Loading...

STM32G031G8U3TR

STMicroelectronics

STM32G031G8U3TR by STMicroelectronics

STM32G031G8U3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 15 ADC channels. Ideal for low-power applications, it supports various connectivity options like I2C and SPI. With a compact design and high performance, it's perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,000

-

-

-

-

Vyrian

USA . 9,906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,906

-

-

-

-

Digiode

USA . 4,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,104

-

-

-

-

Anansix

USA . 2,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,592

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,010 parts In-Stock

1+ parts

$10.300

100+ parts

-

1k+ parts

-

10k+ parts

-

1,010

$10.300

-

-

-

Microchip USA

USA . 4,161 parts In-Stock

1+ parts

$11.752

100+ parts

-

1k+ parts

-

10k+ parts

-

4,161

$11.752

-

-

-

IDEA Electronic Components Group

UK . 1,821 parts In-Stock

1+ parts

$41.818

100+ parts

-

1k+ parts

$37.636

10k+ parts

-

1,821

$41.818

-

$37.636

-

MKK Technologies

India . 1,690 parts In-Stock

1+ parts

$78.635

100+ parts

-

1k+ parts

-

10k+ parts

-

1,690

$78.635

-

-

-

DigiPath Technology Company

USA . 1,690 parts In-Stock

1+ parts

$78.635

100+ parts

-

1k+ parts

-

10k+ parts

-

1,690

$78.635

-

-

-

Parana Technologies

USA . 866 parts In-Stock

1+ parts

-

100+ parts

$49.999

1k+ parts

-

10k+ parts

-

866

-

$49.999

-

-

Corphita

USA . 837 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

837

-

-

-

-

Overview

Unlock the potential of your next project with the STM32G031G8U3TR microcontroller from STMicroelectronics—a leader in innovation and reliability. This compact powerhouse combines low power consumption with high performance, making it ideal for a wide range of applications, from IoT devices to industrial automation. With its robust features and advanced connectivity options, you can innovate faster, reduce costs, and elevate your designs with unmatched quality and support. Experience the difference that precision engineering brings!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact design and improved integration in modern electronic devices.

Maximum Supply Voltage: 3.6 V

Supports a broad range of applications with flexibility in power supply options while ensuring efficient operation.

On Chip Data RAM Width: 8

This width facilitates efficient data processing and manipulation, optimizing performance for various applications.

Package Shape: SQUARE

The square package shape aids in space optimization on printed circuit boards, making it suitable for small devices.

Bit Size: 32

A 32-bit architecture allows for advanced computing capabilities and suitable performance for complex applications.

No. of Terminals: 28

Provides sufficient connection points for various peripherals while maintaining a compact footprint.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile ensures minimal space usage and facilitates integration into ultra-compact designs.

Minimum Supply Voltage: 1.7 V

This low voltage operation helps in energy-efficient designs and applications where battery life is a concern.

Maximum Operating Temperature: 125 °C

High temperature tolerance allows it to function in demanding environments, increasing versatility and reliability.

CPU Family: CORTEX-M0

The Cortex-M0 core offers excellent performance coupled with low power consumption, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

A wide temperature range makes this microcontroller suitable for outdoor and industrial applications.

ADC Channels: YES

Inclusion of ADC channels allows for direct interfacing with analog sensors, enhancing its functionality.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal positioning aids in stable mounting and connectivity, benefiting overall circuit integrity.

ROM Words: 65536

This amount of ROM provides ample space for program storage, accommodating a range of application needs.

Maximum Seated Height: 0.6 mm

The low seated height enables the use in ultra-slim designs, appealing to modern aesthetic requirements.

Width: 4 mm

Compact width supports designs where space is a premium, without sacrificing performance.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Rich peripheral set enhances capability for a wide variety of applications, providing essential features for many designs.

Maximum Clock Frequency: 48 MHz

A 48 MHz clock frequency ensures fast processing speeds, making it suitable for time-critical applications.

Length: 4 mm

Short length contributes to a compact design, allowing for integration into smaller devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being RISC-based gives the product an efficient instruction set, allowing for improved performance and reduced power usage.

No. of Timers: 9

Nine timers provide robust timing functionalities, essential for applications requiring precise timing control.

RAM Bytes: 8192

An ample amount of RAM enables more complex and larger applications to run smoothly without performance degradation.

Technology: CMOS

CMOS technology results in low power consumption and high noise immunity, enhancing the microcontroller's efficiency.

Terminal Form: NO LEAD

No lead terminals enhance design compatibility while reducing the risk of lead-related issues.

Analog To Digital Converters: 15-Ch 12-Bit

Fifteen 12-bit ADCs provide high-resolution data acquisition, ideal for applications requiring precision.

Maximum Supply Current: 7.6 mA

Low supply current makes it suitable for battery-operated devices, maximizing energy efficiency.

Nominal Supply Voltage: 1.8 V

1.8 V nominal supply facilitates power-efficient designs in low-power electronics.

No. of DMA Channels: 5

Five DMA channels enhance data handling capabilities, improving throughput and efficiency in data-centric applications.

No. of Serial I/Os: 3

Multiple serial I/Os allow for versatile communication options with various peripherals, enhancing overall functionality.

PWM Channels: YES

PWM capabilities facilitate control over motors and other devices, expanding application possibilities.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Diverse connectivity options enable easy integration with multiple devices, enhancing user application flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of the firmware, ensuring long-term usability and flexibility.

Terminal Pitch: 0.5 mm

0.5 mm terminal pitch supports high-density designs, crucial for modern compact electronic applications.

Format: FIXED POINT

Fixed point format offers efficient numerical processing capabilities, suitable for many embedded applications.

Speed: 64 rpm

Operating at 64 rpm indicates capability for low speed applications where precision is necessary.

Low Power Mode: YES

The inclusion of a low power mode ensures energy-saving operation, extending battery life in portable applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient program management, enhancing performance for varied applications.

No. of I/O Lines: 26

Twenty-six I/O lines enable extensive interfacing options, making it versatile for different applications.

Technical Specifications

Microcontrollers STM32G031G8U3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

26

No. of Serial I/Os:

3

No. of Terminals:

28

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

15-Ch 12-Bit

Trade Compliance

STM32G031G8U3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20