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STM32F429AGH6TR

STMicroelectronics

STM32F429AGH6TR by STMicroelectronics

STM32F429AGH6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 85°C, and supports up to 169 terminals. It includes dual DACs and 24 ADC channels for versatile applications in industrial automation. With a max clock of 26 MHz, it's ideal for high-performance embedded systems.

Median Price

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4

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1k+

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Vyrian

USA . 8,717 parts In-Stock

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Digiode

USA . 4,648 parts In-Stock

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Chip Stock

USA . 2,896 parts In-Stock

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Anansix

USA . 529 parts In-Stock

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529

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Vigor

Singapore . 2,443 parts In-Stock

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$10.780

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$10.780

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AZTECH Wire

Italy . 904 parts In-Stock

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$10.980

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IDEA Electronic Components Group

UK . 2,182 parts In-Stock

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$15.823

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$14.241

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MKK Technologies

India . 1,051 parts In-Stock

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$29.754

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$29.754

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DigiPath Technology Company

USA . 1,051 parts In-Stock

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$29.754

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Microchip USA

USA . 4,956 parts In-Stock

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$34.540

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$34.040

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$33.800

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$33.550

4,956

$34.540

$34.040

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$33.550

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 1,688 parts In-Stock

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Parana Technologies

USA . 601 parts In-Stock

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$18.919

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Overview

Unlock limitless possibilities with the STM32F429AGH6TR microcontroller from STMicroelectronics, a leader in innovative tech solutions. Designed for performance and efficiency, this cutting-edge device excels in diverse applications—from industrial automation to IoT devices, offering remarkable adaptability. Its robust features ensure reliability while maintaining low power consumption, making it the ideal choice for developers seeking quality and excellence. Experience unparalleled support and expertise from STMicroelectronics, empowering your projects to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making the microcontroller suitable for a variety of applications.

Surface Mount: YES

Being surface mount technology allows for compact designs and facilitates automated assembly, which is ideal for modern electronic devices.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V ensures compatibility with a wide range of electronic circuits and devices.

On Chip Data RAM Width: 8

An 8-bit wide RAM allows efficient local data handling and processing for applications requiring moderate data management.

Address Bus Width: 26

With a 26-bit address bus, this microcontroller can access a large memory space, making it suitable for memory-intensive tasks.

Package Shape: SQUARE

The square package shape is advantageous for spatial design and thermal management in tight layouts, enhancing reliability.

Bit Size: 32

A 32-bit architecture allows for high-performance computing with a broader range of applications, including complex algorithms.

DAC Channels: YES

Having Digital-to-Analog Converter channels provides flexibility for generating analog signals directly from digital data, which is useful in control systems.

No. of Terminals: 169

A higher number of terminals allows for increased connectivity and expansion capabilities, accommodating various peripherals and functionalities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch make this microcontroller suitable for high-density applications while maximizing performance.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage means low power consumption, making it ideal for battery-operated and energy-efficient designs.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C indicates robustness and reliability in industrial environments, ensuring long-term performance.

CPU Family: CORTEX-M4

The CORTEX-M4 CPU family provides excellent processing power with DSP instructions, making it suitable for real-time applications.

No. of External Interrupts: 16

Having 16 external interrupts enhances responsiveness and allows the microcontroller to handle multiple simultaneous events.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures that this microcontroller can function reliably in extreme conditions.

ADC Channels: YES

Integrated Analog-to-Digital Converter channels enable high-accuracy data acquisition from sensors without needing external components.

DMA Channels: YES

Direct Memory Access capability allows for efficient data transfer without CPU intervention, freeing up processing resources for other tasks.

Terminal Position: BOTTOM

Bottom terminal positioning aids in better PCB layout designs and improves thermal dissipation, enhancing overall performance.

ROM Words: 1048576

With 1MB of ROM, ample space is available for application code, accommodating more complex software environments.

Maximum Seated Height: 0.6 mm

A low maximum seated height facilitates designing compact electronic systems and contributes to a smaller footprint.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual-channel 12-bit DACs allow for the generation of precise analog outputs, enhancing control in various applications.

Width: 7 mm

A compact width of 7mm allows the microcontroller to fit into space-constrained designs without compromising functionality.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging PCB designs, improving yield and reliability in production.

External Data Bus Width: 32

A 32-bit external data bus allows for rapid data transfer rates, making this microcontroller suitable for high-speed applications.

Peripherals: BOR, DMA(16), POR, RTC, TIMER(15), WDT(2)

A rich set of peripherals enhances functionality and simplifies design, providing out-of-the-box solutions for diverse applications.

Maximum Clock Frequency: 26 MHz

A clock frequency of 26 MHz offers sufficient speed for most applications while balancing power consumption.

Length: 7 mm

The 7mm length makes it ideal for compact applications and products where space is at a premium.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies reliability and robustness in harsh environmental conditions, suitable for industrial automation.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for efficient programming and reduced power consumption, ideal for embedded systems.

No. of Timers: 15

Fifteen timers enable comprehensive time management features for various applications, improving the microcontroller's versatility.

RAM Bytes: 266240

With 256KB of RAM, there is ample memory for storing variables and buffers, ensuring smooth operation for complex algorithms.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: BALL

Ball terminal form factor supports high-density layouts and enhances reliability against mechanical stress.

Analog To Digital Convertors: 24-Ch 12-Bit

The presence of a 24-channel 12-bit ADC allows for advanced sensing capabilities, enabling simultaneous measurements from multiple sensors.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA ensures sufficient power for running the microcontroller and its connected peripherals.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V is common in contemporary digital circuits, enhancing compatibility.

No. of DMA Channels: 2

Two DMA channels allow concurrent data handling without CPU intervention, optimizing performance in data-intensive processes.

No. of Serial I/Os: 6

With six serial I/O lines, this microcontroller supports diverse communication protocols, enhancing connectivity options.

PWM Channels: YES

PWM capability enables precise control over motors and lighting applications, which is valuable in automation and robotics.

Connectivity: CAN(2), I2C(3), I2S(2), SAI, SPI(6), UART(4), USART(4), USB(2)

Multiple connectivity options provide flexibility in interfacing with various devices and sensors, enhancing overall system integration.

ROM Programmability: FLASH

Flash memory allows for re-programmability and data retention, making it convenient for iterative development and updates.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for compact routing on PCBs, suitable for densely packed electronic designs.

Format: FLOATING POINT

Floating-point processing capability allows for complex calculations and improved precision in data-intensive applications.

Speed: 180 rpm

The specified speed is indicative of potential performance benchmarks that can be achieved in motor control applications.

Low Power Mode: YES

Low power mode enhances energy efficiency, making this microcontroller suitable for long-term, battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient instruction processing, enhancing overall system performance.

No. of I/O Lines: 130

A high number of I/O lines allows for extensive interfacing capabilities with sensors and actuators, elevating design flexibility.

Technical Specifications

Microcontrollers STM32F429AGH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B169

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

2

No. of External Interrupts:

16

No. of I/O Lines:

130

No. of Serial I/Os:

6

No. of Terminals:

169

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

266240

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

180 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), SAI, SPI(6), UART(4), USART(4), USB(2)

Peripherals:

BOR, DMA(16), POR, RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F429AGH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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