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STM32F723ICT6

STMicroelectronics

STM32F723ICT6 by STMicroelectronics

STM32F723ICT6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, 138 I/O lines, and 26 MHz clock frequency. It features ADC and DMA channels, suitable for applications requiring high-speed data processing and precise analog-to-digital conversion. Ideal for compact designs due to its low-profile square package shape.

Median Price

$10.398

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$10.398

100+ parts

-

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650

$10.398

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Vyrian

USA . 8,478 parts In-Stock

1+ parts

-

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8,478

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Digiode

USA . 2,603 parts In-Stock

1+ parts

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2,603

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Anansix

USA . 908 parts In-Stock

1+ parts

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908

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Distributors (Availability)

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AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$8.694

100+ parts

-

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-

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559

$8.694

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Continental Prestige Electronics

USA . 3,640 parts In-Stock

1+ parts

$10.398

100+ parts

-

1k+ parts

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10k+ parts

$10.190

3,640

$10.398

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-

$10.190

Netroflash

USA . 500 parts In-Stock

1+ parts

$10.398

100+ parts

-

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500

$10.398

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$10.606

100+ parts

$10.606

1k+ parts

$10.606

10k+ parts

-

450

$10.606

$10.606

$10.606

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IDEA Electronic Components Group

UK . 1,483 parts In-Stock

1+ parts

$24.675

100+ parts

-

1k+ parts

$22.208

10k+ parts

-

1,483

$24.675

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$22.208

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Ampacity Inc.

Singapore . 393 parts In-Stock

1+ parts

$28.000

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393

$28.000

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Semicontronic

India . 175 parts In-Stock

1+ parts

$31.000

100+ parts

$30.225

1k+ parts

$30.070

10k+ parts

-

175

$31.000

$30.225

$30.070

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Microchip USA

USA . 1,743 parts In-Stock

1+ parts

$31.417

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1,743

$31.417

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MKK Technologies

India . 1,778 parts In-Stock

1+ parts

$46.400

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1,778

$46.400

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DigiPath Technology Company

USA . 1,778 parts In-Stock

1+ parts

$46.400

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1,778

$46.400

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Aztec Data Supply Inc.

USA . 88 parts In-Stock

1+ parts

$57.470

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88

$57.470

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Corohmni

South Africa . 423 parts In-Stock

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$73.468

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423

$73.468

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Corphita

USA . 4,997 parts In-Stock

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4,997

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Argo Parts USA

USA . 2,623 parts In-Stock

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2,623

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Vigor

Singapore . 1,990 parts In-Stock

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1,990

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Parana Technologies

USA . 1,341 parts In-Stock

1+ parts

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100+ parts

$29.503

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1,341

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$29.503

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Overview

Unlock endless possibilities with the STM32F723ICT6 microcontroller by STMicroelectronics. This high-quality product offers unparalleled advantages, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this microcontroller provides value, benefits, and advantages that cater to the diverse needs of customers. Experience seamless performance and innovation like never before with the STM32F723ICT6.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Address Bus Width: 26

Wide address bus width allows for efficient memory addressing and data processing capabilities.

Package Shape: SQUARE

Square package shape simplifies PCB layout and ensures better thermal management.

Bit Size: 32

32-bit architecture enables high-performance computing and data processing tasks.

No. of Terminals: 176

Abundance of terminals allows for versatile connectivity options and integration with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact form factor and precise connection points for efficient circuit design.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage enables operation in low-power environments and supports energy-efficient applications.

ADC Channels: YES

Analog-to-digital converter channels enable precise measurement and processing of analog signals.

DMA Channels: YES

Direct memory access channels enhance data transfer speeds and efficiency by allowing peripherals to access memory directly.

Terminal Position: QUAD

Quad terminal position provides a secure and stable connection interface for reliable operation.

Width: 24 mm

Compact width dimension facilitates integration into space-constrained designs.

External Data Bus Width: 32

Wide external data bus width ensures efficient data transfer between the microcontroller and external components.

Maximum Clock Frequency: 26 MHz

High clock frequency supports fast data processing and execution of instructions.

Length: 24 mm

Similar to width, compact length dimension aids in fitting the microcontroller into small form factor devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances computational efficiency and speed of the microcontroller for quick response times.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable soldering connections for robust circuit integration.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the microcontroller.

PWM Channels: YES

Pulse width modulation channels enable precise control of analog signals for applications such as motor control and dimming.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and connections, ideal for space-constrained designs.

Speed: 216 rpm

High speed capability supports rapid data processing, computation, and response times in applications requiring quick performance.

No. of I/O Lines: 138

Abundance of input/output lines provides flexibility for interfacing with various peripherals and external devices for enhanced functionality.

Technical Specifications

Microcontrollers STM32F723ICT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

24 mm

No. of I/O Lines:

138

No. of Terminals:

176

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

216 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

STM32F723ICT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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