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STM32F410CBU3TR

STMicroelectronics

STM32F410CBU3TR by STMicroelectronics

STM32F410CBU3TR by STMicroelectronics is a 32-bit microcontroller with 36 I/O lines, 26 MHz clock frequency, and ADC/DMA channels. Ideal for applications requiring high-speed processing and precise analog-to-digital conversion in compact designs.

Median Price

$2.128

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 27,500 parts In-Stock

1+ parts

-

100+ parts

-

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-

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$2.950

27,500

-

-

-

$2.950

Arrow

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.128

25,000

-

-

-

$2.128

Verical

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.128

25,000

-

-

-

$2.128

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,094 parts In-Stock

1+ parts

-

100+ parts

-

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8,094

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-

-

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Digiode

USA . 2,144 parts In-Stock

1+ parts

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1k+ parts

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2,144

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Anansix

USA . 554 parts In-Stock

1+ parts

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554

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

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50

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 17,656 parts In-Stock

1+ parts

$2.140

100+ parts

-

1k+ parts

-

10k+ parts

-

17,656

$2.140

-

-

-

Vigor

Singapore . 3,000 parts In-Stock

1+ parts

$3.020

100+ parts

-

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-

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-

3,000

$3.020

-

-

-

AZTECH Wire

Italy . 513 parts In-Stock

1+ parts

$8.190

100+ parts

-

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-

513

$8.190

-

-

-

Microchip USA

USA . 4,443 parts In-Stock

1+ parts

$22.430

100+ parts

$22.300

1k+ parts

$22.230

10k+ parts

$22.160

4,443

$22.430

$22.300

$22.230

$22.160

IDEA Electronic Components Group

UK . 202 parts In-Stock

1+ parts

$36.544

100+ parts

-

1k+ parts

$32.890

10k+ parts

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202

$36.544

-

$32.890

-

MKK Technologies

India . 57 parts In-Stock

1+ parts

$68.719

100+ parts

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57

$68.719

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DigiPath Technology Company

USA . 57 parts In-Stock

1+ parts

$68.719

100+ parts

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57

$68.719

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Continental Prestige Electronics

USA . 4,192 parts In-Stock

1+ parts

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4,192

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Argo Parts USA

USA . 3,413 parts In-Stock

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3,413

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Corphita

USA . 2,873 parts In-Stock

1+ parts

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2,873

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Parana Technologies

USA . 2,271 parts In-Stock

1+ parts

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100+ parts

$43.694

1k+ parts

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2,271

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$43.694

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Aranea Global

USA . 500 parts In-Stock

1+ parts

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500

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Overview

Unlock the power of innovation with the STM32F410CBU3TR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality microcontrollers that set new standards for performance and reliability. Ideal for a wide range of applications, this chip carrier microcontroller offers customers unmatched value and benefits. With features such as ADC channels, DMA channels, and PWM channels, the STM32F410CBU3TR provides the perfect solution for your next project. Trust STMicroelectronics to bring your ideas to life with cutting-edge technology and exceptional quality.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller suitable for mass production.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, ensuring compatibility with a wide range of systems.

Package Shape: SQUARE

Square package shape provides a compact footprint, ideal for space-constrained applications.

Bit Size: 32

32-bit architecture offers enhanced performance and capabilities compared to lower bit sizes.

No. of Terminals: 48

Higher number of terminals allows for versatile connectivity options and integration with various components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in thermal management and physical mounting, catering to specific application requirements.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage enables efficient power consumption, making it suitable for battery-powered devices.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, expanding the range of sensor and input options.

DMA Channels: YES

Support for DMA channels improves data transfer efficiency, suitable for high-speed data processing applications.

Terminal Position: QUAD

Quad terminal position facilitates secure and reliable connections, reducing the risk of connectivity issues.

Width: 7 mm

Compact width dimension allows for easy integration into space-constrained designs, maximizing PCB layout efficiency.

Maximum Clock Frequency: 26 MHz

High clock frequency enables fast processing speed, suitable for real-time applications and demanding computational tasks.

Length: 7 mm

Short length dimension contributes to overall compact form factor, facilitating design flexibility and space optimization.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture offers optimized performance, energy efficiency, and ease of programming.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high noise immunity, enhancing overall system reliability.

Terminal Form: NO LEAD

No-lead terminal form improves solder joint reliability and thermal performance, ensuring long-term durability and robustness.

Nominal Supply Voltage: 3 V

Standard nominal supply voltage simplifies power management and compatibility with common power sources.

PWM Channels: YES

Integrated PWM channels enable precise control of analog output signals, essential for motor control, lighting, and other applications requiring pulse-width modulation.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density interconnects, supporting complex PCB layouts and miniaturization.

Speed: 100 rpm

High speed capability enhances overall system performance, ideal for applications requiring rapid data processing and response times.

No. of I/O Lines: 36

Abundance of I/O lines offers extensive interfacing possibilities, enabling versatile connectivity with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers STM32F410CBU3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

36

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

100 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F410CBU3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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