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STM32F413RHT3

STMicroelectronics

STM32F413RHT3 by STMicroelectronics

STM32F413RHT3 by STMicroelectronics is a 32-bit microcontroller with 16-Ch 12-Bit ADC and 2-Ch 12-Bit DAC. It operates at up to 26 MHz, suitable for automotive applications with CAN, I2C, SPI connectivity options. The microcontroller features 327680 bytes of RAM and flash ROM programmability for versatile usage in various embedded systems.

Median Price

$13.420

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 644 parts In-Stock

1+ parts

$13.420

100+ parts

$8.610

1k+ parts

$7.150

10k+ parts

-

644

$13.420

$8.610

$7.150

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$11.348

100+ parts

-

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500

$11.348

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Vyrian

USA . 3,661 parts In-Stock

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3,661

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Chip Stock

USA . 2,800 parts In-Stock

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2,800

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Anansix

USA . 1,068 parts In-Stock

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1,068

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Digiode

USA . 1,003 parts In-Stock

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1,003

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,414 parts In-Stock

1+ parts

$6.000

100+ parts

-

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-

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1,414

$6.000

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Vigor

Singapore . 2,364 parts In-Stock

1+ parts

$9.610

100+ parts

-

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2,364

$9.610

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Continental Prestige Electronics

USA . 3,245 parts In-Stock

1+ parts

$11.348

100+ parts

-

1k+ parts

-

10k+ parts

$11.121

3,245

$11.348

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$11.121

Netroflash

USA . 500 parts In-Stock

1+ parts

$11.348

100+ parts

-

1k+ parts

$10.781

10k+ parts

$10.554

500

$11.348

-

$10.781

$10.554

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$11.575

100+ parts

$11.575

1k+ parts

$11.575

10k+ parts

-

500

$11.575

$11.575

$11.575

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AZTECH Wire

Italy . 410 parts In-Stock

1+ parts

$17.070

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410

$17.070

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Microchip USA

USA . 2,324 parts In-Stock

1+ parts

$30.760

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2,324

$30.760

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Semicontronic

India . 1,213 parts In-Stock

1+ parts

$35.000

100+ parts

$34.125

1k+ parts

$33.950

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1,213

$35.000

$34.125

$33.950

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Corohmni

South Africa . 449 parts In-Stock

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$53.438

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449

$53.438

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IDEA Electronic Components Group

UK . 913 parts In-Stock

1+ parts

$67.691

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$60.922

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913

$67.691

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$60.922

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Aztec Data Supply Inc.

USA . 2,359 parts In-Stock

1+ parts

$78.440

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2,359

$78.440

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MKK Technologies

India . 15 parts In-Stock

1+ parts

$127.288

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15

$127.288

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DigiPath Technology Company

USA . 15 parts In-Stock

1+ parts

$127.288

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15

$127.288

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Corphita

USA . 3,595 parts In-Stock

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3,595

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Argo Parts USA

USA . 1,404 parts In-Stock

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1,404

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Parana Technologies

USA . 1,356 parts In-Stock

1+ parts

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$80.935

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1,356

-

$80.935

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Overview

Unlock the power of innovation with the STM32F413RHT3 by STMicroelectronics, a cutting-edge microcontroller designed for a wide range of applications. With a reputation for excellence and quality, STMicroelectronics delivers top-of-the-line products that exceed expectations. This microcontroller offers unparalleled value with its high performance and reliability, making it the perfect choice for automotive and industrial applications. Experience the advantages of seamless connectivity, advanced peripherals, and efficient operation with the STM32F413RHT3. Elevate your projects to new heights with this innovative solution from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers for its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier assembly process.

Maximum Supply Voltage: 3.6 V

This high supply voltage allows for compatibility with a wide range of external components and peripherals.

Address Bus Width: 26

A wider address bus allows for more memory addressing capability and data transfer efficiency.

Bit Size: 32

A 32-bit architecture enables faster processing speed and higher computational capabilities.

DAC Channels: YES

Digital-to-analog converters provide flexibility in interfacing with analog sensors and actuators.

No. of Terminals: 64

A higher number of terminals allows for more connectivity options and expansion possibilities.

Minimum Supply Voltage: 1.7 V

This low minimum supply voltage enables energy-efficient operation and extends battery life.

Maximum Operating Temperature: 125 °C

The high operating temperature range makes this microcontroller suitable for industrial and automotive applications.

ADC Channels: YES

Analog-to-digital converters enable accurate conversion of analog signals for processing by the microcontroller.

DMA Channels: YES

Direct memory access channels improve data transfer speed and efficiency, reducing the load on the CPU.

Terminal Position: QUAD

Quad terminal position allows for more secure and reliable connections in a compact form factor.

ROM Words: 1572864

A large ROM capacity allows for storing complex programs and data, enhancing the microcontroller's functionality.

Maximum Seated Height: 1.6 mm

Low seated height enables thinner and more compact device designs.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual 12-bit DACs provide high-resolution analog output capabilities for precise control of external devices.

Width: 10 mm

Compact width dimension allows for space-saving integration in various applications.

External Data Bus Width: 16

A 16-bit external data bus facilitates fast data transfer between the microcontroller and external memory or peripherals.

Peripherals: BOR, DMA, LCD, PDM, POR, PWM, RTC, TIMER(16), WDT(2)

A wide range of peripherals enhances the microcontroller's versatility and functionality for diverse applications.

Maximum Clock Frequency: 26 MHz

High clock frequency enables fast execution of instructions and efficient operation of the microcontroller.

Length: 10 mm

Compact length dimension allows for space-efficient PCB layout and integration in small form factor devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable performance in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient processing and execution of instructions, ideal for real-time applications.

RAM Bytes: 327680

Large RAM capacity enables efficient data storage and manipulation during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections for stable electrical connections.

Analog To Digital Convertors: 16-Ch 12-Bit

Sixteen 12-bit ADC channels enable simultaneous conversion of multiple analog signals, suitable for multi-sensor applications.

Nominal Supply Voltage: 3.3 V

A stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Pulse width modulation channels allow for precise control of analog devices such as motors and LEDs.

Connectivity: CAN(3), I2C(3), I2S(5), IRDA, LIN, PMBUS, SAI, SD, SMBUS, SPI(5), UART(3), USART(4), USB

Multiple connectivity options enable seamless integration with a variety of communication protocols and devices.

ROM Programmability: FLASH

Flash ROM allows for easy programming and updating of firmware, improving flexibility and scalability.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on PCBs, saving space and improving design efficiency.

Speed: 100 rpm

High processing speed of 100 revolutions per minute ensures fast response times in real-time applications.

On Chip Program ROM Width: 8

An 8-bit on-chip program ROM width provides sufficient capacity for storing essential firmware and program data.

No. of I/O Lines: 50

Fifty I/O lines offer extensive connectivity options for interfacing with external sensors, actuators, and peripherals.

Technical Specifications

Microcontrollers STM32F413RHT3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

50

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

327680

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(3), I2S(5), IRDA, LIN, PMBUS, SAI, SD, SMBUS, SPI(5), UART(3), USART(4), USB

Peripherals:

BOR, DMA, LCD, PDM, POR, PWM, RTC, TIMER(16), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F413RHT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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