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STM32F469NEH6

STMicroelectronics

STM32F469NEH6 by STMicroelectronics

STM32F469NEH6 by STMicroelectronics is a 32-bit microcontroller with 216 terminals, 24-bit address bus, and 32 external data bus width. It operates at a max clock frequency of 26 MHz and has PWM and ADC channels for versatile applications in robotics, automation, and IoT devices. With a compact square package style and low supply voltage requirements, it's ideal for space-constrained designs requiring high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 5,327 parts In-Stock

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5,327

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Vyrian

USA . 5,202 parts In-Stock

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5,202

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Anansix

USA . 1,490 parts In-Stock

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1,490

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Digiode

USA . 752 parts In-Stock

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752

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 302 parts In-Stock

1+ parts

$14.672

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-

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302

$14.672

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AZTECH Wire

Italy . 230 parts In-Stock

1+ parts

$19.257

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-

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230

$19.257

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Ampacity Inc.

Singapore . 816 parts In-Stock

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$27.000

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816

$27.000

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Semicontronic

India . 1,485 parts In-Stock

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$29.000

100+ parts

$28.275

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$28.130

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1,485

$29.000

$28.275

$28.130

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Microchip USA

USA . 2,734 parts In-Stock

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$35.214

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2,734

$35.214

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Aztec Data Supply Inc.

USA . 3,007 parts In-Stock

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$57.090

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$57.090

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IDEA Electronic Components Group

UK . 2,203 parts In-Stock

1+ parts

$65.636

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$59.072

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2,203

$65.636

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$59.072

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MKK Technologies

India . 1,408 parts In-Stock

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$123.423

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$123.423

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DigiPath Technology Company

USA . 1,408 parts In-Stock

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$123.423

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$123.423

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Continental Prestige Electronics

USA . 6,290 parts In-Stock

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6,290

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Authorized Procurement Solutions

USA . 2,873 parts In-Stock

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2,873

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Parana Technologies

USA . 2,231 parts In-Stock

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$78.477

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2,231

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$78.477

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Vigor

Singapore . 1,703 parts In-Stock

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1,703

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Corphita

USA . 1,545 parts In-Stock

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1,545

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Argo Parts USA

USA . 1,296 parts In-Stock

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Bastille Electronics

Australia . 74 parts In-Stock

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74

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Overview

Unleash the power of innovation with the STM32F469NEH6 microcontroller by STMicroelectronics. Designed with precision and reliability in mind, this cutting-edge device offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, the STM32F469NEH6 delivers seamless integration and advanced functionality. Experience the value of superior quality and efficiency with STMicroelectronics, a trusted leader in microcontroller technology. Elevate your projects and unlock endless possibilities with the STM32F469NEH6.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and compact integration of the microcontroller onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in power requirements for different applications.

Address Bus Width: 24

Wide address bus width allows for accessing a large memory space, enabling the microcontroller to handle complex programs and data.

Package Shape: SQUARE

Square package shape facilitates efficient PCB layout and placement of the microcontroller, improving overall design aesthetics and space utilization.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities, enabling faster execution of instructions and better performance for demanding tasks.

No. of Terminals: 216

Generous number of terminals allow for versatile connectivity options, accommodating various external components and peripherals for comprehensive functionality.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array packaging with thin profile and fine pitch enhances signal integrity and thermal performance, promoting stable operation and efficient heat dissipation.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage enables operation in power-constrained environments, increasing compatibility with battery-powered applications.

ADC Channels: YES

Integrated ADC channels facilitate analog signal conversion, enabling the microcontroller to process real-world inputs such as sensor data with high accuracy.

DMA Channels: YES

Support for DMA channels enhances data transfer efficiency and offloads CPU burden, allowing for seamless handling of data-intensive tasks and peripherals.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB routing and interconnection with other components, optimizing signal flow and minimizing interference for reliable operation.

Width: 13 mm

Compact width dimensions enable space-saving integration in compact designs, making the microcontroller suitable for applications with size constraints.

External Data Bus Width: 32

Wide external data bus width supports fast data transfer rates between the microcontroller and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 26 MHz

High maximum clock frequency allows for rapid execution of instructions, enabling the microcontroller to handle complex computations and time-critical tasks efficiently.

Length: 13 mm

Short length dimensions further contribute to the compact footprint of the microcontroller, providing flexibility for placement in space-constrained designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture of the microcontroller enhances instruction processing efficiency, resulting in improved performance and reduced power consumption for optimized operation.

Terminal Form: BALL

Ball terminal form simplifies soldering and assembly processes, ensuring secure electrical connections and reliable operation in demanding environmental conditions.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent operation of the microcontroller within specified performance parameters, enhancing overall system reliability and durability.

PWM Channels: YES

PWM channels enable precise control of output signals for applications such as motor speed regulation and LED brightness, offering versatile functionality for diverse use cases.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting on PCBs, facilitating compact design layouts and increasing the overall system integration efficiency.

Speed: 180 rpm

High operating speed of 180 rpm enables fast data processing and system responsiveness, making the microcontroller suitable for time-critical applications and tasks.

No. of I/O Lines: 161

Abundant I/O lines provide extensive connectivity options for interfacing with external devices and peripherals, offering flexibility in system design and functional expansion.

Technical Specifications

Microcontrollers STM32F469NEH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

13 mm

No. of I/O Lines:

161

No. of Terminals:

216

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

13 mm

Peripheral IC Type:

Trade Compliance

STM32F469NEH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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