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STM32G031G6U3

STMicroelectronics

STM32G031G6U3 by STMicroelectronics

STM32G031G6U3 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 15 ADC channels. With low power modes and extensive connectivity options, it's ideal for IoT applications. Its compact design suits space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,961 parts In-Stock

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12,961

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Digiode

USA . 4,770 parts In-Stock

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4,770

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Anansix

USA . 2,301 parts In-Stock

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2,301

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 5,734 parts In-Stock

1+ parts

$11.087

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5,734

$11.087

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Component Stockers USA

USA . 2,528 parts In-Stock

1+ parts

$18.410

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2,528

$18.410

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AZTECH Wire

Italy . 90 parts In-Stock

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$20.940

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90

$20.940

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IDEA Electronic Components Group

UK . 2,176 parts In-Stock

1+ parts

$48.983

100+ parts

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$44.084

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2,176

$48.983

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$44.084

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MKK Technologies

India . 258 parts In-Stock

1+ parts

$92.109

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258

$92.109

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DigiPath Technology Company

USA . 258 parts In-Stock

1+ parts

$92.109

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258

$92.109

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Corphita

USA . 2,656 parts In-Stock

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2,656

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Parana Technologies

USA . 1,721 parts In-Stock

1+ parts

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$58.566

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1,721

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$58.566

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Overview

Unlock the power of innovation with the STM32G031G6U3 microcontroller from STMicroelectronics, a leader in semiconductor solutions. Designed for efficiency and versatility, this cutting-edge MCU excels in applications ranging from IoT devices to industrial automation. With low power consumption, robust performance, and a compact form factor, it empowers developers to create smarter, connected products that enhance user experiences and drive success. Elevate your projects with a trusted partner in technology!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration on PCBs, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage ensures compatibility with a wide range of power sources while maintaining efficiency.

On Chip Data RAM Width: 8

An 8-bit RAM width enhances data handling capabilities for applications requiring moderate data processing.

Package Shape: SQUARE

The square package shape facilitates efficient layout design and assembly, making it suitable for various PCB designs.

Bit Size: 32

The 32-bit architecture provides strong processing power for complex applications and improves performance over 8-bit or 16-bit alternatives.

No. of Terminals: 28

With 28 terminals, this microcontroller allows for multiple I/O options, enhancing connectivity and flexibility in design.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Its thin profile is perfect for applications that require low-profile designs and space efficiency.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage allows for battery-operated applications, improving energy efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes it reliable for use in harsh environments.

CPU Family: CORTEX-M0

Based on the energy-efficient Cortex-M0 architecture, this microcontroller offers low power consumption while delivering solid performance.

Minimum Operating Temperature: -40 °C

It can operate in extreme cold conditions, making it suitable for outdoor and industrial applications.

ADC Channels: YES

Having ADC channels allows for the direct conversion of analog signals, perfect for sensor applications.

DMA Channels: YES

With DMA channels, data transfer is more efficient, freeing up CPU time for other tasks.

Terminal Position: QUAD

The quad terminal position aids in robust soldering connections and improves signal integrity.

ROM Words: 32768

A ROM size of 32KB provides ample storage for embedded applications and firmware.

Maximum Seated Height: 0.6 mm

The low seated height is beneficial for low-profile designs, enhancing overall product compactness.

Width: 4 mm

A width of 4 mm is ideal for high-density circuit board layouts.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

The rich set of peripherals enhances functionality, allowing for precise timing, data management, and system reliability.

Maximum Clock Frequency: 48 MHz

A clock frequency of 48 MHz allows for speedy processing of instructions, making it suitable for real-time applications.

Length: 4 mm

A compact length of 4 mm complements the small form factor and aids in optimizing space on a PCB.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes the execution of instructions, contributing to low power consumption and high performance.

No. of Timers: 9

Having 9 timers allows for versatile timing applications and multitasking capabilities.

RAM Bytes: 8192

8KB of RAM supports more complex applications and tasks, allowing for better performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller efficient and reliable.

Terminal Form: NO LEAD

The no-lead form factor enhances thermal performance and reduces the footprint on the PCB.

Analog To Digital Converters: 15-Ch 12-Bit

15 channels of 12-bit ADC allows for high-resolution measurements from multiple analog inputs, ideal for sensor applications.

Maximum Supply Current: 7.6 mA

The low supply current contributes to energy-efficient designs, especially for battery-powered applications.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V ensures low power operation and is ideal for low-power applications.

No. of DMA Channels: 5

Five DMA channels facilitate efficient data transfers, allowing for more effective use of processing resources.

No. of Serial I/Os: 3

Supports multiple serial communication interfaces, enhancing connectivity with other devices.

PWM Channels: YES

The availability of PWM channels enables efficient motor control and signal modulation.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Diverse connectivity options support various communication protocols, allowing for flexible integration into diverse systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware without the need for physical changes.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch supports high-density designs, allowing for more components to fit in limited spaces.

Format: FIXED POINT

Fixed-point format is beneficial for embedded and digital signal processing applications where precision is needed.

Speed: 64 rpm

Performance at 64 rpm provides adequate speed for a range of applications, enhancing overall efficiency.

Low Power Mode: YES

Low power modes enhance battery life for portable devices and reduce energy costs in sustainability-focused applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width helps efficiently accommodate embedded code for optimized execution.

No. of I/O Lines: 26

With 26 I/O lines, this microcontroller can handle multiple external devices while providing flexibility in design.

Technical Specifications

Microcontrollers STM32G031G6U3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

26

No. of Serial I/Os:

3

No. of Terminals:

28

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

15-Ch 12-Bit

Trade Compliance

STM32G031G6U3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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