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STM32F437AIH6TR

STMicroelectronics

STM32F437AIH6TR by STMicroelectronics

STM32F437AIH6TR by STMicroelectronics is a 32-bit microcontroller featuring a Cortex-M4F CPU, ideal for industrial applications. It supports up to 169 terminals, operates b/w -40 °C and 85°C, and includes DAC/ADC channels. With a max clock frequency of 26 MHz, it ensures efficient performance in embedded systems.

Median Price

$10.740

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 17,500 parts In-Stock

1+ parts

-

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$10.740

17,500

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$10.740

Vyrian

USA . 9,581 parts In-Stock

1+ parts

-

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-

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9,581

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Digiode

USA . 1,043 parts In-Stock

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1,043

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Anansix

USA . 152 parts In-Stock

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152

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Distributors (Availability)

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Vigor

Singapore . 9,337 parts In-Stock

1+ parts

$11.990

100+ parts

-

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9,337

$11.990

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AZTECH Wire

Italy . 266 parts In-Stock

1+ parts

$17.340

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-

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266

$17.340

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Microchip USA

USA . 3,985 parts In-Stock

1+ parts

$39.199

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3,985

$39.199

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IDEA Electronic Components Group

UK . 2,077 parts In-Stock

1+ parts

$54.890

100+ parts

-

1k+ parts

$49.401

10k+ parts

-

2,077

$54.890

-

$49.401

-

MKK Technologies

India . 449 parts In-Stock

1+ parts

$103.217

100+ parts

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449

$103.217

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DigiPath Technology Company

USA . 449 parts In-Stock

1+ parts

$103.217

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449

$103.217

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Component Stockers USA

USA . 664 parts In-Stock

1+ parts

$184.030

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664

$184.030

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Parana Technologies

USA . 980 parts In-Stock

1+ parts

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100+ parts

$65.629

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980

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$65.629

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Corphita

USA . 236 parts In-Stock

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236

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Overview

Unlock the potential of your next project with the STM32F437AIH6TR microcontroller from STMicroelectronics, a leader in high-performance solutions. This versatile and robust device excels in industrial applications, offering exceptional processing power while ensuring energy efficiency. With advanced features like integrated DACs and ADCs, it empowers developers to craft innovative products that stand out in a competitive market. Count on ST's proven quality and support for seamless integration and superior results!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides robust protection against environmental factors, enhancing reliability in various applications.

Surface Mount: YES

Surface mount technology allows for smaller device footprints and easier integration into compact electronic designs.

Maximum Supply Voltage: 3.6 V

A maximum voltage of 3.6 V maintains compatibility with a wide range of existing systems while ensuring safe operation.

Package Shape: SQUARE

The square package shape provides a uniform layout, facilitating circuit board design and layout optimization.

Bit Size: 32

The 32-bit architecture allows for more complex computations and greater efficiency, suitable for advanced applications.

DAC Channels: YES

Integrated DAC channels enable the device to perform digital-to-analog conversions, useful for audio and control applications.

Power Supplies (V): 2/3.3

With support for dual power supply voltages, this microcontroller can adapt to varying energy requirements of different devices.

No. of Terminals: 169

A higher number of terminals provides more connectivity options, allowing for increased peripheral integration.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array with a very thin profile ensures efficient space usage and is ideal for high-density applications.

Minimum Supply Voltage: 1.7 V

Lower minimum voltage operation allows for extended battery life in portable devices, making this microcontroller energy-efficient.

Maximum Operating Temperature: 85 °C

Designed to operate in high-temperature environments, this microcontroller is suitable for industrial applications.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers enhanced performance, DSP capabilities, and floating-point processing for complex applications.

Minimum Operating Temperature: -40 °C

The capability to function in extreme cold conditions makes this microcontroller ideal for automotive and outdoor applications.

ADC Channels: YES

With ADC channels, this microcontroller can interface with a variety of sensors, making it versatile for data acquisition.

DMA Channels: YES

Direct Memory Access channels enhance data handling efficiency, allowing for faster processing and reduced CPU load.

Terminal Position: BOTTOM

Bottom terminal positioning enables effective heat dissipation and compact layout design for high-performance applications.

ROM Words: 2097152

The large ROM capacity provides ample space for program storage, supporting intricate applications and functionalities.

Maximum Seated Height: 0.6 mm

A low seated height contributes to space efficiency on PCBs, enabling slimmer design profiles for modern electronics.

Width: 7 mm

A compact width allows for easy placement in tight spaces, ideal for miniaturized products.

Maximum Clock Frequency: 26 MHz

The maximum clock frequency enables faster processing speeds, enhancing the microcontroller's overall performance.

Length: 7 mm

The short length complements its small form factor, making it highly suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Classified for industrial use, this product is built for durability and reliability in challenging operational conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers high performance per watt, making it efficient for both low-power and high-speed applications.

RAM Bytes: 262144

Generous RAM size allows for more complex algorithms and real-time processing, essential for advanced control systems.

Technology: CMOS

CMOS technology provides low power consumption, making this microcontroller suitable for battery-operated devices.

Terminal Form: BALL

Ball terminal form supports reliable soldering and excellent electrical connections, enhancing durability in critical applications.

Maximum Supply Current: 123 mA

A maximum supply current limit of 123 mA enables the device to perform demanding tasks while maintaining power efficiency.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V keeps it compatible with many peripheral devices, simplifying integration into various electronics.

PWM Channels: YES

PWM channels facilitate control of motors and lights, broadening application possibilities in automation and robotics.

ROM Programmability: FLASH

Flash programmability allows for easier updates and modifications to software, ensuring flexibility in application development.

Terminal Pitch: 0.5 mm

A smaller terminal pitch enables higher pin density, supporting more complex functions and greater I/O possibilities.

Speed: 180 rpm

With a speed capability of 180 rpm, this device is suitable for applications requiring precise motion control.

No. of I/O Lines: 114

Having 114 I/O lines maximizes connectivity options, making it adaptable for various interfacing requirements.

Technical Specifications

Microcontrollers STM32F437AIH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B169

Length:

7 mm

No. of I/O Lines:

114

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

123 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F437AIH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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