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STM32F446ZEH6TR

STMicroelectronics

STM32F446ZEH6TR by STMicroelectronics

STM32F446ZEH6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 144 terminals, and 26 MHz clock frequency. Ideal for industrial applications, it features 24-Ch ADC, 2-Ch DAC, and various connectivity options like CAN, I2C, SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,841 parts In-Stock

1+ parts

-

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4,841

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Digiode

USA . 4,586 parts In-Stock

1+ parts

-

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4,586

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Anansix

USA . 2,629 parts In-Stock

1+ parts

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2,629

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Nova Conductors

Japan . 78 parts In-Stock

1+ parts

-

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-

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78

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 6,767 parts In-Stock

1+ parts

$6.460

100+ parts

-

1k+ parts

-

10k+ parts

-

6,767

$6.460

-

-

-

Semicontronic

India . 1,476 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

1k+ parts

$8.730

10k+ parts

-

1,476

$9.000

$8.775

$8.730

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AZTECH Wire

Italy . 209 parts In-Stock

1+ parts

$10.079

100+ parts

-

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-

10k+ parts

-

209

$10.079

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-

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Microchip USA

USA . 4,143 parts In-Stock

1+ parts

$20.700

100+ parts

$20.410

1k+ parts

$20.260

10k+ parts

$20.110

4,143

$20.700

$20.410

$20.260

$20.110

IDEA Electronic Components Group

UK . 1,784 parts In-Stock

1+ parts

$27.086

100+ parts

-

1k+ parts

$24.377

10k+ parts

-

1,784

$27.086

-

$24.377

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Ampacity Inc.

Singapore . 1,440 parts In-Stock

1+ parts

$35.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,440

$35.000

-

-

-

MKK Technologies

India . 659 parts In-Stock

1+ parts

$50.933

100+ parts

-

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10k+ parts

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659

$50.933

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DigiPath Technology Company

USA . 659 parts In-Stock

1+ parts

$50.933

100+ parts

-

1k+ parts

-

10k+ parts

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659

$50.933

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Corohmni

South Africa . 629 parts In-Stock

1+ parts

$56.327

100+ parts

-

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10k+ parts

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629

$56.327

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Aztec Data Supply Inc.

USA . 4,645 parts In-Stock

1+ parts

$68.990

100+ parts

-

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4,645

$68.990

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Continental Prestige Electronics

USA . 6,094 parts In-Stock

1+ parts

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6,094

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Alle Elektronik GmbH

Germany . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 3,244 parts In-Stock

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3,244

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Parana Technologies

USA . 1,829 parts In-Stock

1+ parts

-

100+ parts

$32.385

1k+ parts

-

10k+ parts

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1,829

-

$32.385

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

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300

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Argo Parts USA

USA . 151 parts In-Stock

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151

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Advanced Electronics

New Zealand . 29 parts In-Stock

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29

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Overview

Unlock the full potential of your electronic designs with the STM32F446ZEH6TR microcontroller by STMicroelectronics. Renowned for their quality and reliability, STMicroelectronics delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this microcontroller offers unmatched performance and efficiency. With advanced features like DAC and ADC channels, DMA capabilities, and low power mode, the STM32F446ZEH6TR provides exceptional value and versatility to customers seeking top-of-the-line microcontrollers. Choose STMicroelectronics for innovative solutions that drive your projects forward.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and reliability for the product.

Surface Mount:

YES - Allows for easy installation and integration into various systems.

Maximum Supply Voltage:

3.6 V - Provides flexibility for different power requirements.

On Chip Data RAM Width:

8 - Efficient data processing capability for high performance.

Package Shape:

SQUARE - Compact design for space-saving installations.

Bit Size:

32 - Suitable for handling complex computational tasks.

DAC Channels:

YES - Enables analog outputs for diverse applications.

No. of Terminals:

144 - Sufficient connectivity options for interfacing with external devices.

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - Facilitates precise and compact PCB layout designs.

Minimum Supply Voltage:

1.8 V - Supports low power operation for energy efficiency.

Maximum Operating Temperature:

85 °C - Ensures product reliability in various environmental conditions.

CPU Family:

CORTEX-M4 - Known for its high performance and energy efficiency.

No. of External Interrupts:

16 - Allows for timely response to external events.

Minimum Operating Temperature:

40 °C - Ensures functionality in extreme cold environments.

ADC Channels:

YES - Enables analog inputs for sensing and monitoring applications.

DMA Channels:

YES - Enhances data transfer efficiency for improved performance.

Terminal Position:

BOTTOM - Enables easy PCB layout design for routing connections.

ROM Words:

524288 - Sufficient memory for storing program instructions.

Maximum Seated Height:

0.6 mm - Low profile design for space-constrained applications.

Digital To Analog Convertors:

2-Ch 12-Bit - Provides high-resolution analog output capabilities.

Width:

7 mm - Compact form factor for easy integration into systems.

Boundary Scan:

YES - Facilitates debugging and testing during product development.

Peripherals:

BOD, POR, TIMER(15), WDT(2) - Comprehensive set of integrated peripherals for diverse functionalities.

Maximum Clock Frequency:

26 MHz - Suitable for handling real-time processing requirements.

Length:

7 mm - Compact design for space-saving installations.

Temperature Grade:

INDUSTRIAL - Suitable for industrial operating conditions.

Peripheral IC Type:

MICROCONTROLLER, RISC - Ideal for embedded control applications.

No. of Timers:

15 - Enables efficient time-based operations and scheduling.

RAM Bytes:

135168 - Sufficient memory for storing data during operation.

Technology:

CMOS - Ensures low power consumption and high speed operation.

Terminal Form:

BALL - Facilitates easy soldering and assembly processes.

Analog To Digital Convertors:

24-Ch 12-Bit - Provides high-resolution analog input capabilities.

Maximum Supply Current:

115 mA - Suitable for various power supply configurations.

Nominal Supply Voltage:

2.4 V - Optimal voltage level for stable operation.

No. of DMA Channels:

2 - Enables efficient data transfer for multitasking applications.

No. of Serial I/Os:

6 - Sufficient communication interfaces for connectivity with external devices.

PWM Channels:

YES - Enables precise control of output signals for varied applications.

Connectivity:

CAN(2), I2C(5), I2S(3), SAI(2), SPI(4), UART(2), USART(4), QSPI - Versatile communication options for seamless integration.

ROM Programmability:

FLASH - Allows for easy reprogramming and updating of firmware.

Terminal Pitch:

0.5 mm - Facilitates precise and compact PCB layout design.

Format:

FLOATING POINT - Suitable for handling floating-point arithmetic operations.

Speed:

180 rpm - Provides high-speed processing capabilities for time-critical applications.

Low Power Mode:

YES - Supports power-saving modes for energy efficiency.

On Chip Program ROM Width:

8 - Efficient program storage for quick access and execution.

No. of I/O Lines:

114 - Enables versatile interfacing with external devices.

Technical Specifications

Microcontrollers STM32F446ZEH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B144

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

2

No. of External Interrupts:

16

No. of I/O Lines:

114

No. of Serial I/Os:

6

No. of Terminals:

144

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

135168

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

180 rpm

Maximum Supply Current:

115 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(5), I2S(3), SAI(2), SPI(4), UART(2), USART(4), QSPI

Peripherals:

BOD, POR, TIMER(15), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F446ZEH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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