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STM32F413VHH3

STMicroelectronics

STM32F413VHH3 by STMicroelectronics

STM32F413VHH3 by STMicroelectronics is a 32-bit microcontroller with 26-bit address bus width and 16-Ch 12-Bit ADC. Ideal for automotive applications, it features peripherals like BOR, DMA(2), LCD, PDM, POR, PWM, RTC, TIMER(16), WDT(2) and connectivity options such as CAN(3), I2C(3), SPI(5), UART(6), USB. Operating temperature ranges from -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,604 parts In-Stock

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7,604

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Digiode

USA . 3,117 parts In-Stock

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3,117

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Anansix

USA . 2,314 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 730 parts In-Stock

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$6.563

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730

$6.563

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Corohmni

South Africa . 253 parts In-Stock

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$13.780

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253

$13.780

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Semicontronic

India . 542 parts In-Stock

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$33.000

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$32.175

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$32.010

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542

$33.000

$32.175

$32.010

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Microchip USA

USA . 3,924 parts In-Stock

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$33.245

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$33.245

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Ampacity Inc.

Singapore . 614 parts In-Stock

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$34.000

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614

$34.000

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IDEA Electronic Components Group

UK . 2,222 parts In-Stock

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$49.855

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$44.869

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$49.855

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$44.869

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Aztec Data Supply Inc.

USA . 107 parts In-Stock

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$58.810

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107

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MKK Technologies

India . 1,711 parts In-Stock

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$93.749

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$93.749

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DigiPath Technology Company

USA . 1,711 parts In-Stock

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$93.749

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Argo Parts USA

USA . 4,217 parts In-Stock

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Continental Prestige Electronics

USA . 3,172 parts In-Stock

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Vigor

Singapore . 2,842 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Parana Technologies

USA . 673 parts In-Stock

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$59.609

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Corphita

USA . 624 parts In-Stock

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Overview

Unlock the potential of your next project with the STM32F413VHH3 microcontroller by STMicroelectronics. Boasting top-notch quality and reliability from a trusted manufacturer, this versatile device is perfect for a wide range of applications in automotive, industrial, and consumer electronics. With its advanced features and efficient design, the STM32F413VHH3 offers unmatched value to customers looking to enhance performance and streamline their projects. Say goodbye to limitations and hello to endless possibilities with this powerhouse microcontroller at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a durable and cost-effective package for the microcontroller.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources.

Address Bus Width: 26

The 26-bit address bus width provides a large address space for memory access, making it suitable for complex applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB.

Bit Size: 32

The 32-bit architecture provides high performance and precision for data processing tasks.

DAC Channels: YES

The presence of DAC channels allows for analog signal generation, expanding the capabilities of the microcontroller.

No. of Terminals: 100

Having 100 terminals enables the microcontroller to interface with a variety of external components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a compact design with high terminal density, ideal for space-constrained applications.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage makes this microcontroller energy-efficient and suitable for battery-powered devices.

Technical Specifications

Microcontrollers STM32F413VHH3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of I/O Lines:

81

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

327680

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(3), I2S(5), IRDA, LIN, PMBUS, SAI, SD, SMBUS, SPI(5), UART(6), USART(4), USB

Peripherals:

BOR, DMA(2), LCD, PDM, POR, PWM, RTC, TIMER(16), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F413VHH3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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