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STM32F479AGH6

STMicroelectronics

STM32F479AGH6 by STMicroelectronics

STM32F479AGH6 microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max clock frequency of 26 MHz, and supports ADC & PWM channels. With a compact 7x7 mm grid array package, it's ideal for embedded applications requiring efficient processing and control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,202 parts In-Stock

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7,202

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Digiode

USA . 3,947 parts In-Stock

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3,947

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Anansix

USA . 2,175 parts In-Stock

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2,175

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Distributors (Availability)

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AZTECH Wire

Italy . 597 parts In-Stock

1+ parts

$18.780

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597

$18.780

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Microchip USA

USA . 3,998 parts In-Stock

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$37.488

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3,998

$37.488

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IDEA Electronic Components Group

UK . 921 parts In-Stock

1+ parts

$49.346

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$44.411

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921

$49.346

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$44.411

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MKK Technologies

India . 863 parts In-Stock

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$92.792

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863

$92.792

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DigiPath Technology Company

USA . 863 parts In-Stock

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$92.792

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863

$92.792

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,496 parts In-Stock

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4,496

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Vigor

Singapore . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,981 parts In-Stock

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$59.001

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1,981

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$59.001

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Overview

Elevate your projects with the STM32F479AGH6 microcontroller from STMicroelectronics, a leader in innovation and quality. This powerful 32-bit device features superior performance with advanced peripherals, making it ideal for a wide range of applications, from industrial automation to consumer electronics. Enjoy lower power consumption, enhanced reliability, and seamless integration into your designs, unlocking endless possibilities for creativity and efficiency.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of PCB real estate, making it easy to integrate into compact applications.

Maximum Supply Voltage: 3.6 V

This voltage range enables compatibility with various power supply systems used in modern electronic devices.

Package Shape: SQUARE

The square package shape facilitates even heat distribution and makes it easier to place on PCBs.

Bit Size: 32

A 32-bit architecture enhances processing power and allows for more complex operations and higher precision in computations.

No. of Terminals: 169

With 169 terminals, this microcontroller supports numerous peripherals and I/O connections, enabling complex and feature-rich designs.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch design make it ideal for space-constrained applications without compromising performance.

Minimum Supply Voltage: 1.7 V

This low minimum supply voltage allows the microcontroller to operate in battery-powered applications, enhancing energy efficiency.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to directly interact with analog signals, making it suitable for sensor-based applications.

DMA Channels: YES

The availability of DMA channels improves data transfer efficiency, allowing the CPU to focus on processing while peripheral data is handled automatically.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier placement on PCBs and better electrical connections, reducing the risk of signal interference.

Width: 7 mm

A compact width makes this microcontroller suitable for slim devices and embedded applications, where space is at a premium.

Maximum Clock Frequency: 26 MHz

A maximum clock frequency of 26 MHz ensures responsive performance for a variety of tasks, supporting real-time operations.

Length: 7 mm

A length of 7 mm contributes to its compact design, making it versatile for various applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller implies a simplified instruction set which can lead to faster execution rates and lower power consumption.

Terminal Form: BALL

Ball terminal form offers a reliable and robust connection to the PCB, enhancing mechanical stability.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V allows seamless integration with common digital circuits and devices widely used in electronics.

PWM Channels: YES

The inclusion of PWM channels makes it ideal for motor control and drive applications, allowing for precise control of output signals.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm aids in high-density PCB designs, providing more functionality in less space.

Speed: 180 rpm

This specification indicates a capability to manage tasks efficiently, especially in control applications, enhancing overall performance.

No. of I/O Lines: 114

Having 114 I/O lines allows for ample connectivity with various peripherals and components, making it ideal for complex applications.

Technical Specifications

Microcontrollers STM32F479AGH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

114

No. of Terminals:

169

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F479AGH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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