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STM32F412ZEJ6

STMicroelectronics

STM32F412ZEJ6 by STMicroelectronics

STM32F412ZEJ6 microcontroller by STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. With industrial-grade temp range (-40 °C to 85 °C), it's ideal for automation and control applications. Its compact design supports various connectivity options like CAN and USB.

Median Price

$9.881

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 351 parts In-Stock

1+ parts

$8.862

100+ parts

-

1k+ parts

-

10k+ parts

$5.138

351

$8.862

-

-

$5.138

Chip1Stop

Japan . 351 parts In-Stock

1+ parts

$10.900

100+ parts

$6.720

1k+ parts

$6.280

10k+ parts

-

351

$10.900

$6.720

$6.280

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Avnet

USA . 336 parts In-Stock

1+ parts

-

100+ parts

-

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336

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Distributors (In-Stock)

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Digiode

USA . 1,841 parts In-Stock

1+ parts

$10.260

100+ parts

-

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1,841

$10.260

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Vyrian

USA . 6,502 parts In-Stock

1+ parts

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6,502

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Anansix

USA . 2,242 parts In-Stock

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2,242

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 9,000 parts In-Stock

1+ parts

$6.720

100+ parts

-

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10k+ parts

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9,000

$6.720

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-

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Corphita

USA . 3,364 parts In-Stock

1+ parts

$9.720

100+ parts

-

1k+ parts

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3,364

$9.720

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AZTECH Wire

Italy . 504 parts In-Stock

1+ parts

$20.440

100+ parts

-

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504

$20.440

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IDEA Electronic Components Group

UK . 676 parts In-Stock

1+ parts

$65.163

100+ parts

-

1k+ parts

$58.646

10k+ parts

-

676

$65.163

-

$58.646

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MKK Technologies

India . 1,862 parts In-Stock

1+ parts

$122.534

100+ parts

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1,862

$122.534

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DigiPath Technology Company

USA . 1,862 parts In-Stock

1+ parts

$122.534

100+ parts

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1,862

$122.534

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QUARKTWIN TECHNOLOGY LTD

USA . 19,119 parts In-Stock

1+ parts

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19,119

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Microchip USA

USA . 2,446 parts In-Stock

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2,446

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Perfect Parts

USA . 1,317 parts In-Stock

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1,317

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Eastek

USA . 336 parts In-Stock

1+ parts

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100+ parts

$9.390

1k+ parts

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336

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$9.390

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Parana Technologies

USA . 292 parts In-Stock

1+ parts

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100+ parts

$77.912

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292

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$77.912

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Overview

Unlock endless possibilities with the STM32F412ZEJ6 microcontroller from STMicroelectronics! Renowned for its exceptional quality and reliability, this powerhouse is designed to elevate your projects—from industrial automation to smart devices. Experience superior performance with low power consumption, ensuring efficient operation in any application. Choose STMicroelectronics for innovative solutions that drive success and transform ideas into reality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material offers durability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient placement on circuit boards, enhancing space efficiency.

Maximum Supply Voltage: 3.6 V

The maximum voltage of 3.6 V ensures compatibility with various power supply systems, making it versatile for different applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows efficient processing of data, optimizing performance for various applications.

Package Shape: SQUARE

A square package shape enables uniform footprint design, facilitating easier integration into different layouts.

Bit Size: 32

The 32-bit architecture enhances computational power, making it suitable for complex applications and processing requirements.

No. of Terminals: 144

With 144 terminals, the product provides extensive connectivity options, ensuring flexibility in interface design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This style allows for high-density integration and minimizes space requirements, which is advantageous in compact designs.

Minimum Supply Voltage: 1.7 V

The low minimum operating voltage supports battery-powered applications and energy-efficient devices.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliable performance in high-temperature environments, making it suitable for industrial uses.

CPU Family: CORTEX-M4

The Cortex-M4 CPU architecture enhances processing capabilities, especially for signal processing and control tasks.

No. of External Interrupts: 16

Having 16 external interrupts allows the microcontroller to respond quickly to various external events, improving responsiveness.

ADC Channels: YES

Integrated ADC channels enable precise analog-to-digital conversions, essential for sensor interfacing.

DMA Channels: YES

With DMA support, this product can manage data transfers autonomously, reducing CPU load and improving efficiency.

Terminal Position: BOTTOM

Bottom-terminal positioning can facilitate better thermal management and electrical performance on the PCB.

ROM Words: 524288

A high ROM memory capacity allows for complex programs and extensive firmware, enhancing the functionality of applications.

Maximum Seated Height: 0.6 mm

The low seated height promotes a sleek design and saves space on PCBs, which is critical for compact devices.

RAM Words: 65536

Having 65,536 words of RAM enables efficient data handling and storage for applications requiring real-time processing.

Width: 10 mm

Compact width ensures minimal footprint on the PCB, enabling the design of small and portable devices.

Boundary Scan: YES

Boundary scan capability allows for easier testing and debugging of the board, streamlining production processes.

Peripherals: BOR, DMA(16), LCD, PDR, POR, PVD, RTC, TIMER(14), WDT

A diverse set of peripherals enhances the microcontroller's adaptability across various applications.

Maximum Clock Frequency: 26 MHz

A clock frequency of 26 MHz supports faster processing speeds, which is advantageous for performance-critical tasks.

Length: 10 mm

The 10 mm length complements the compact design, facilitating easy integration into space-constrained environments.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in harsh environments, extending the product's lifecycle.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances efficiency and performance while ensuring lower power consumption.

No. of Timers: 15

The presence of 15 timers facilitates precise timing operations critical for various applications, including control systems.

RAM Bytes: 262144

With 262,144 bytes of RAM, it can handle larger data sets, making it suitable for advanced processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the product suitable for battery-operated devices.

Terminal Form: BALL

Ball terminal form enhances soldering reliability and improves thermal and electrical performance.

Analog To Digital Convertors: 16-Ch 12-Bit

The 12-bit resolution provides high accuracy in ADC conversions, making it effective for applications requiring precise measurements.

Maximum Supply Current: 42.85 mA

The maximum supply current of 42.85 mA indicates efficient power usage in applications, contributing to battery longevity.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V aligns with common digital logic levels, promoting compatibility with other components.

No. of DMA Channels: 16

With 16 DMA channels, the microcontroller can manage multiple data streams efficiently, enhancing overall system performance.

No. of Serial I/Os: 4

Having 4 serial I/O lines allows for diverse communication protocols, making integration with other devices simpler.

PWM Channels: YES

PWM support enables effective control of motors and other devices, expanding its application in robotics and automation.

Connectivity: CAN(2), I2C(3), I2S(5), MMC, SPI(5), USART(4), USB

Versatile connectivity options ensure compatibility with many devices and peripheral systems, enhancing the microcontroller's utility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, making this microcontroller adaptable to evolving application requirements.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch is optimal for fine-pitch designs, allowing for high-density layouts without compromising performance.

Format: FLOATING POINT

Support for floating point operations enables precise calculations, which is critical in applications such as audio processing and complex algorithms.

Speed: 100 rpm

A speed rating of 100 rpm makes it suitable for applications where moderate speed is required, enhancing performance.

Low Power Mode: YES

Low power mode functionality supports energy-saving applications by minimizing power consumption during inactivity.

On Chip Program ROM Width: 8

The 8-bit ROM width facilitates efficient data handling, which is ideal for smaller control algorithms.

No. of I/O Lines: 114

Having 114 I/O lines provides extensive interfacing capabilities, making this microcontroller highly flexible for various applications.

Technical Specifications

Microcontrollers STM32F412ZEJ6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B144

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

114

No. of Serial I/Os:

4

No. of Terminals:

144

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

262144

RAM Words:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

100 rpm

Maximum Supply Current:

42.85 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(5), MMC, SPI(5), USART(4), USB

Peripherals:

BOR, DMA(16), LCD, PDR, POR, PVD, RTC, TIMER(14), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F412ZEJ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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