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STM32G031K4T3TR

STMicroelectronics

STM32G031K4T3TR by STMicroelectronics

STM32G031K4T3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. With low power modes and multiple connectivity options, it's ideal for IoT applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,314 parts In-Stock

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9,314

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Digiode

USA . 2,173 parts In-Stock

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2,173

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Anansix

USA . 1,429 parts In-Stock

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1,429

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Distributors (Availability)

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AZTECH Wire

Italy . 64 parts In-Stock

1+ parts

$8.190

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-

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64

$8.190

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Microchip USA

USA . 5,160 parts In-Stock

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$11.045

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5,160

$11.045

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IDEA Electronic Components Group

UK . 2,118 parts In-Stock

1+ parts

$20.607

100+ parts

-

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$18.546

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2,118

$20.607

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$18.546

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MKK Technologies

India . 1,562 parts In-Stock

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$38.750

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1,562

$38.750

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DigiPath Technology Company

USA . 1,562 parts In-Stock

1+ parts

$38.750

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1,562

$38.750

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Corphita

USA . 3,337 parts In-Stock

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3,337

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Parana Technologies

USA . 132 parts In-Stock

1+ parts

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$24.639

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132

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$24.639

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Overview

Unlock innovation with the STM32G031K4T3TR microcontroller by STMicroelectronics, a leader in semiconductor solutions. This versatile 32-bit MCU is designed for low-power applications without sacrificing performance. Ideal for IoT devices, consumer electronics, and industrial automation, it delivers efficiency and reliability. Experience seamless connectivity options and robust features that empower your designs, driving value and accelerating time-to-market for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs, making it easier to integrate into modern electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of voltage sources in low-power applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width supports efficient data handling for simple and effective processing of information.

Package Shape: SQUARE

The square shape facilitates uniform layout and efficient use of PCB space, essential for compact designs.

Bit Size: 32

A 32-bit architecture enables handling of larger data types and improved performance in complex calculations.

No. of Terminals: 32

A higher number of terminals enhances connectivity options, allowing it to interface with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style contributes to a slim design, making it ideal for applications with space constraints.

Minimum Supply Voltage: 1.7 V

Operating down to 1.7 V is advantageous for battery-powered applications, optimizing power consumption.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in high-heat environments, broadening application possibilities.

CPU Family: CORTEX-M0

The ARM Cortex-M0 family delivers high efficiency and performance for low-power embedded applications.

Minimum Operating Temperature: -40 °C

A wide temperature range (-40 °C to 125 °C) makes this microcontroller suitable for various industrial and outdoor applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to process analog signals, expanding its application potential.

DMA Channels: YES

Direct Memory Access channels improve data transfer rates and efficiency, reducing CPU workload during data operations.

Terminal Position: QUAD

Quad terminal configuration allows for easy and flexible mounting on PCBs and enhances connectivity.

ROM Words: 16384

With 16384 ROM words available, there is ample space for program storage, enabling complex applications.

Maximum Seated Height: 1.6 mm

The low seated height maintains a compact form factor, allowing for a seamless fit in space-constrained designs.

Width: 7 mm

A compact width of 7 mm permits efficient use of PCB space and supports high-density packaging.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Rich peripheral integration enhances functionality and versatility, making it suitable for diverse applications.

Maximum Clock Frequency: 48 MHz

A clock frequency of 48 MHz provides sufficient processing power for real-time applications and tasks.

Length: 7 mm

The compact length helps in designing smaller devices, enhancing portability and convenience.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture benefits performance and power efficiency, ideal for low-power microcontroller applications.

No. of Timers: 9

Multiple timers facilitate complex time-based operations, enhancing the control of devices in various applications.

RAM Bytes: 8192

With 8192 bytes of RAM, it supports sufficient temporary data storage for efficient program execution.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, suited for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form provides reliable soldering options and is a standard in surface-mount technology.

Analog To Digital Converters: 16-Ch 12-Bit

The 16-channel 12-bit ADC allows for precise analog signal processing, which is critical for sensor applications.

Maximum Supply Current: 7.6 mA

A low maximum supply current is beneficial for power-sensitive applications, extending battery life.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V means efficient power usage, ideal for low-energy devices.

No. of DMA Channels: 5

Having 5 DMA channels ensures effective data handling without CPU intervention, improving overall system performance.

No. of Serial I/Os: 3

Three serial I/O options provide flexible communication capabilities with external devices.

PWM Channels: YES

Support for PWM channels enables motor control and signal modulation, expanding application scenarios.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Multiple connectivity options allow seamless integration with a variety of peripherals and communication standards.

ROM Programmability: FLASH

Flash programmability facilitates easy updates and modifications to the firmware, ensuring long-term usability and flexibility.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is optimal for high-density designs, maintaining a balance between size and usability.

Format: FIXED POINT

Fixed-point format processing ensures efficient computation where necessary, especially in resource-constrained environments.

Speed: 64 rpm

The speed rating of 64 rpm indicates the microcontroller's capability to handle moderate-speed applications effectively.

Low Power Mode: YES

The availability of a low power mode is essential for extending battery life in portable applications, enhancing energy efficiency.

On Chip Program ROM Width: 8

An 8-bit program ROM width is suitable for efficient instruction fetching in embedded applications.

No. of I/O Lines: 30

With 30 I/O lines, this microcontroller offers flexible interfacing capabilities for various sensors and devices.

Technical Specifications

Microcontrollers STM32G031K4T3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32G031K4T3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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