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STM32F469AEH6

STMicroelectronics

STM32F469AEH6 by STMicroelectronics

STM32F469AEH6 by STMicroelectronics is a 32-bit microcontroller with 24-bit address bus width, 169 terminals, and 524288 ROM words. It operates b/w -40 to 85°C, offers CAN, I2C, UART connectivity, and features DMA(2), TIMER(17) peripherals. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,448 parts In-Stock

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Digiode

USA . 4,491 parts In-Stock

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Anansix

USA . 2,604 parts In-Stock

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Nova Conductors

Japan . 18 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 342 parts In-Stock

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$16.000

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342

$16.000

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AZTECH Wire

Italy . 654 parts In-Stock

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$18.930

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654

$18.930

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Microchip USA

USA . 4,018 parts In-Stock

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$31.235

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$31.235

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IDEA Electronic Components Group

UK . 2,275 parts In-Stock

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$31.440

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$28.296

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2,275

$31.440

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$28.296

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MKK Technologies

India . 704 parts In-Stock

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$59.121

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704

$59.121

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DigiPath Technology Company

USA . 704 parts In-Stock

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$59.121

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704

$59.121

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Corohmni

South Africa . 293 parts In-Stock

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$78.454

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293

$78.454

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Component Stockers USA

USA . 934 parts In-Stock

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$121.240

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Vigor

Singapore . 8,900 parts In-Stock

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Continental Prestige Electronics

USA . 6,948 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Perfect Parts

USA . 932 parts In-Stock

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Argo Parts USA

USA . 726 parts In-Stock

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Parana Technologies

USA . 554 parts In-Stock

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$37.591

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554

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$37.591

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Corphita

USA . 422 parts In-Stock

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422

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Overview

Unlock endless possibilities with the STM32F469AEH6 microcontroller by STMicroelectronics. Crafted with precision and quality, this innovative device offers unparalleled performance and reliability for various applications. From industrial automation to consumer electronics, the STM32F469AEH6 delivers exceptional value and benefits to customers seeking cutting-edge technology. Experience seamless connectivity, advanced peripherals, and efficient power management in a compact and versatile package. Trust STMicroelectronics to revolutionize your projects with the STM32F469AEH6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its thermal and electrical insulation properties, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier automated assembly, saving space and time during production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, the product can be used in a wide range of applications without the risk of exceeding its voltage tolerance.

Address Bus Width: 24

A wide address bus width allows for efficient memory addressing and data transfer, improving overall performance.

Package Shape: SQUARE

Square packages are space-efficient and provide a uniform mounting surface, making them easier to handle during assembly.

Bit Size: 32

A 32-bit architecture allows for efficient processing of data and instructions, enhancing the product's overall computing capabilities.

DAC Channels: YES

Digital-to-analog converter channels enable the product to interface with analog sensors and devices, expanding its connectivity options.

No. of Terminals: 169

Having a high number of terminals allows for versatile input/output configurations, accommodating a wide range of peripherals and interfaces.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high pin density, low profile design, and fine pitch for compact and reliable mounting on circuit boards.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage ensures energy efficiency and compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in harsh environmental conditions or high-temperature applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function effectively in cold environments without compromising performance.

ADC Channels: YES

Analog-to-digital converter channels enable the product to read analog signals from sensors or external devices, enhancing its data acquisition capabilities.

DMA Channels: YES

Direct Memory Access channels improve data transfer speed and efficiency, reducing the workload on the CPU and enhancing overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the product into existing designs.

ROM Words: 524288

The large ROM capacity allows for storing a significant amount of program data and instructions, providing ample space for complex software applications.

Maximum Seated Height: 0.6 mm

A low seated height ensures a compact overall package size, making it suitable for space-constrained applications or designs.

Width: 7 mm

The compact width makes the product suitable for small form factor designs while maintaining a high level of functionality.

External Data Bus Width: 32

A wide external data bus width allows for efficient data transfer between the CPU and external memory or peripherals, optimizing system performance.

Peripherals: CRC, DMA(2), TIMER(17), RTC, WDT

The inclusion of various peripherals such as CRC, DMA, timers, real-time clock (RTC), and watchdog timer (WDT) enhances the product's capabilities for diverse applications.

Maximum Clock Frequency: 26 MHz

With a high maximum clock frequency, the product can execute instructions quickly, leading to improved overall system responsiveness and performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during assembly, reducing the risk of solder joint failures or defects.

Length: 7 mm

The compact length allows for flexibility in PCB layout and design, accommodating space constraints without sacrificing functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can operate reliably in harsh industrial environments with wide temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture, the product offers efficient processing capabilities, low power consumption, and quick response times for embedded applications.

No. of Timers: 17

Having 17 timers allows for precise timing control in various applications, enabling the product to manage multiple tasks simultaneously with accuracy.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable in operation.

Terminal Form: BALL

Ball terminal form simplifies soldering and enhances electrical connections, ensuring reliable signal transmission and mechanical stability.

Nominal Supply Voltage: 3.3 V

Having a stable nominal supply voltage simplifies power management and ensures consistent performance, especially in applications with strict voltage requirements.

No. of DMA Channels: 2

Multiple DMA channels allow for concurrent data transfers between peripherals and memory, optimizing system efficiency and reducing CPU workload.

PWM Channels: YES

Pulse-width modulation channels enable precise control of output signals, making the product suitable for applications requiring adjustable voltage or current levels.

Connectivity: CAN, I2C, I2S, UART

Support for various connectivity options such as Controller Area Network (CAN), I2C, I2S, and UART enables seamless communication with external devices and networks.

ROM Programmability: FLASH

ROM programmable through FLASH technology allows for easy updating of firmware and software, improving flexibility and adaptability of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density packaging, reducing PCB footprint and enabling higher pin counts for increased functionality.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture during storage and assembly, requiring standard handling procedures to prevent component damage.

Speed: 180 rpm

With a speed rating of 180 rpm, the product can process and respond to data inputs quickly, ensuring smooth operation in real-time applications.

No. of I/O Lines: 114

Having 114 I/O lines offers extensive connectivity options for interfacing with external devices and peripherals, enhancing the product's versatility and functionality.

Technical Specifications

Microcontrollers STM32F469AEH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B169

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of I/O Lines:

114

No. of Terminals:

169

No. of Timers:

17

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN, I2C, I2S, UART

Peripherals:

CRC, DMA(2), TIMER(17), RTC, WDT

Trade Compliance

STM32F469AEH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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