Surface Mount: YES

This surface mount capability allows for easier integration into compact designs, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V makes it compatible with a variety of power supply systems, enhancing flexibility in design.

On Chip Data RAM Width: 8

An 8-bit data width is suitable for various applications and allows for efficient data handling within the microcontroller.

Package Shape: SQUARE

The square package shape is conducive to uniform heat distribution and enhances the ease of PCB layout.

Bit Size: 32

The 32-bit architecture provides higher processing power and the ability to handle complex computations more effectively than lower bit sizes.

No. of Terminals: 32

A higher number of terminals means more connectivity and functionality, allowing for versatile application designs.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile allows for compact designs, and the heat sink capability aids in thermal management.

Minimum Supply Voltage: 1.7 V

A minimum supply voltage of 1.7V ensures operation in low power applications, making it energy efficient.

Maximum Operating Temperature: 125 °C

Operating up to 125 °C allows this microcontroller to function reliably in high-temperature environments, enhancing operational range.

CPU Family: CORTEX-M0

The CORTEX-M0 CPU family is optimized for low power consumption, making it suitable for battery-operated devices.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is suitable for extreme conditions, increasing design possibilities.

ADC Channels: YES

Integrated ADC channels enhance the microcontroller's ability to interface with analog sensors, expanding application use cases.

DMA Channels: YES

The inclusion of DMA channels allows for efficient data transfer, improving overall system performance.

Terminal Position: QUAD

Quad terminal positions facilitate easier PCB layout and improve manufacturing efficiency.

ROM Words: 16384

With 16384 ROM words, ample memory is available for program storage, enabling complex functionalities.

Maximum Seated Height: 0.6 mm

The low seated height helps save board space and allows for thinner designs.

Width: 5 mm

A compact width of 5mm fits into space-restricted designs easily, promoting space-efficient layouts.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Diverse built-in peripherals enhance functionality, allowing for a wide array of applications without additional components.

Maximum Clock Frequency: 48 MHz

The 48 MHz clock frequency ensures sufficient processing speed for most embedded applications.

Length: 5 mm

The 5 mm length enables compact designs, boosting compatibility with tight layouts on PCBs.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it is designed for efficient operation and quick instruction execution, improving application performance.

No. of Timers: 9

Having 9 timers allows for versatile timing operations, which is beneficial in various time-sensitive applications.

RAM Bytes: 8192

With 8192 bytes of RAM, sufficient memory is available for temporary data storage, enabling more complex applications.

Technology: CMOS

CMOS technology offers low power consumption, aiding in the microcontroller's application in energy-sensitive designs.

Terminal Form: NO LEAD

No lead terminals allow for efficient soldering processes and reduce potential mechanical stress on solder joints.

Analog To Digital Converters: 6-Ch 12-Bit

The inclusion of 6 channels of 12-bit ADC supports high precision in converting analog signals, ideal for sensor applications.

Maximum Supply Current: 7.6 mA

With a maximum supply current of 7.6 mA, the microcontroller is optimized for low-power applications, prolonging battery life.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8V allows for efficient power management in devices, enhancing battery life for portable applications.

No. of DMA Channels: 5

Having 5 DMA channels allows for advanced data handling capabilities, facilitating complex data workflows without CPU intervention.

No. of Serial I/Os: 3

Three serial I/O options provide flexibility in communication protocols, which can accommodate various device interactions.

PWM Channels: YES

The availability of PWM channels makes it suitable for motor control and other applications requiring precise signal modulation.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Multiple connectivity options enable versatile communication with peripherals, expanding the microcontroller’s application range.

ROM Programmability: FLASH

FLASH programmability facilitates easy updates and reprogramming, enhancing the microcontroller's adaptability to changing needs.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows high-density PCB designs, making it suitable for compact electronic devices.

Format: FIXED POINT

Fixed-point format simplifies arithmetic processes and is beneficial for resource-constrained applications.

Speed: 64 rpm

Operating at 64 rpm enables the microcontroller to perform tasks at an efficient speed for many embedded applications.

Low Power Mode: YES

The low power mode feature ensures energy efficiency, which is essential for battery-operated or energy-sensitive applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width makes it compatible with various applications while maintaining efficiency in processing.

No. of I/O Lines: 30

Thirty I/O lines provide extensive input and output options for interfacing with other components, making it versatile for multiple applications.

Technical Specifications

Microcontrollers STM32G031K4U3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

STM32G031K4U3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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