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STM32F765IGK6TR

STMicroelectronics

STM32F765IGK6TR by STMicroelectronics

STM32F765IGK6TR by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 3.6V and a clock frequency of 26MHz. It features 24-channel 12-bit ADCs, 2-channel 12-bit DACs, and various connectivity options such as CAN, Ethernet, I2C, SPI, UART, USART, and USB. This microcontroller is commonly used in industrial applications requiring high-performance processing and communication capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,468 parts In-Stock

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8,468

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Digiode

USA . 4,542 parts In-Stock

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4,542

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Anansix

USA . 1,483 parts In-Stock

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1,483

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 756 parts In-Stock

1+ parts

$11.000

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756

$11.000

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AZTECH Wire

Italy . 314 parts In-Stock

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$18.686

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314

$18.686

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IDEA Electronic Components Group

UK . 2,269 parts In-Stock

1+ parts

$22.744

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$20.470

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2,269

$22.744

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$20.470

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Aztec Data Supply Inc.

USA . 4,143 parts In-Stock

1+ parts

$25.350

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4,143

$25.350

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Semicontronic

India . 1,527 parts In-Stock

1+ parts

$30.000

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$29.250

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$29.100

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1,527

$30.000

$29.250

$29.100

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$30.890

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$29.345

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$29.345

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1,000

$30.890

$29.345

$29.345

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Microchip USA

USA . 4,285 parts In-Stock

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$39.244

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4,285

$39.244

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MKK Technologies

India . 1,633 parts In-Stock

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$42.769

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1,633

$42.769

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DigiPath Technology Company

USA . 1,633 parts In-Stock

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$42.769

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1,633

$42.769

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Corohmni

South Africa . 389 parts In-Stock

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$70.083

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389

$70.083

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QUARKTWIN TECHNOLOGY LTD

USA . 18,414 parts In-Stock

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Vigor

Singapore . 6,000 parts In-Stock

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Argo Parts USA

USA . 4,102 parts In-Stock

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Continental Prestige Electronics

USA . 3,224 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,796 parts In-Stock

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2,796

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Parana Technologies

USA . 260 parts In-Stock

1+ parts

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$27.194

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260

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$27.194

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Discover the power and precision of the STM32F765IGK6TR microcontroller by STMicroelectronics. With its high-quality manufacturing and reputation for excellence, STMicroelectronics delivers a product that meets the highest industry standards. This versatile microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. Whether you're looking to enhance your IoT devices, develop cutting-edge robotics, or create innovative industrial control systems, the STM32F765IGK6TR is the ideal choice. Don't miss out on the advantages this microcontroller brings to your projects - unlock its potential today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This microcontroller's plastic/epoxy package body material ensures durability and resistance to environmental conditions, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount capability of this microcontroller simplifies its integration into circuit boards, enhancing ease of assembly and reducing overall system complexity.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs effectively, offering flexibility in different power supply configurations.

Address Bus Width: 26

The 26-bit address bus width allows the microcontroller to access a larger memory space, facilitating the execution of complex programs and enabling the device to handle extensive data storage requirements.

Package Shape: SQUARE

Featuring a square package shape, this microcontroller optimizes space utilization on circuit boards, enabling compact and efficient system designs.

Bit Size: 32

The microcontroller's 32-bit architecture provides enhanced processing capabilities, allowing for faster execution of instructions and more efficient data handling.

DAC Channels: YES

With built-in DAC channels, this microcontroller enables analog output capabilities, making it suitable for applications requiring precise analog voltage generation.

No. of Terminals: 176

With a generous number of terminals, this microcontroller offers versatile connectivity options and can interface with multiple external devices, expanding its compatibility with various peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style, combined with a very thin profile and fine pitch, enables high-density mounting of the microcontroller, making it ideal for space-constrained designs without compromising performance.

Minimum Supply Voltage: 1.7 V

Supporting a low minimum supply voltage, this microcontroller is suitable for applications where power efficiency and battery operation are essential, ensuring optimal energy consumption.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, enhancing its reliability and suitability for industrial-grade applications.

Minimum Operating Temperature: -40 °C

Designed to operate reliably in extreme cold temperatures, this microcontroller's minimum operating temperature of -40°C expands its usability in various environments.

ADC Channels: YES

Featuring integrated ADC channels, this microcontroller enables accurate analog-to-digital conversion, making it suitable for applications requiring precise measurements from external sensors.

DMA Channels: YES

Including DMA channels, this microcontroller provides efficient data transfer capabilities, reducing the burden on the CPU and enabling high-speed, low-latency data handling.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB routing and allows for convenient integration of this microcontroller into circuit boards, optimizing signal flow and reducing interference.

ROM Words: 1048576

With a large ROM capacity of 1,048,576 words, this microcontroller can store extensive program code and data, making it suitable for complex applications with demanding storage requirements.

Maximum Seated Height: 0.6 mm

With an ultra-thin maximum seated height of 0.6 mm, this microcontroller enables compact and low-profile system designs, minimizing overall device thickness.

Digital To Analog Convertors: 2-Ch 12-Bit

Equipped with two 12-bit digital-to-analog converters (DACs), this microcontroller provides precise analog voltage generation capabilities, facilitating accurate control and output for analog devices.

Width: 10 mm

With a compact width of 10 mm, this microcontroller offers space-efficient placement on circuit boards, allowing for compact system designs.

External Data Bus Width: 32

Featuring a wide 32-bit external data bus width, this microcontroller allows for efficient data transfer between the microcontroller and external devices, enhancing overall system performance.

Peripherals: BOR, DMA(2), POR, PVD, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(15), WDT(2)

This microcontroller comes with various peripherals, including a Brown Out Reset (BOR), multiple DMA channels, Power-On Reset (POR), Power Voltage Detector (PVD), four PWM channels, a Real-Time Clock (RTC), a temperature sensor, fifteen timers, and two Watchdog Timers (WDT). These peripherals enhance the capability and versatility of the microcontroller in handling diverse application requirements.

Maximum Clock Frequency: 26 MHz

With a maximum clock frequency of 26 MHz, this microcontroller offers high-speed processing capabilities, enabling efficient execution of instructions and rapid data handling.

Length: 10 mm

With a compact length of 10 mm, this microcontroller facilitates space-saving designs and efficient utilization of circuit board real estate.

Temperature Grade: INDUSTRIAL

Designed to meet industrial-grade temperature requirements, this microcontroller ensures reliable operation in harsh temperature environments, making it suitable for demanding industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a microcontroller based on the Reduced Instruction Set Computing (RISC) architecture, this device provides efficient instruction execution, enabling faster overall system performance and power-efficient operation.

RAM Bytes: 524288

With a generous RAM capacity of 524,288 bytes, this microcontroller allows for efficient data storage and manipulation, supporting complex algorithms and data-intensive applications.

Technology: CMOS

Utilizing Complementary Metal-Oxide-Semiconductor (CMOS) technology, this microcontroller offers low power consumption, ensuring energy efficiency and longer battery life in portable applications.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and enhances the mechanical connection between the microcontroller and the PCB, ensuring reliable contact and secure mounting.

Analog To Digital Convertors: 24-Ch 12-Bit

Equipped with twenty-four 12-bit analog-to-digital converters (ADCs), this microcontroller allows for accurate conversion and sampling of analog signals, making it suitable for applications involving multiple sensors or analog inputs.

Nominal Supply Voltage: 1.8 V

Featuring a low nominal supply voltage of 1.8 V, this microcontroller is optimized for power efficiency and low-voltage applications, ensuring reduced energy consumption and extended battery life.

PWM Channels: YES

With support for Pulse Width Modulation (PWM) channels, this microcontroller allows accurate control of digital signals, making it ideal for applications demanding precise motor control, dimming, or audio generation.

Connectivity: CAN(3), ETHERNET, I2C(4), I2S(3), IRDA, LIN, SAI(2), SDMMC(2), SPI(6), UART(4), USART(4), USB(2)

This microcontroller provides a wide range of connectivity options, including three CAN interfaces, Ethernet support, four I2C ports, three I2S interfaces, IRDA compatibility, LIN interface, two Serial Audio Interfaces (SAI), two SDMMC interfaces, six SPI channels, four UART ports, four USART channels, and two USB ports. This extensive connectivity allows for seamless integration with various communication interfaces and devices.

ROM Programmability: FLASH

This microcontroller employs Flash memory technology for program storage, facilitating easy and reliable programming of the device, enabling firmware updates, and delivering flexibility for future enhancements or modifications.

Terminal Pitch: 0.65 mm

With a narrow terminal pitch of 0.65 mm, this microcontroller allows for high-density PCB layouts, enabling compact system designs and maximizing interconnect density.

Speed: 216 rpm

With a speed rating of 216 revolutions per minute (rpm), this microcontroller is suitable for applications involving motor control or speed regulation, ensuring precise control and accurate performance.

On Chip Program ROM Width: 8

Featuring an on-chip program ROM width of 8 bits, this microcontroller provides a reliable and efficient storage solution for program code, supporting seamless execution of instructions and rapid data access.

No. of I/O Lines: 140

Equipped with 140 input/output (I/O) lines, this microcontroller offers extensive connectivity options and enables versatile interfacing with external devices, expanding system compatibility and flexibility.

Technical Specifications

Microcontrollers STM32F765IGK6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B176

Length:

10 mm

No. of I/O Lines:

140

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

524288

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

216 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), ETHERNET, I2C(4), I2S(3), IRDA, LIN, SAI(2), SDMMC(2), SPI(6), UART(4), USART(4), USB(2)

Peripherals:

BOR, DMA(2), POR, PVD, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(15), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F765IGK6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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