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STM32F415VGT7

STMicroelectronics

STM32F415VGT7 by STMicroelectronics

STM32F415VGT7 microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 105 °C, and supports up to 168 MHz. With 2 DACs and 16 ADC channels, it's ideal for industrial applications requiring precision control. Its compact design ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,286 parts In-Stock

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6,286

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Digiode

USA . 2,363 parts In-Stock

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2,363

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Anansix

USA . 1,719 parts In-Stock

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1,719

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Distributors (Availability)

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AZTECH Wire

Italy . 1,100 parts In-Stock

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$15.590

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$15.590

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IDEA Electronic Components Group

UK . 527 parts In-Stock

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$47.821

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$43.039

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527

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$43.039

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MKK Technologies

India . 1,035 parts In-Stock

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$89.924

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1,035

$89.924

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DigiPath Technology Company

USA . 1,035 parts In-Stock

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$89.924

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$89.924

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Corphita

USA . 3,175 parts In-Stock

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3,175

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Parana Technologies

USA . 1,807 parts In-Stock

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$57.177

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$57.177

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Overview

Unlock the power of innovation with the STM32F415VGT7 microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile chip excels in industrial applications, offering advanced performance and seamless connectivity for your projects. With its robust design, exceptional efficiency, and extensive peripherals, it empowers engineers to create reliable, cutting-edge devices. Experience unparalleled value and flexibility as you elevate your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on the PCB.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V suits various low-power applications, improving battery life.

Package Shape: SQUARE

The square package shape provides an organized layout, making it easy to integrate on PCBs.

Bit Size: 32

A 32-bit architecture enhances processing power and supports more complex applications.

DAC Channels: YES

Includes DAC channels for high-quality analog output, making it versatile for embedding audio and signal processing.

Power Supplies (V): 2/3.3

Flexible voltage supply options allow compatibility with a wide range of applications.

No. of Terminals: 100

With 100 terminals, it supports many connections, facilitating complex designs and simultaneous operations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style offers a compact footprint, ideal for space-constrained applications.

Minimum Supply Voltage: 1.8 V

This low minimum supply voltage ensures functionality in low-power and energy-efficient designs.

Maximum Operating Temperature: 105 °C

Capable of operating at high temperatures, making it suitable for industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 core offers advanced processing capabilities and digital signal processing features.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliability in extreme conditions and harsh environments.

ADC Channels: YES

Includes ADC channels, enabling digital representation of analog signals for versatile applications.

DMA Channels: YES

With DMA support, it allows for efficient data transfer without CPU intervention, boosting performance.

Terminal Position: QUAD

Quad terminal configuration enhances connection stability and improves soldering reliability.

ROM Words: 1048576

Offering a large ROM size for extensive program storage, suitable for complex firmware.

Maximum Seated Height: 1.6 mm

Low profile design enables integration into thinner devices while preserving performance.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual 12-bit DACs provide high-resolution analog output, supporting various applications including sound and signal conversion.

Width: 14 mm

Compact width contributes to overall space-saving design in electronic applications.

Peripherals: BOR, CRC, DMA(2), LCD, PWM, RTC, TEMPERATURE SENSOR, TIMER(14), WDT(2)

A rich set of peripherals supports diverse functionalities, reducing the need for additional components.

Maximum Clock Frequency: 26 MHz

A maximum clock frequency of 26 MHz allows for fast processing, suitable for real-time applications.

Length: 14 mm

Maintains a compact size, enhancing suitability for space-limited designs and applications.

Temperature Grade: INDUSTRIAL

Industrial temperature rating guarantees reliability for uses in harsh conditions and environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture delivers efficient performance with reduced power consumption, ideal for embedded systems.

RAM Bytes: 200704

Ample RAM size provides sufficient memory for complex algorithms and data storage capabilities.

Technology: CMOS

CMOS technology ensures low power consumption and high integration density, contributing to energy efficiency.

Terminal Form: GULL WING

Gull wing terminal form is well-suited for automated assembly processes and improves soldering accessibility.

Analog To Digital Convertors: 16-Ch 12-Bit (3)

Three 12-bit ADCs with 16 channels each facilitate accurate readings from multiple sensors and devices.

Maximum Supply Current: 117 mA

Moderate supply current ensures compatibility with battery-operated devices, enhancing battery lifespan.

Nominal Supply Voltage: 3.3 V

3.3 V nominal voltage is standard for most applications, simplifying design and power supply requirements.

PWM Channels: YES

PWM channels support motor control and dimming applications, increasing design versatility.

Connectivity: CAN(2), I2C(3), I2S(2), IRDA, LIN, MMC, PMBUS, SMBUS, SPI(3), UART(2), USART(4), USB(2)

A wide range of connectivity options facilitates flexible integration into various systems and communication protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, increasing product lifespan and adaptability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports fine pitched designs, facilitating high-density layouts.

Speed: 168 rpm

The speed specification indicates suitability for applications requiring precise control and response.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for effective data handling and processing.

No. of I/O Lines: 82

82 I/O lines provide extensive interfacing capabilities, suitable for complex control applications.

Technical Specifications

Microcontrollers STM32F415VGT7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

82

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

200704

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

168 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

117 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), IRDA, LIN, MMC, PMBUS, SMBUS, SPI(3), UART(2), USART(4), USB(2)

Peripherals:

BOR, CRC, DMA(2), LCD, PWM, RTC, TEMPERATURE SENSOR, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit (3)

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F415VGT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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