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STM32F469NGH6

STMicroelectronics

STM32F469NGH6 by STMicroelectronics

STM32F469NGH6 by STMicroelectronics is a 32-bit microcontroller with 216 terminals, 24-bit address bus, and 32-bit external data bus. It operates at a max clock frequency of 26 MHz and has PWM and ADC channels. Ideal for applications requiring high-speed processing and precise control in compact designs.

Median Price

$8.720

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 28,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.720

10k+ parts

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28,800

-

-

$8.720

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EBV Elektronik

Germany . 640 parts In-Stock

1+ parts

-

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-

1k+ parts

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640

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$17.610

100+ parts

-

1k+ parts

-

10k+ parts

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50

$17.610

-

-

-

IBS Electronics

USA . 27,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.925

10k+ parts

-

27,840

-

-

$10.925

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Chip Stock

USA . 6,300 parts In-Stock

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6,300

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Vyrian

USA . 6,161 parts In-Stock

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6,161

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-

-

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Anansix

USA . 1,719 parts In-Stock

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1,719

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-

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Digiode

USA . 1,654 parts In-Stock

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1,654

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 14,574 parts In-Stock

1+ parts

$6.790

100+ parts

-

1k+ parts

-

10k+ parts

-

14,574

$6.790

-

-

-

Semicontronic

India . 14,496 parts In-Stock

1+ parts

$6.790

100+ parts

$6.620

1k+ parts

$6.586

10k+ parts

-

14,496

$6.790

$6.620

$6.586

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AZTECH Wire

Italy . 54 parts In-Stock

1+ parts

$13.620

100+ parts

-

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54

$13.620

-

-

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Aztec Data Supply Inc.

USA . 23,023 parts In-Stock

1+ parts

$14.820

100+ parts

-

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23,023

$14.820

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Corohmni

South Africa . 201 parts In-Stock

1+ parts

$17.562

100+ parts

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201

$17.562

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Continental Prestige Electronics

USA . 3,659 parts In-Stock

1+ parts

$17.610

100+ parts

-

1k+ parts

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$17.258

3,659

$17.610

-

-

$17.258

Netroflash

USA . 100 parts In-Stock

1+ parts

$17.610

100+ parts

-

1k+ parts

$16.730

10k+ parts

$16.377

100

$17.610

-

$16.730

$16.377

Advanced Electronics

New Zealand . 58 parts In-Stock

1+ parts

$18.089

100+ parts

$17.184

1k+ parts

$17.184

10k+ parts

-

58

$18.089

$17.184

$17.184

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Microchip USA

USA . 2,049 parts In-Stock

1+ parts

$39.762

100+ parts

-

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2,049

$39.762

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-

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IDEA Electronic Components Group

UK . 1,627 parts In-Stock

1+ parts

$70.320

100+ parts

-

1k+ parts

$63.288

10k+ parts

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1,627

$70.320

-

$63.288

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MKK Technologies

India . 2,129 parts In-Stock

1+ parts

$132.233

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2,129

$132.233

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DigiPath Technology Company

USA . 2,129 parts In-Stock

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$132.233

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2,129

$132.233

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Argo Parts USA

USA . 4,388 parts In-Stock

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4,388

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Lixinc

USA . 2,897 parts In-Stock

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2,897

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Corphita

USA . 2,832 parts In-Stock

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2,832

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Futuretech Components

Singapore . 2,600 parts In-Stock

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2,600

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Vigor

Singapore . 2,329 parts In-Stock

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2,329

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Parana Technologies

USA . 1,795 parts In-Stock

1+ parts

-

100+ parts

$84.078

1k+ parts

-

10k+ parts

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1,795

-

$84.078

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Overview

Discover the cutting-edge STM32F469NGH6 microcontroller by STMicroelectronics, a game-changer in the industry. With its top-notch quality and advanced technology, this product is perfect for a wide range of applications. From IoT devices to industrial automation, this versatile microcontroller offers unmatched value, benefits, and advantages to customers. Trust in STMicroelectronics' reputation for excellence and innovation, and experience the power and performance of the STM32F469NGH6 for yourself.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 3.6 V

Can accept a wide range of supply voltages, providing flexibility in design and compatibility with various power sources.

Address Bus Width: 24

Wide address bus width allows for accessing a large memory space, enabling complex and data-intensive applications.

Package Shape: SQUARE

Square package shape ensures efficient use of PCB space, making it suitable for compact designs.

Bit Size: 32

32-bit architecture enables high-speed processing and handling of large datasets, enhancing overall performance.

No. of Terminals: 216

High number of terminals provide ample connectivity options for interfacing with external components and peripherals.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

Advanced package style with thin profile and fine pitch enhances signal integrity and reliability, crucial for high-performance applications.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage allows for efficient power management and extends battery life in portable devices.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making it suitable for sensor interfacing and data acquisition applications.

DMA Channels: YES

DMA channels facilitate direct data transfer between peripherals and memory, reducing CPU overhead and improving overall system efficiency.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, optimizing space utilization and enhancing overall design aesthetics.

Width: 13 mm

Compact width allows for easy integration into space-constrained designs, ideal for portable and embedded applications.

External Data Bus Width: 32

Wide external data bus width enables high-speed data transfer between the microcontroller and external memory or peripherals, enhancing system performance.

Maximum Clock Frequency: 26 MHz

High maximum clock frequency facilitates rapid data processing and execution of instructions, ensuring real-time responsiveness in critical applications.

Length: 13 mm

Short length enables compact PCB layout and reduces signal propagation delays, critical for high-speed applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Advanced RISC architecture offers enhanced performance, power efficiency, and scalability, making it a versatile choice for a wide range of applications.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and minimizes signal losses, ensuring robust and stable operation in diverse operating conditions.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and reliable operation across varied operating conditions.

PWM Channels: YES

Integrated PWM channels enable precise control of motor speeds, LED brightness, and other analog functions, adding flexibility to design.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting and compact PCB design, suitable for miniaturized electronic devices.

Speed: 180 rpm

Fast speed capabilities enable quick response times and efficient data processing, enhancing overall system performance and usability.

No. of I/O Lines: 161

Abundant I/O lines provide flexibility for interfacing with external devices, sensors, and peripherals, enabling versatile functionality and connectivity.

Technical Specifications

Microcontrollers STM32F469NGH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

13 mm

No. of I/O Lines:

161

No. of Terminals:

216

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

13 mm

Peripheral IC Type:

Trade Compliance

STM32F469NGH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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