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STM32F446MEY6MTR

STMicroelectronics

STM32F446MEY6MTR by STMicroelectronics

STM32F446MEY6MTR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and includes 14 ADC channels. Ideal for industrial applications, it supports various connectivity options like CAN and SPI. Its low power mode enhances efficiency in embedded systems.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 4,331 parts In-Stock

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Anansix

USA . 1,206 parts In-Stock

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1,206

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Digiode

USA . 541 parts In-Stock

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541

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AZTECH Wire

Italy . 587 parts In-Stock

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$8.800

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587

$8.800

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Microchip USA

USA . 6,147 parts In-Stock

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$16.723

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6,147

$16.723

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IDEA Electronic Components Group

UK . 471 parts In-Stock

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$56.196

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$50.577

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471

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MKK Technologies

India . 540 parts In-Stock

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$105.674

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540

$105.674

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DigiPath Technology Company

USA . 540 parts In-Stock

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$105.674

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540

$105.674

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Corphita

USA . 1,095 parts In-Stock

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Parana Technologies

USA . 720 parts In-Stock

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$67.191

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Overview

Unlock unparalleled performance with the STM32F446MEY6MTR microcontroller by STMicroelectronics. Renowned for their innovation and reliability, STMicroelectronics delivers a powerhouse that seamlessly integrates advanced features into your applications. With its versatile connectivity options and low power consumption, this microcontroller is perfect for automotive, industrial, and consumer electronics. Experience enhanced efficiency and design flexibility—empower your projects with cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliable performance and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and simplifies assembly, making this microcontroller suitable for modern applications.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage enhances energy efficiency, ideal for battery-operated devices.

On Chip Data RAM Width: 8

This width supports efficient data processing, allowing for quick access to information.

Package Shape: RECTANGULAR

A rectangular shape provides an efficient use of board space and easier integration into designs.

Bit Size: 32

The 32-bit architecture allows for faster processing and greater computational power for complex tasks.

DAC Channels: YES

Having Digital-to-Analog Converters enables the microcontroller to produce analog signals, which is beneficial in audio and signal processing applications.

No. of Terminals: 81

A higher number of terminals provide more connectivity options for peripherals and other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style supports high-density layouts, catering to space-constrained designs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage improves compatibility with various power sources, including low-voltage batteries.

Maximum Operating Temperature: 85 °C

This high temperature threshold ensures reliable performance in demanding environments.

CPU Family: CORTEX-M4

The Cortex-M4 family provides excellent processing capabilities with energy efficiency, making it suitable for both high-performance and low-power applications.

No. of External Interrupts: 16

Multiple external interrupts improve the microcontroller's ability to respond to external events quickly and efficiently.

Minimum Operating Temperature: -40 °C

Withstand extreme low temperatures, making it suitable for harsh environmental conditions.

ADC Channels: YES

Having multiple Analog-to-Digital Converters allows for precise measurement of analog signals, useful in various sensing applications.

DMA Channels: YES

Direct Memory Access enhances data transfer efficiency between peripherals and memory, reducing CPU workload.

Terminal Position: BOTTOM

Bottom terminal positioning aids in better thermal management and space optimization on PCB.

ROM Words: 524288

A generous size of ROM allows for more complex programs and firmware to be stored, enhancing functionality.

Maximum Seated Height: 0.6 mm

The low seated height is optimal for compact devices, ensuring minimal space usage on the PCB.

Digital To Analog Convertors: 2-Ch 12-Bit

Having dual channels running at 12 bits allows for high-resolution signal generation, essential in high-fidelity audio and other applications.

Width: 3.693 mm

A compact width contributes to more adaptable designs, especially in space-sensitive applications.

Boundary Scan: YES

Boundary scan capability allows for improved testing and debugging of the microcontroller, enhancing product reliability.

Peripherals: BOD, POR, TIMER(15), WDT(2)

A variety of peripherals available enhances functionality, making it versatile for a wide range of applications.

Maximum Clock Frequency: 26 MHz

This clock frequency supports efficient processing power and quick response times for various applications.

Length: 3.815 mm

The compact length contributes to an overall smaller footprint for devices, ideal for portable applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in challenging environments, suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides higher performance and energy efficiency for applications demanding processing power.

No. of Timers: 15

Multiple timers support complex timing and scheduling tasks, beneficial for real-time applications.

RAM Bytes: 135168

Ample RAM size enables more data handling and processing, improving application performance.

Technology: CMOS

CMOS technology ensures low power consumption and improved performance, ideal for many modern applications.

Terminal Form: BALL

Ball terminal form enhances heat dissipation capabilities and helps in reliable soldering to PCBs.

Analog To Digital Convertors: 14-Ch 12-Bit

Fourteen channels allow for extensive data collection from multiple analog sources simultaneously, useful in sensing applications.

Maximum Supply Current: 115 mA

A moderate maximum current helps balance performance with power consumption, suitable for low-power applications.

Nominal Supply Voltage: 2.4 V

This nominal voltage supports a variety of power supply options and battery configurations.

No. of DMA Channels: 2

Two DMA channels improve efficiency in data transfers, allowing the CPU to focus on other tasks.

No. of Serial I/Os: 6

Multiple serial I/O options provide flexibility and ease of connecting various peripherals.

PWM Channels: YES

The presence of Pulse Width Modulation channels enables control of motors and brightness levels in LED applications.

Connectivity: CAN(2), I2C(5), I2S(3), SAI(2), SPI(4), UART(2), USART(4), QSPI

Extensive connectivity options enhance interoperability and integration capabilities with other devices and systems.

ROM Programmability: FLASH

Flash memory allows for reprogrammability, ensuring the microcontroller can be updated and adapted for various applications.

Terminal Pitch: 0.4 mm

A fine terminal pitch allows for high-density connections, making it easier to design compact PCBs.

Format: FLOATING POINT

Floating point support improves mathematical computation capabilities, crucial for complex calculations.

Speed: 180 rpm

Operational speed can be advantageous in systems requiring rapid processing and response.

Low Power Mode: YES

Low power mode enhances energy efficiency, extending battery life and reducing heat generation.

On Chip Program ROM Width: 8

This width helps in optimizing software performance and memory utilization.

No. of I/O Lines: 63

Having numerous I/O lines supports a wide range of interfacing options for peripherals and sensors.

Technical Specifications

Microcontrollers STM32F446MEY6MTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B81

Length:

3.815 mm

Low Power Mode:

YES

No. of DMA Channels:

2

No. of External Interrupts:

16

No. of I/O Lines:

63

No. of Serial I/Os:

6

No. of Terminals:

81

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA81,9X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

135168

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

180 rpm

Maximum Supply Current:

115 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

3.693 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(5), I2S(3), SAI(2), SPI(4), UART(2), USART(4), QSPI

Peripherals:

BOD, POR, TIMER(15), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F446MEY6MTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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