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STM32F412VET3TR

STMicroelectronics

STM32F412VET3TR by STMicroelectronics

STM32F412VET3TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 524288 ROM words, and 262144 RAM bytes. It features 16 ADC channels, 16 DMA channels, and operates at a max clock frequency of 26 MHz. Ideal for applications requiring low power mode, such as IoT devices and industrial automation systems.

Median Price

$8.051

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$8.051

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$8.051

-

-

-

Vyrian

USA . 5,832 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,832

-

-

-

-

Digiode

USA . 3,978 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,978

-

-

-

-

Anansix

USA . 2,051 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,051

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,541 parts In-Stock

1+ parts

$7.040

100+ parts

-

1k+ parts

-

10k+ parts

-

1,541

$7.040

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$7.890

100+ parts

-

1k+ parts

$7.575

10k+ parts

-

2,000

$7.890

-

$7.575

-

Continental Prestige Electronics

USA . 6,434 parts In-Stock

1+ parts

$8.051

100+ parts

-

1k+ parts

-

10k+ parts

$7.890

6,434

$8.051

-

-

$7.890

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$8.212

100+ parts

$8.212

1k+ parts

$8.212

10k+ parts

-

600

$8.212

$8.212

$8.212

-

AZTECH Wire

Italy . 691 parts In-Stock

1+ parts

$8.568

100+ parts

-

1k+ parts

-

10k+ parts

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691

$8.568

-

-

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Corohmni

South Africa . 7 parts In-Stock

1+ parts

$8.987

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$8.987

-

-

-

Semicontronic

India . 1,623 parts In-Stock

1+ parts

$12.000

100+ parts

$11.700

1k+ parts

$11.640

10k+ parts

-

1,623

$12.000

$11.700

$11.640

-

Ampacity Inc.

Singapore . 1,256 parts In-Stock

1+ parts

$19.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,256

$19.000

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-

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Aztec Data Supply Inc.

USA . 17,348 parts In-Stock

1+ parts

$20.580

100+ parts

-

1k+ parts

-

10k+ parts

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17,348

$20.580

-

-

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Microchip USA

USA . 2,943 parts In-Stock

1+ parts

$22.540

100+ parts

$22.220

1k+ parts

$22.060

10k+ parts

$21.900

2,943

$22.540

$22.220

$22.060

$21.900

IDEA Electronic Components Group

UK . 592 parts In-Stock

1+ parts

$77.475

100+ parts

-

1k+ parts

$69.728

10k+ parts

-

592

$77.475

-

$69.728

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MKK Technologies

India . 189 parts In-Stock

1+ parts

$145.687

100+ parts

-

1k+ parts

-

10k+ parts

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189

$145.687

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-

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DigiPath Technology Company

USA . 189 parts In-Stock

1+ parts

$145.687

100+ parts

-

1k+ parts

-

10k+ parts

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189

$145.687

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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10,000

-

-

-

-

Argo Parts USA

USA . 3,070 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,070

-

-

-

-

Parana Technologies

USA . 2,017 parts In-Stock

1+ parts

-

100+ parts

$92.633

1k+ parts

-

10k+ parts

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2,017

-

$92.633

-

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Corphita

USA . 385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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385

-

-

-

-

Overview

Unleash the power of innovation with the STM32F412VET3TR by STMicroelectronics. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional value, benefits, and advantages to our customers. Trust in the quality and expertise of STMicroelectronics to bring your designs to life with the STM32F412VET3TR.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This lightweight and durable material ensures the product is easy to handle and long-lasting.

Surface Mount:

YES - Easy installation and compact design make this microcontroller convenient to use in various applications.

Maximum Supply Voltage:

3.6 V - Provides a wide range of voltage input options for flexibility in power supply requirements.

On Chip Data RAM Width:

8 - Efficient data processing with a wide RAM width enhances the performance of the microcontroller.

Package Shape:

SQUARE - The square shape allows for easy mounting and integration into different electronic systems.

Bit Size:

32 - High bit size ensures fast and accurate data processing capabilities for complex applications.

No. of Terminals:

100 - With a high number of terminals, this microcontroller offers ample connectivity options for external components.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - The compact and flat design of the package saves space and allows for dense PCB layouts.

Minimum Supply Voltage:

1.7 V - Operates efficiently at low voltage levels, making it suitable for energy-efficient applications.

Maximum Operating Temperature:

125 °C - Can withstand high temperatures, suitable for industrial environments with elevated heat levels.

CPU Family:

CORTEX-M4 - Comes from a reliable and high-performance CPU family known for its efficiency and processing power.

No. of External Interrupts:

16 - Supports multiple external interrupt sources, enhancing the microcontroller's responsiveness to external events.

Minimum Operating Temperature:

40 °C - Performs reliably even in extreme cold conditions, making it suitable for a wide range of environments.

ADC Channels:

YES - Integrated analog-to-digital converters enable the microcontroller to process analog signals for various applications.

DMA Channels:

YES - Direct Memory Access channels improve data transfer efficiency and reduce CPU load for enhanced performance.

Terminal Position:

QUAD - Quad terminal position provides a stable and secure connection, ensuring reliability in operation.

ROM Words:

524288 - Large ROM capacity allows for storing a significant amount of program data for complex applications.

Maximum Seated Height:

1.6 mm - Low profile design facilitates compact system integration and efficient use of space.

Width:

14 mm - Compact width dimension enables easy installation in space-constrained environments.

Boundary Scan:

YES - Boundary scan capability allows for easy testing and debugging of the microcontroller during development and production stages.

Peripherals:

BOR, DMA(16), LCD, PDR, POR, PVD, RTC, TIMER(14), WDT - A wide range of peripherals enhances the functionality and versatility of the microcontroller for diverse applications.

Maximum Clock Frequency:

26 MHz - Offers high clock frequency for fast processing speeds and real-time operation in demanding applications.

Length:

14 mm - Compact length dimension makes the microcontroller suitable for applications with limited space availability.

Peripheral IC Type:

MICROCONTROLLER, RISC - RISC-based microcontroller architecture delivers efficient performance and low power consumption for energy-efficient applications.

No. of Timers:

15 - Multiple timers enable precise timing control and synchronization in complex applications.

RAM Bytes:

262144 - Generous RAM capacity allows for efficient data storage and retrieval, enhancing overall processing performance.

Technology:

CMOS - Utilizes CMOS technology for low power consumption, high speed, and reliable operation in various applications.

Terminal Form:

GULL WING - Gull-wing terminal form factor provides secure connection and easy soldering during assembly.

Analog To Digital Convertors:

16-Ch 12-Bit - Multiple ADC channels with high resolution enhance analog signal processing for accurate data conversion.

Maximum Supply Current:

46.8 mA - Low supply current consumption ensures energy efficiency and prolonged battery life in portable applications.

Nominal Supply Voltage:

3.3 V - Standard supply voltage rating for compatibility with common power sources in electronic systems.

No. of DMA Channels:

16 - Ample DMA channels improve data transfer efficiency and offload the CPU for optimized performance.

No. of Serial I/Os:

4 - Multiple serial I/O interfaces provide versatile communication options with external devices.

PWM Channels:

YES - Pulse-width modulation support enables precise control of analog output signals for various applications.

Connectivity:

CAN(2), I2C(3), I2S(5), MMC, SPI(5), USART(4), USB - Versatile connectivity options expand the microcontroller's compatibility with diverse communication protocols and peripherals.

ROM Programmability:

FLASH - Flash programmable ROM allows for flexible and convenient updating of firmware and software applications.

Terminal Pitch:

0.5 mm - Fine terminal pitch enables high-density PCB layouts and compact system designs.

Format:

FLOATING POINT - Floating-point format enhances mathematical computation accuracy and performance in numerical applications.

Speed:

100 rpm - Offers high processing speed for real-time operation and rapid data processing in time-sensitive applications.

Low Power Mode:

YES - Low power mode functionality conserves energy consumption and extends battery life in power-sensitive applications.

On Chip Program ROM Width:

8 - Wide ROM width ensures efficient program storage and execution for optimal performance.

No. of I/O Lines:

81 - Abundant I/O lines provide extensive connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32F412VET3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

81

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

262144

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Current:

46.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(5), MMC, SPI(5), USART(4), USB

Peripherals:

BOR, DMA(16), LCD, PDR, POR, PVD, RTC, TIMER(14), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F412VET3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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