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STM32F778AIY6TR

STMicroelectronics

STM32F778AIY6TR by STMicroelectronics

STM32F778AIY6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 180 terminals, and 16 external interrupts. It features 24 ADC channels, 262144 RAM words, and operates at a max clock frequency of 26 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,123 parts In-Stock

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4,123

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Vyrian

USA . 3,063 parts In-Stock

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3,063

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Anansix

USA . 542 parts In-Stock

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542

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,471 parts In-Stock

1+ parts

$11.000

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-

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1,471

$11.000

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Vigor

Singapore . 3,613 parts In-Stock

1+ parts

$11.690

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3,613

$11.690

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AZTECH Wire

Italy . 410 parts In-Stock

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$12.405

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410

$12.405

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Semicontronic

India . 1,281 parts In-Stock

1+ parts

$18.000

100+ parts

$17.550

1k+ parts

$17.460

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1,281

$18.000

$17.550

$17.460

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Corohmni

South Africa . 64 parts In-Stock

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$22.083

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64

$22.083

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Microchip USA

USA . 7,122 parts In-Stock

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$39.223

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7,122

$39.223

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IDEA Electronic Components Group

UK . 1,749 parts In-Stock

1+ parts

$67.276

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$60.548

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1,749

$67.276

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$60.548

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Aztec Data Supply Inc.

USA . 4,035 parts In-Stock

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$77.840

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4,035

$77.840

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MKK Technologies

India . 445 parts In-Stock

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$126.508

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445

$126.508

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DigiPath Technology Company

USA . 445 parts In-Stock

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$126.508

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445

$126.508

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Continental Prestige Electronics

USA . 5,596 parts In-Stock

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Argo Parts USA

USA . 2,341 parts In-Stock

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Parana Technologies

USA . 1,828 parts In-Stock

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$80.439

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$80.439

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Corphita

USA . 1,731 parts In-Stock

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1,731

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unleash the power of innovation with the STM32F778AIY6TR microcontroller by STMicroelectronics. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. Dive into a world of endless possibilities with integrated cache, advanced peripherals, and low power modes that ensure optimal efficiency. Elevate your projects to new heights with the STM32F778AIY6TR and experience the ultimate blend of quality, value, and innovation that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Integrated Cache: YES

The integrated cache helps in improving the performance of the microcontroller by reducing access time to frequently used data and instructions.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in powering the microcontroller and enables it to work with various power sources.

Address Bus Width: 24

A wider address bus width allows the microcontroller to access a larger memory space, enabling it to handle more data and instructions efficiently.

Bit Size: 32

With a 32-bit architecture, the microcontroller can process data in larger chunks, leading to faster and more efficient operation.

DAC Channels: YES

The presence of DAC channels allows the microcontroller to generate analog signals, which can be beneficial in various applications such as audio processing and sensor interfacing.

No. of Terminals: 180

The abundant number of terminals provides flexibility in connecting external components, peripherals, and interfacing with other devices.

No. of External Interrupts: 16

Having multiple external interrupts enables the microcontroller to respond quickly to external events, making it suitable for real-time applications.

ADC Channels: YES

The availability of ADC channels allows the microcontroller to convert analog signals from sensors or other external sources into digital data for processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Being based on the RISC architecture, the microcontroller offers high performance, low power consumption, and efficient instruction execution, making it a reliable choice for various applications.

Technical Specifications

Microcontrollers STM32F778AIY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B180

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

129

No. of Terminals:

180

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA180,13X14,16

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

RAM Words:

262144

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

216 rpm

Maximum Supply Current:

281 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Minimum Time:

SECONDS

Width:

5.5 mm

Peripheral IC Type:

Connectivity:

CAN(3), I2C(4), I2S(3), SAI(2), SDMMC(2), SPDIFRX(4), SPI(6), UART(4), USART(4), USB(2)

Peripherals:

BOR, CRC, DMA(16), LCD, PDR, POR, PVD, PWM(4), RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F778AIY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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