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STM32F412RGY6TR

STMicroelectronics

STM32F412RGY6TR by STMicroelectronics

STM32F412RGY6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 16 external interrupts, and 15 timers. It features 16 ADC channels, 16 DMA channels, and CAN, I2C, SPI connectivity. Ideal for industrial applications requiring low power mode and high-speed processing up to 26 MHz.

Median Price

$8.950

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,484 parts In-Stock

1+ parts

$8.950

100+ parts

$5.900

1k+ parts

$5.721

10k+ parts

-

3,484

$8.950

$5.900

$5.721

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,872 parts In-Stock

1+ parts

$8.750

100+ parts

-

1k+ parts

-

10k+ parts

-

4,872

$8.750

-

-

-

Nova Conductors

Japan . 82 parts In-Stock

1+ parts

$9.460

100+ parts

-

1k+ parts

-

10k+ parts

-

82

$9.460

-

-

-

Semtec, LLC

USA . 22,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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22,970

-

-

-

-

Chip Stock

USA . 2,765 parts In-Stock

1+ parts

-

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-

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-

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2,765

-

-

-

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Vyrian

USA . 647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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647

-

-

-

-

Anansix

USA . 253 parts In-Stock

1+ parts

-

100+ parts

-

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-

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253

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12,288 parts In-Stock

1+ parts

$4.620

100+ parts

-

1k+ parts

-

10k+ parts

-

12,288

$4.620

-

-

-

Semicontronic

India . 48 parts In-Stock

1+ parts

$7.830

100+ parts

$7.634

1k+ parts

$7.595

10k+ parts

-

48

$7.830

$7.634

$7.595

-

Corphita

USA . 4,668 parts In-Stock

1+ parts

$8.289

100+ parts

-

1k+ parts

-

10k+ parts

-

4,668

$8.289

-

-

-

Continental Prestige Electronics

USA . 6,929 parts In-Stock

1+ parts

$9.460

100+ parts

-

1k+ parts

-

10k+ parts

$9.271

6,929

$9.460

-

-

$9.271

Netroflash

USA . 50 parts In-Stock

1+ parts

$9.460

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$9.460

-

-

-

Vigor

Singapore . 7,775 parts In-Stock

1+ parts

$10.920

100+ parts

-

1k+ parts

-

10k+ parts

-

7,775

$10.920

-

-

-

AZTECH Wire

Italy . 647 parts In-Stock

1+ parts

$13.416

100+ parts

-

1k+ parts

-

10k+ parts

-

647

$13.416

-

-

-

Aztec Data Supply Inc.

USA . 72 parts In-Stock

1+ parts

$27.360

100+ parts

-

1k+ parts

-

10k+ parts

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72

$27.360

-

-

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Corohmni

South Africa . 201 parts In-Stock

1+ parts

$36.614

100+ parts

-

1k+ parts

-

10k+ parts

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201

$36.614

-

-

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IDEA Electronic Components Group

UK . 456 parts In-Stock

1+ parts

$74.306

100+ parts

-

1k+ parts

$66.875

10k+ parts

-

456

$74.306

-

$66.875

-

MKK Technologies

India . 361 parts In-Stock

1+ parts

$139.727

100+ parts

-

1k+ parts

-

10k+ parts

-

361

$139.727

-

-

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DigiPath Technology Company

USA . 361 parts In-Stock

1+ parts

$139.727

100+ parts

-

1k+ parts

-

10k+ parts

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361

$139.727

-

-

-

iodParts Technologies Inc.

India . 45,000 parts In-Stock

1+ parts

-

100+ parts

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45,000

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-

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Kepictronics

USA . 44,491 parts In-Stock

1+ parts

-

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44,491

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Lixinc

USA . 18,181 parts In-Stock

1+ parts

-

100+ parts

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18,181

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QUARKTWIN TECHNOLOGY LTD

USA . 15,186 parts In-Stock

1+ parts

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15,186

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-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

-

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Component Stockers USA

USA . 9,289 parts In-Stock

1+ parts

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9,289

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Microchip USA

USA . 6,380 parts In-Stock

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6,380

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GreenTree Electronics

Israel . 5,000 parts In-Stock

1+ parts

-

100+ parts

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5,000

-

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Argo Parts USA

USA . 3,552 parts In-Stock

1+ parts

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3,552

-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

-

-

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Parana Technologies

USA . 946 parts In-Stock

1+ parts

-

100+ parts

$88.844

1k+ parts

-

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946

-

$88.844

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Metaverse IC Inc.

Canada . 823 parts In-Stock

1+ parts

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823

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Robosynatics

Brazil . 500 parts In-Stock

1+ parts

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500

-

-

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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500

-

-

-

-

Overview

Discover the STM32F412RGY6TR by STMicroelectronics, a top-tier microcontroller designed for a wide range of applications. With a robust package body material and advanced technology, this device offers unmatched performance and reliability. Boasting a multitude of peripherals and connectivity options, this microcontroller is perfect for industrial-grade projects that demand high-speed processing and low power consumption. Trust STMicroelectronics for cutting-edge solutions that deliver value and efficiency to your next project.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable and lightweight material for long-lasting use.

Surface Mount:

YES - Easy to install and ideal for compact designs.

Maximum Supply Voltage:

3.6 V - Provides flexibility in power supply options.

On Chip Data RAM Width:

8 - Efficient data processing capabilities for faster performance.

Package Shape:

RECTANGULAR - Easy to integrate into various electronic devices.

Bit Size:

32 - High processing power for handling complex tasks.

No. of Terminals:

64 - Sufficient connectivity options for a range of applications.

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - Space-saving design for smaller devices.

Minimum Supply Voltage:

1.7 V - Allows for low power operation and energy efficiency.

Maximum Operating Temperature:

85 °C - Reliable operation even in high-temperature environments.

CPU Family:

CORTEX-M4 - Advanced processor technology for enhanced performance.

No. of External Interrupts:

16 - Enables efficient handling of external events and signals.

Minimum Operating Temperature:

40 °C - Suitable for use in extreme cold conditions.

ADC Channels:

YES - Ability to convert analog signals for digital processing.

DMA Channels:

YES - Efficient data transfer capabilities for improved performance.

Terminal Position:

BOTTOM - Convenient terminal placement for easy PCB routing.

ROM Words:

1048576 - Large memory capacity for storing program data.

Maximum Seated Height:

0.585 mm - Slim profile for compact device designs.

RAM Words:

65536 - Sufficient memory for data storage and processing.

Width:

3.623 mm - Compact size for space-constrained applications.

Boundary Scan:

YES - Built-in diagnostics for improved testing and debugging.

Peripherals:

BOR, DMA(16), LCD, PDR, POR, PVD, RTC, TIMER(14), WDT - Wide range of integrated peripherals for versatile functionality.

Maximum Clock Frequency:

26 MHz - High clock speed for rapid data processing.

Peak Reflow Temperature °C:

260 - Resistant to high-temperature soldering processes.

Length:

3.651 mm - Compact form factor for integration into small devices.

Temperature Grade:

INDUSTRIAL - Suitable for industrial operating environments.

Peripheral IC Type:

MICROCONTROLLER, RISC - Advanced controller technology for efficient operation.

No. of Timers:

15 - Multiple timer options for time-sensitive applications.

RAM Bytes:

262144 - Ample memory space for data storage and processing.

Technology:

CMOS - Reliable and low-power consumption technology.

Terminal Form:

BALL - Secure terminal connection for stable operation.

Analog To Digital Convertors:

16-Ch 12-Bit - High-resolution ADC for accurate analog signal conversion.

Maximum Supply Current:

42.85 mA - Efficient power usage for energy-saving operation.

Nominal Supply Voltage:

3.3 V - Standard voltage option for compatibility with various systems.

No. of DMA Channels:

16 - Multiple DMA channels for efficient data transfer.

No. of Serial I/Os:

4 - Sufficient communication ports for external connectivity.

PWM Channels:

YES - Precise control of output signals for various applications.

Connectivity:

CAN(2), I2C(3), I2S(5), MMC, SPI(5), USART(4), USB - Wide range of connectivity options for versatile interfacing.

ROM Programmability:

FLASH - Easy reprogrammability for firmware updates.

Terminal Pitch:

0.4 mm - Fine pitch for high-density PCB designs.

Format:

FLOATING POINT - Support for floating-point arithmetic for advanced calculations.

Speed:

100 rpm - Fast data processing capabilities for quick response times.

Low Power Mode:

YES - Energy-saving mode for extended battery life.

On Chip Program ROM Width:

8 - Efficient program storage for quick access.

No. of I/O Lines:

50 - Versatile I/O options for flexible connectivity.

Technical Specifications

Microcontrollers STM32F412RGY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

POWER-DOWN MODE

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B64

Length:

3.651 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

50

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

65536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

100 rpm

Maximum Supply Current:

42.85 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

3.623 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(5), MMC, SPI(5), USART(4), USB

Peripherals:

BOR, DMA(16), LCD, PDR, POR, PVD, RTC, TIMER(14), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F412RGY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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