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STM32F410C8U7TR

STMicroelectronics

STM32F410C8U7TR by STMicroelectronics

STM32F410C8U7TR microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and includes 10 ADC channels. With industrial-grade temp range (-40 °C to 105 °C), it's ideal for automation and IoT applications. Its compact design supports various connectivity options like I2C and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,786 parts In-Stock

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4,786

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Digiode

USA . 2,986 parts In-Stock

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Anansix

USA . 1,809 parts In-Stock

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AZTECH Wire

Italy . 786 parts In-Stock

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$10.910

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786

$10.910

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IDEA Electronic Components Group

UK . 359 parts In-Stock

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$22.008

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$19.807

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359

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MKK Technologies

India . 143 parts In-Stock

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$41.385

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143

$41.385

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DigiPath Technology Company

USA . 143 parts In-Stock

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$41.385

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143

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Microchip USA

USA . 6,688 parts In-Stock

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Corphita

USA . 3,745 parts In-Stock

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Parana Technologies

USA . 919 parts In-Stock

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$26.314

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Overview

Unlock the potential of your next project with the STM32F410C8U7TR microcontroller from STMicroelectronics! Renowned for its exceptional quality and reliability, this versatile component offers robust performance across various applications—from industrial automation to IoT devices. Enjoy the benefits of integrated DAC and ADC channels, power efficiency, and a compact design, all while leveraging ST’s commitment to innovation and excellence. Elevate your designs with confidence!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact and efficient circuit board layout, making integration into various applications convenient.

Maximum Supply Voltage: 3.6 V

Matches typical digital circuit supply levels, ensuring compatibility with widespread components and systems.

Package Shape: SQUARE

A square package optimizes board space, enabling more flexible designs and layouts.

Bit Size: 32

With a 32-bit architecture, this microcontroller ensures high processing power and performance for demanding applications.

DAC Channels: YES

The presence of Digital-to-Analog Conversion channels allows for precise analog signal generation, enhancing application capabilities.

No. of Terminals: 48

A higher number of terminals provide more input/output options, allowing for complex design implementations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package design facilitates efficient thermal management and minimizes space used, leading to better reliability.

Minimum Supply Voltage: 1.7 V

Lower supply voltage operation makes this microcontroller suitable for battery-powered and energy-efficient designs.

Maximum Operating Temperature: 105 °C

Designed for high temperature environments, this microcontroller is ideal for industrial applications.

Minimum Operating Temperature: -40 °C

Its wide temperature range enhances reliability for outdoor and harsh environment applications.

ADC Channels: YES

With built-in Analog-to-Digital Conversion channels, it can accurately measure real-world signals, perfect for monitoring applications.

DMA Channels: YES

Direct Memory Access support allows for efficient data transfer without CPU intervention, improving performance.

Terminal Position: QUAD

Quad terminal position ensures easier mounting and better connectivity on a circuit board.

ROM Words: 65536

Offers ample program space for complex applications, allowing for extensive code bases.

Maximum Seated Height: 0.65 mm

Very low seated height enables space-saving designs and easier assembly for compact applications.

Digital To Analog Converters: 1-Ch 12-Bit

A 12-bit DAC provides high resolution for more precise analog output, beneficial for sound and control applications.

Width: 7 mm

A compact width facilitates design flexibility in various applications, fitting easily into tight spaces.

Peripherals: BOR, CRC, DMA(16), PDR, POR, PVD, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

A rich set of peripherals enhances the microcontroller's functionality, catering to diverse application needs.

Maximum Clock Frequency: 26 MHz

Higher clock frequency translates to improved processing speed, boosting application responsiveness.

Length: 7 mm

Compact length keeps the design neat and helps in creating smaller devices.

Temperature Grade: INDUSTRIAL

Industrial grade ensures better durability and reliability in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficiency and performance, making it ideal for embedded applications.

RAM Bytes: 32768

Sufficient RAM size supports larger data handling and multitasking within applications.

Technology: CMOS

CMOS technology ensures low power consumption and high density, enhancing overall performance.

Terminal Form: NO LEAD

No-lead terminals contribute to a reduction in the footprint of the chip, facilitating denser designs.

Analog To Digital Converters: 10-Ch 12-Bit

With 10 channels for ADC, multiple sensor readings can be captured simultaneously, enabling complex data acquisition.

Nominal Supply Voltage: 3.3 V

Standard supply voltage enhances compatibility with other components in low-power systems.

PWM Channels: YES

PWM capability is essential for motor control, lighting, and other applications requiring signal modulation.

Connectivity: I2C(3), I2S(3), IRDA, LIN, SPI(3), USART(3)

Diverse connectivity options improve integration with other devices and systems, enhancing overall functionality.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, making the product adaptable to changing requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables dense component placement on PCB, optimizing board layout and design.

Speed: 100 rpm

Speeds of 100 rpm indicate compatibility with low-speed motor applications, suitable for various control tasks.

On Chip Program ROM Width: 8

An 8-bit program ROM width increases processing capability, allowing for efficient code execution.

No. of I/O Lines: 36

A substantial number of I/O lines facilitates multiple connections to peripherals, enhancing design versatility.

Technical Specifications

Microcontrollers STM32F410C8U7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of I/O Lines:

36

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

32768

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.65 mm

Speed:

100 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), I2S(3), IRDA, LIN, SPI(3), USART(3)

Peripherals:

BOR, CRC, DMA(16), PDR, POR, PVD, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32F410C8U7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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