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STM32F429ZET6TR

STMicroelectronics

STM32F429ZET6TR by STMicroelectronics

STM32F429ZET6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, offering 26 MHz clock frequency and 524288 ROM words. It features 144 terminals, 16 external interrupts, and peripherals like BOR, DMA(16), RTC. Ideal for industrial applications requiring low power mode and connectivity via CAN(2), I2C(3), SPI(6).

Median Price

$9.748

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 181 parts In-Stock

1+ parts

$5.909

100+ parts

-

1k+ parts

-

10k+ parts

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181

$5.909

-

-

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Chip1Stop

Japan . 284 parts In-Stock

1+ parts

$9.427

100+ parts

-

1k+ parts

-

10k+ parts

-

284

$9.427

-

-

-

Mouser Electronics

USA . 1,950 parts In-Stock

1+ parts

$10.070

100+ parts

$7.670

1k+ parts

$7.280

10k+ parts

-

1,950

$10.070

$7.670

$7.280

-

DigiKey

USA . 779 parts In-Stock

1+ parts

$13.570

100+ parts

$9.163

1k+ parts

$9.041

10k+ parts

-

779

$13.570

$9.163

$9.041

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Verical

USA . 181 parts In-Stock

1+ parts

-

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181

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Distributors (In-Stock)

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Digiode

USA . 155 parts In-Stock

1+ parts

$8.381

100+ parts

-

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155

$8.381

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$11.610

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-

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15

$11.610

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Chip Stock

USA . 7,530 parts In-Stock

1+ parts

-

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7,530

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Anansix

USA . 265 parts In-Stock

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265

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Vyrian

USA . 227 parts In-Stock

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227

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 428 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

10k+ parts

-

428

$7.500

$7.312

$7.275

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Ampacity Inc.

Singapore . 92 parts In-Stock

1+ parts

$7.500

100+ parts

-

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92

$7.500

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Corphita

USA . 1,892 parts In-Stock

1+ parts

$7.940

100+ parts

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1,892

$7.940

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Continental Prestige Electronics

USA . 4,478 parts In-Stock

1+ parts

$11.605

100+ parts

-

1k+ parts

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10k+ parts

$11.373

4,478

$11.605

-

-

$11.373

Modulus Dynamics

Lithuania . 300 parts In-Stock

1+ parts

$12.881

100+ parts

$12.753

1k+ parts

$12.366

10k+ parts

-

300

$12.881

$12.753

$12.366

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Aztec Data Supply Inc.

USA . 2,781 parts In-Stock

1+ parts

$24.200

100+ parts

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2,781

$24.200

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IDEA Electronic Components Group

UK . 391 parts In-Stock

1+ parts

$30.219

100+ parts

-

1k+ parts

$27.197

10k+ parts

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391

$30.219

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$27.197

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Microchip USA

USA . 1,711 parts In-Stock

1+ parts

$32.494

100+ parts

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1,711

$32.494

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$49.942

100+ parts

$47.445

1k+ parts

$47.445

10k+ parts

-

3,000

$49.942

$47.445

$47.445

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MKK Technologies

India . 2,284 parts In-Stock

1+ parts

$56.825

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2,284

$56.825

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DigiPath Technology Company

USA . 2,284 parts In-Stock

1+ parts

$56.825

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2,284

$56.825

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Corohmni

South Africa . 198 parts In-Stock

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$82.952

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198

$82.952

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QUARKTWIN TECHNOLOGY LTD

USA . 21,092 parts In-Stock

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Argo Parts USA

USA . 4,450 parts In-Stock

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4,450

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Robosynatics

Brazil . 950 parts In-Stock

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950

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Lucentia Tech

USA . 950 parts In-Stock

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950

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Futuretech Components

Singapore . 246 parts In-Stock

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246

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Parana Technologies

USA . 36 parts In-Stock

1+ parts

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$36.132

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36

-

$36.132

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Overview

Elevate your projects to the next level with the STM32F429ZET6TR by STMicroelectronics. Crafted with precision and expertise, this microcontroller boasts top-quality features and a wide range of applications, making it a versatile choice for various projects. Experience the seamless integration and high performance that STMicroelectronics is renowned for, while enjoying the value and benefits this product brings to your designs. Upgrade your creations with the STM32F429ZET6TR and unlock endless possibilities in the world of technology.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable material for long-lasting performance.

Surface Mount:

YES - Convenient for easy installation on PCBs.

Maximum Supply Voltage:

3.6 V - Provides flexibility in power supply options.

On Chip Data RAM Width:

8 - Efficient data processing capabilities.

Address Bus Width:

26 - Supports larger memory address space.

Package Shape:

SQUARE - Space-saving design for compact systems.

Bit Size:

32 - High computational power for complex tasks.

DAC Channels:

YES - Enables analog output functionality.

No. of Terminals:

144 - Sufficient connectivity for various peripherals.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - Easy to integrate into tight spaces.

Minimum Supply Voltage:

1.7 V - Allows for low-power operation.

Maximum Operating Temperature:

85 °C - Suitable for industrial environments.

CPU Family:

CORTEX-M4 - Reliable performance from a reputable brand.

No. of External Interrupts:

16 - Supports multiple interrupt-driven operations.

Minimum Operating Temperature:

40 °C - Operates effectively in extreme conditions.

Terminal Finish:

MATTE TIN - Resistant to corrosion for extended lifespan.

ADC Channels:

YES - Enables analog input capabilities.

DMA Channels:

YES - Enhances data transfer efficiency.

Terminal Position:

QUAD - Simplifies PCB layout and wiring.

ROM Words:

524288 - Large memory capacity for storing program code.

Maximum Seated Height:

1.6 mm - Fits well within slim device profiles.

Digital To Analog Convertors:

2-Ch 12-Bit - Delivers accurate analog signal conversion.

Width:

20 mm - Compact size for versatile installation options.

Boundary Scan:

YES - Simplifies testing and debugging processes.

External Data Bus Width:

16 - Supports high-speed data transfer.

Peripherals:

BOR, DMA(16), POR, RTC, TIMER(15), WDT(2) - Wide range of peripheral support for diverse applications.

Maximum Clock Frequency:

26 MHz - Provides fast processing speeds.

Peak Reflow Temperature °C:

260 - Ensures reliable soldering in manufacturing.

Length:

20 mm - Balanced dimensions for efficient PCB layout.

Temperature Grade:

INDUSTRIAL - Suitable for rugged industrial environments.

Peripheral IC Type:

MICROCONTROLLER, RISC - Ideal for embedded control applications.

No. of Timers:

15 - Flexible timing options for various tasks.

RAM Bytes:

266240 - Sufficient memory for data storage and processing.

Technology:

CMOS - Energy-efficient and reliable technology.

Terminal Form:

GULL WING - Secure terminal design for stable connections.

Analog To Digital Convertors:

24-Ch 12-Bit - High-resolution conversion for accurate data acquisition.

Maximum Supply Current:

100 mA - Ensures stable power consumption.

Nominal Supply Voltage:

3.3 V - Standard voltage level for compatibility.

No. of DMA Channels:

2 - Efficient data handling capabilities.

No. of Serial I/Os:

4 - Supports multiple communication interfaces.

PWM Channels:

YES - Enables precise control of output signals.

Connectivity:

CAN(2), I2C(3), I2S(2), SAI, SPI(6), UART(4), USART(4), USB(2) - Versatile communication options for diverse connectivity needs.

ROM Programmability:

FLASH - Allows for easy reprogramming of memory.

Terminal Pitch:

0.5 mm - Fine pitch for compact layout designs.

Format:

FLOATING POINT - Supports floating-point calculations for accuracy.

Moisture Sensitivity Level (MSL):

3 - Suitable for a variety of operating environments.

Speed:

180 rpm - Efficient performance for real-time processing.

Low Power Mode:

YES - Enables energy-efficient operation.

On Chip Program ROM Width:

8 - Efficient program storage for quick access.

No. of I/O Lines:

114 - Versatile I/O options for connectivity and expansion.

Technical Specifications

Microcontrollers STM32F429ZET6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of External Interrupts:

16

No. of I/O Lines:

114

No. of Serial I/Os:

4

No. of Terminals:

144

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

266240

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), SAI, SPI(6), UART(4), USART(4), USB(2)

Peripherals:

BOR, DMA(16), POR, RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F429ZET6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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