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STM32F411VCH6

STMicroelectronics

STM32F411VCH6 by STMicroelectronics

STM32F411VCH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 262144 ROM words, and 16 ADC channels. Ideal for industrial applications requiring high-speed processing, it features 16 external interrupts and low power mode for efficient operation at temperatures ranging from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 1,664 parts In-Stock

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1,664

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Digiode

USA . 4,516 parts In-Stock

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4,516

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Vyrian

USA . 2,271 parts In-Stock

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2,271

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Bristol Electronics

USA . 1,438 parts In-Stock

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1,438

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Anansix

USA . 476 parts In-Stock

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476

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Distributors (Availability)

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Vigor

Singapore . 1,671 parts In-Stock

1+ parts

$4.660

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-

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1,671

$4.660

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Microchip USA

USA . 3,682 parts In-Stock

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$14.934

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3,682

$14.934

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AZTECH Wire

Italy . 1,005 parts In-Stock

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$15.900

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1,005

$15.900

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IDEA Electronic Components Group

UK . 447 parts In-Stock

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$30.865

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-

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$27.779

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447

$30.865

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$27.779

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MKK Technologies

India . 978 parts In-Stock

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$58.040

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978

$58.040

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DigiPath Technology Company

USA . 978 parts In-Stock

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$58.040

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978

$58.040

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kepictronics

USA . 2,131 parts In-Stock

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Eastek

USA . 1,664 parts In-Stock

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$6.510

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$6.510

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Corphita

USA . 1,332 parts In-Stock

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Parana Technologies

USA . 1,050 parts In-Stock

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$36.904

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1,050

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$36.904

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Overview

Discover the STM32F411VCH6 microcontroller by STMicroelectronics, a top-tier manufacturer known for cutting-edge technology and reliability. Ideal for a wide range of applications, this high-quality product offers unparalleled value to customers. With advanced features like low power mode, connectivity options, and a wide array of peripherals, this microcontroller provides endless possibilities for your projects. Trust STMicroelectronics for superior performance and innovation in every application. Elevate your designs with the STM32F411VCH6 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in power requirements.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and storage on the chip.

Package Shape: SQUARE

Square package shape helps in optimizing space utilization on the circuit board.

Bit Size: 32

32-bit architecture provides high computational performance and precision.

No. of Terminals: 100

Ample number of terminals for connectivity with external components and devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch enables compact and efficient design layouts.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

CPU Family: CORTEX-M4

Belonging to the Cortex-M4 family ensures high performance and reliability in processing tasks.

No. of External Interrupts: 16

Multiple external interrupts allow for responsive handling of events and signals from external sources.

Minimum Operating Temperature: -40 °C

Operates reliably even in low-temperature environments.

ADC Channels: YES

Built-in Analog to Digital Converters enable easy interfacing with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency and performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and soldering during assembly.

ROM Words: 262144

Large ROM capacity for storing program code and data.

Maximum Seated Height: 0.6 mm

Low seated height enables compact and slim device designs.

RAM Words: 65536

Sufficient RAM capacity for data processing and storage requirements.

Width: 7 mm

Compact width size ideal for space-constrained applications.

Boundary Scan: YES

Boundary scan feature aids in testing and debugging during manufacturing and maintenance.

Peripherals: BOR; POR; PVD; RTC; TIMER(9); WDT(2)

Various built-in peripherals enhance functionality and support for diverse applications.

Maximum Clock Frequency: 26 MHz

High clock frequency enables fast processing and operation speed.

Length: 7 mm

Optimal length size for compact and efficient PCB design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature performance for rugged and demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture microcontroller for efficient and high-speed processing.

RAM Bytes: 131072

Generous RAM size for data storage and manipulation tasks.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form facilitates reliable and secure connections during assembly.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple ADC channels with high precision resolution for accurate analog signal conversion.

Maximum Supply Current: 34.5 mA

Efficient supply current consumption for power optimization.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent and reliable operation.

PWM Channels: YES

Pulse Width Modulation channels for precise control of digital signals and power.

Connectivity: I2C(3); I2S(5); SDIO, SPI(5); USART(3); USB

Versatile connectivity options for interfacing with various communication protocols and devices.

ROM Programmability: FLASH

Flash programmable ROM for flexible and easy firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact PCB layout and high-density integration.

Format: FLOATING POINT

Floating-point format for accurate numerical calculations and processing.

Speed: 100 rpm

High speed capability for rapid data processing and real-time operations.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 8

Wide on-chip program ROM width for efficient program storage and execution.

No. of I/O Lines: 81

Sufficient number of I/O lines for flexible interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32F411VCH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

Low Power Mode:

YES

No. of External Interrupts:

16

No. of I/O Lines:

81

No. of Terminals:

100

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

131072

RAM Words:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

100 rpm

Maximum Supply Current:

34.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3); I2S(5); SDIO, SPI(5); USART(3); USB

Peripherals:

BOR; POR; PVD; RTC; TIMER(9); WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F411VCH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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