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STM32G031J4M3

STMicroelectronics

STM32G031J4M3 by STMicroelectronics

STM32G031J4M3 by STMicroelectronics is a 32-bit microcontroller with Cortex-M0 CPU, 48 MHz clock frequency, and 8192 bytes of RAM. It features 6-Ch 12-Bit ADC channels, 5 DMA channels, and low power mode. Ideal for applications requiring high-speed processing and low power consumption in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Martec Srl

Italy . 150,000 parts In-Stock

1+ parts

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150,000

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J2 Sourcing AB

Sweden . 7,000 parts In-Stock

1+ parts

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7,000

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Vyrian

USA . 6,292 parts In-Stock

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6,292

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Digiode

USA . 4,373 parts In-Stock

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4,373

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Anansix

USA . 849 parts In-Stock

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849

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Semicontronic

India . 1,034 parts In-Stock

1+ parts

$10.000

100+ parts

$9.750

1k+ parts

$9.700

10k+ parts

-

1,034

$10.000

$9.750

$9.700

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AZTECH Wire

Italy . 669 parts In-Stock

1+ parts

$16.113

100+ parts

-

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669

$16.113

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Ampacity Inc.

Singapore . 1,373 parts In-Stock

1+ parts

$26.000

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1,373

$26.000

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IDEA Electronic Components Group

UK . 310 parts In-Stock

1+ parts

$43.660

100+ parts

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$39.294

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310

$43.660

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$39.294

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$64.626

100+ parts

$61.395

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$61.395

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750

$64.626

$61.395

$61.395

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Corohmni

South Africa . 157 parts In-Stock

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$76.132

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157

$76.132

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Aztec Data Supply Inc.

USA . 1,148 parts In-Stock

1+ parts

$79.750

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1,148

$79.750

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MKK Technologies

India . 138 parts In-Stock

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$82.101

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138

$82.101

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DigiPath Technology Company

USA . 138 parts In-Stock

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$82.101

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138

$82.101

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Continental Prestige Electronics

USA . 5,792 parts In-Stock

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5,792

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Argo Parts USA

USA . 2,520 parts In-Stock

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2,520

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Parana Technologies

USA . 1,096 parts In-Stock

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$52.203

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1,096

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$52.203

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Corphita

USA . 450 parts In-Stock

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450

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Discover the STM32G031J4M3 microcontroller by STMicroelectronics, a reliable and versatile solution for a wide range of applications. With a maximum clock frequency of 48 MHz and low power mode, this microcontroller offers high performance while conserving energy. Whether you're designing IoT devices, consumer electronics, or industrial automation systems, the STM32G031J4M3 provides the value, benefits, and advantages you need to bring your projects to life. Trust in the quality and expertise of STMicroelectronics to deliver top-notch components for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options, making the product versatile.

Bit Size: 32

The 32-bit architecture provides high performance and processing capability.

ROM Words: 16384

Large ROM capacity allows for storing complex programs and data.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture improves efficiency and speed of operations in the microcontroller.

Maximum Clock Frequency: 48 MHz

High clock frequency enables fast processing and response times.

ADC Channels: YES

Built-in analog to digital converters enable accurate conversion of analog signals.

DMA Channels: YES

Direct Memory Access channels reduce the workload on the CPU, improving efficiency.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Multiple communication interfaces provide versatility in connecting to external devices.

Low Power Mode: YES

Ability to operate in low power mode conserves energy and extends battery life.

Technical Specifications

Microcontrollers STM32G031J4M3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

6

No. of Serial I/Os:

3

No. of Terminals:

8

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Speed:

64 rpm

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

STM32G031J4M3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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