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STM32F446ZEH7

STMicroelectronics

STM32F446ZEH7 by STMicroelectronics

STM32F446ZEH7 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4F CPU, 144 terminals, and 131072 bytes of RAM. It features 24 ADC channels, 2 DACs, and peripherals like BOD, DMA(2), and RTC. Ideal for industrial applications requiring high-speed processing up to 16 MHz with a wide range of connectivity options including CAN, I2C(4), SPI(4), and USB.

Median Price

$11.410

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 55 parts In-Stock

1+ parts

$11.410

100+ parts

-

1k+ parts

-

10k+ parts

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55

$11.410

-

-

-

Anansix

USA . 1,634 parts In-Stock

1+ parts

-

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-

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1,634

-

-

-

-

Digiode

USA . 1,400 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,400

-

-

-

-

Vyrian

USA . 1,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,358

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,685 parts In-Stock

1+ parts

$6.920

100+ parts

-

1k+ parts

-

10k+ parts

-

4,685

$6.920

-

-

-

Continental Prestige Electronics

USA . 6,794 parts In-Stock

1+ parts

$11.410

100+ parts

-

1k+ parts

-

10k+ parts

$11.182

6,794

$11.410

-

-

$11.182

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$11.410

100+ parts

$11.182

1k+ parts

-

10k+ parts

-

2,000

$11.410

$11.182

-

-

Semicontronic

India . 1,457 parts In-Stock

1+ parts

$12.000

100+ parts

$11.700

1k+ parts

$11.640

10k+ parts

-

1,457

$12.000

$11.700

$11.640

-

AZTECH Wire

Italy . 197 parts In-Stock

1+ parts

$13.218

100+ parts

-

1k+ parts

-

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197

$13.218

-

-

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Microchip USA

USA . 4,312 parts In-Stock

1+ parts

$22.152

100+ parts

-

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4,312

$22.152

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Ampacity Inc.

Singapore . 1,464 parts In-Stock

1+ parts

$35.000

100+ parts

-

1k+ parts

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10k+ parts

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1,464

$35.000

-

-

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IDEA Electronic Components Group

UK . 1,433 parts In-Stock

1+ parts

$43.691

100+ parts

-

1k+ parts

$39.322

10k+ parts

-

1,433

$43.691

-

$39.322

-

Aztec Data Supply Inc.

USA . 316 parts In-Stock

1+ parts

$54.790

100+ parts

-

1k+ parts

-

10k+ parts

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316

$54.790

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$62.925

100+ parts

$59.779

1k+ parts

$59.779

10k+ parts

-

3,000

$62.925

$59.779

$59.779

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Corohmni

South Africa . 245 parts In-Stock

1+ parts

$67.363

100+ parts

-

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245

$67.363

-

-

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MKK Technologies

India . 1,345 parts In-Stock

1+ parts

$82.158

100+ parts

-

1k+ parts

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10k+ parts

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1,345

$82.158

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-

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DigiPath Technology Company

USA . 1,345 parts In-Stock

1+ parts

$82.158

100+ parts

-

1k+ parts

-

10k+ parts

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1,345

$82.158

-

-

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Corphita

USA . 3,905 parts In-Stock

1+ parts

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3,905

-

-

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Parana Technologies

USA . 1,410 parts In-Stock

1+ parts

-

100+ parts

$52.239

1k+ parts

-

10k+ parts

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1,410

-

$52.239

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Argo Parts USA

USA . 1,373 parts In-Stock

1+ parts

-

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1,373

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Robosynatics

Brazil . 150 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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150

-

-

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Lucentia Tech

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$4.837

1k+ parts

$4.837

10k+ parts

$4.837

150

-

$4.837

$4.837

$4.837

Overview

Unlock endless possibilities with the STM32F446ZEH7 microcontroller by STMicroelectronics. Built with precision and innovation, this powerful device offers unparalleled performance for a wide range of applications. From IoT devices to consumer electronics, this cutting-edge microcontroller provides seamless connectivity, advanced peripherals, and efficient power management. Experience the reliability and quality of STMicroelectronics with the STM32F446ZEH7, delivering value and efficiency to customers worldwide. Step into the future of technology with this exceptional microcontroller at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

The surface mount feature allows for easy assembly onto PCBs, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, making it versatile for different projects.

Address Bus Width: 24

The 24-bit address bus width allows for efficient memory addressing, enabling the microcontroller to access a large amount of data quickly.

Package Shape: SQUARE

The square package shape helps in optimizing space on the PCB, ensuring efficient use of board real estate.

Bit Size: 32

The 32-bit bit size provides enhanced computational capabilities, allowing the microcontroller to handle complex processing tasks with ease.

Power Supplies (V): 1.8/3.3

With multiple power supply options, this microcontroller can operate in various power environments, increasing its adaptability.

No. of Terminals: 144

The large number of terminals allows for multiple connections and peripherals to be integrated, enhancing the functionality of the microcontroller.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style ensures a secure and reliable connection to the PCB, reducing the risk of signal interference.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage requirement makes this microcontroller energy-efficient, suitable for battery-operated devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range allows for reliable performance even in extreme environmental conditions.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers high performance and energy efficiency, making this microcontroller suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures the microcontroller can function in cold environments without any issues.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data, expanding its sensing capabilities.

DMA Channels: YES

The availability of DMA channels enhances data transfer speed and efficiency, improving overall system performance.

Terminal Position: BOTTOM

The terminal position at the bottom of the microcontroller simplifies PCB layout and routing, reducing design complexity.

ROM Words: 524288

The large ROM storage capacity allows for storing a significant amount of program data, enabling the microcontroller to execute complex algorithms.

Digital To Analog Convertors: 2-Ch 12-Bit

The dual DACs with 12-bit resolution provide precise analog output signals, essential for applications requiring accurate voltage levels.

Width: 7 mm

The compact width of the microcontroller makes it suitable for space-constrained designs, ensuring efficient use of available area.

External Data Bus Width: 32

The wide 32-bit external data bus width facilitates high-speed data transfers between the microcontroller and external peripherals, enhancing system performance.

Technical Specifications

Microcontrollers STM32F446ZEH7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B144

Length:

7 mm

No. of I/O Lines:

114

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), HDMI-CEC, I2C(4), I2S(3), IRDA, LIN, SAI(2), SDMMC, SPDIF-RX, SPI(4), UART(2), USART(4), USB

Peripherals:

BOD, CAMERA, DMA(2), LCD, POR, RTC, TIMER(17)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F446ZEH7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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