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STM32G031G6U3TR

STMicroelectronics

STM32G031G6U3TR by STMicroelectronics

STM32G031G6U3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 125 °C, and supports up to 48 MHz clock speed. With 8 KB RAM and 15 ADC channels, it's ideal for low-power applications in IoT devices. Its compact design (4x4 mm) ensures efficient space utilization in embedded systems.

Median Price

$1.270

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Martec Srl

Italy . 200,000 parts In-Stock

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200,000

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Vyrian

USA . 8,310 parts In-Stock

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8,310

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TME

Poland . 2,999 parts In-Stock

1+ parts

-

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$1.270

2,999

-

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$1.270

Anansix

USA . 2,739 parts In-Stock

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2,739

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Digiode

USA . 327 parts In-Stock

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327

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 4,232 parts In-Stock

1+ parts

$11.087

100+ parts

-

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4,232

$11.087

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AZTECH Wire

Italy . 1,169 parts In-Stock

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$13.850

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1,169

$13.850

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IDEA Electronic Components Group

UK . 1,359 parts In-Stock

1+ parts

$68.822

100+ parts

-

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$61.940

10k+ parts

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1,359

$68.822

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$61.940

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MKK Technologies

India . 477 parts In-Stock

1+ parts

$129.416

100+ parts

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477

$129.416

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DigiPath Technology Company

USA . 477 parts In-Stock

1+ parts

$129.416

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477

$129.416

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Corphita

USA . 778 parts In-Stock

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778

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Parana Technologies

USA . 609 parts In-Stock

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$82.288

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609

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$82.288

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Overview

Unlock the potential of your next project with the STM32G031G6U3TR microcontroller from STMicroelectronics! Renowned for its reliability and innovation, STMicroelectronics delivers exceptional performance in a compact design, perfect for diverse applications like IoT devices, industrial automation, and consumer electronics. Enjoy unmatched energy efficiency, advanced features, and seamless connectivity, ensuring your products stand out in a competitive market while optimizing development costs. Elevate your designs with quality that leads to success!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact PCB layouts, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The flexible voltage tolerance enables use in various battery-operated and energy-efficient applications.

On Chip Data RAM Width: 8

An 8-bit data bus allows efficient handling of data in embedded systems.

Package Shape: SQUARE

Square package shape aids in uniform thermal management and layout simplicity.

Bit Size: 32

The 32-bit architecture supports more extensive processing capabilities compared to 8-bit or 16-bit MCUs.

No. of Terminals: 28

28 terminals provide ample connectivity options for interfacing with various peripherals.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

A very thin profile is ideal for slim designs in modern electronics, enhancing portability.

Minimum Supply Voltage: 1.7 V

Low voltage operation extends battery life and enables usage in low-power applications.

Maximum Operating Temperature: 125 °C

High-temperature tolerance allows for reliable operation in harsh environments.

CPU Family: CORTEX-M0

Utilizing the efficient ARM Cortex-M0 core ensures high performance while maintaining low power consumption.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold makes it suitable for outdoor and industrial applications.

ADC Channels: YES

Integrated ADC channels simplify the design process for applications requiring analog-to-digital conversion.

DMA Channels: YES

Direct Memory Access channels facilitate efficient data handling, reducing CPU workload.

Terminal Position: QUAD

Quad terminal position enhances soldering reliability and ensures stable connections.

ROM Words: 32768

A substantial ROM capacity allows for complex embedded applications and firmware storage.

Maximum Seated Height: 0.6 mm

The low seated height ensures compatibility with modern, ultra-dense circuit designs.

Width: 4 mm

Compact width aids in miniaturizing electronic circuitry without sacrificing performance.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

A variety of built-in peripherals enhance functionality and reduce external component requirements.

Maximum Clock Frequency: 48 MHz

A 48 MHz speed allows for responsive performance in real-time applications.

Length: 4 mm

Short length helps maintain minimal PCB real estate usage, fitting into small devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture means efficient instruction execution, making it a suitable choice for speed-critical applications.

No. of Timers: 9

Multiple timers provide versatile timing solutions for various tasks, from simple delays to complex scheduling.

RAM Bytes: 8192

Ample RAM supports more extensive applications, enabling richer functionality and quicker data processing.

Technology: CMOS

The CMOS technology ensures low power consumption, making it ideal for battery-powered devices.

Terminal Form: NO LEAD

No lead terminals minimize environmental impact and allow for flexible soldering methods.

Analog To Digital Converters: 15-Ch 12-Bit

High-resolution ADCs provide accurate data conversion, essential for precise measurements.

Maximum Supply Current: 7.6 mA

Low supply current supports energy-efficient designs, prolonging the battery life of portable devices.

Nominal Supply Voltage: 1.8 V

The nominal voltage aligns with many common battery technologies, making integration straightforward.

No. of DMA Channels: 5

Five DMA channels allow for efficient data transfers without taxing the CPU, enhancing performance.

No. of Serial I/Os: 3

Versatile serial interfaces enable easy connectivity with a variety of other devices and peripherals.

PWM Channels: YES

Pulse Width Modulation support is ideal for motor control and other applications requiring precise signal modulation.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Diverse connectivity options provide flexibility in communication with various devices and sensors.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and reconfigurations, enhancing product longevity.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density designs, accommodating advanced applications.

Format: FIXED POINT

Fixed-point format is efficient for arithmetic operations in embedded applications, reducing computational complexity.

Speed: 64 rpm

Speed ensures modern applications that require real-time processing can be effectively handled.

Low Power Mode: YES

Low power mode extends battery life and supports energy-conscious designs during inactivity.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides efficient instruction handling within the MCU.

No. of I/O Lines: 26

26 I/O lines offer extensive interfacing options, ensuring high design flexibility for various applications.

Technical Specifications

Microcontrollers STM32G031G6U3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

26

No. of Serial I/Os:

3

No. of Terminals:

28

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

15-Ch 12-Bit

Trade Compliance

STM32G031G6U3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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