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STM32F401CBY6TR

STMicroelectronics

STM32F401CBY6TR by STMicroelectronics

STM32F401CBY6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4F CPU, 131072 ROM words, and 65536 RAM bytes. It operates at a max clock frequency of 26 MHz and has connectivity options like I2C, SPI, USART, and USB. Ideal for industrial applications requiring high-speed processing and multiple peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,757 parts In-Stock

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5,757

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Digiode

USA . 2,987 parts In-Stock

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2,987

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Anansix

USA . 1,464 parts In-Stock

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1,464

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 909 parts In-Stock

1+ parts

$14.122

100+ parts

-

1k+ parts

$12.710

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909

$14.122

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$12.710

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AZTECH Wire

Italy . 1,021 parts In-Stock

1+ parts

$20.950

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-

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1,021

$20.950

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MKK Technologies

India . 2,076 parts In-Stock

1+ parts

$26.556

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2,076

$26.556

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DigiPath Technology Company

USA . 2,076 parts In-Stock

1+ parts

$26.556

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2,076

$26.556

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QUARKTWIN TECHNOLOGY LTD

USA . 16,575 parts In-Stock

1+ parts

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16,575

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Microchip USA

USA . 3,519 parts In-Stock

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3,519

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Vigor

Singapore . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 2,332 parts In-Stock

1+ parts

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$16.885

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2,332

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$16.885

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Corphita

USA . 424 parts In-Stock

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424

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Overview

Unlock endless possibilities with the STM32F401CBY6TR by STMicroelectronics. Crafted with precision and cutting-edge technology, this microcontroller offers unparalleled performance and reliability. From industrial automation to consumer electronics, this versatile device empowers you to bring your ideas to life with ease. Experience seamless connectivity, advanced peripherals, and efficient power management in a compact package. Trust STMicroelectronics for superior quality and innovation. Elevate your projects with the STM32F401CBY6TR and unleash your creativity today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of supply voltage inputs, increasing flexibility in design and operation.

Package Shape: SQUARE

Helps in efficient placement of the microcontroller on the circuit board, optimizing space and layout.

Bit Size: 32

Provides high processing capability and performance for complex computations and tasks.

Power Supplies (V): 1.8/3.3

Supports multiple power supply options, allowing compatibility with different external devices and systems.

No. of Terminals: 49

Offers a sufficient number of terminals for connecting external components and peripherals to the microcontroller.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables a compact and slim design, ideal for space-constrained applications and devices.

Minimum Supply Voltage: 1.7 V

Allows for operation at low supply voltages, conserving power and reducing energy consumption.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in high-temperature environments, making it suitable for industrial applications.

CPU Family: CORTEX-M4F

Features a high-performance Cortex-M4F processor for efficient and powerful computing capabilities.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in low-temperature conditions, suitable for a wide range of operating environments.

ADC Channels: YES

Includes analog-to-digital converter channels for accurate and efficient conversion of analog signals, enabling sensor interfacing and data acquisition.

DMA Channels: YES

Supports direct memory access channels for fast and efficient data transfer, improving system performance and response time.

Terminal Position: BOTTOM

Facilitates easy access and soldering of terminals during assembly, enhancing the overall manufacturing process.

ROM Words: 131072

Includes a large ROM memory capacity for storing program instructions and data, enabling complex applications and functions.

Maximum Seated Height: 0.585 mm

Provides a low-profile design for slim and compact devices, suitable for applications with space constraints.

Width: 2.965 mm

Compact width size for easy integration into various electronic systems and devices.

Peripherals: BOD, DMA(2), POR, TIMER(11)

Offers a range of peripherals including Brown-Out Detection, Direct Memory Access, Power-On Reset, and Timers for enhanced functionality and performance.

Maximum Clock Frequency: 26 MHz

Operates at a high clock frequency for efficient and quick processing of instructions, improving overall system performance.

Length: 2.965 mm

Compact length size for versatile placement and integration into electronic systems and devices.

Temperature Grade: INDUSTRIAL

Meets industrial temperature standards for reliable operation in harsh environmental conditions, suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Features a microcontroller with Reduced Instruction Set Computing architecture for optimized performance and efficiency.

RAM Bytes: 65536

Includes a large RAM memory capacity for temporary data storage and processing, enabling multitasking and complex computations.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high speed, and reliable operation, ideal for battery-powered and high-performance applications.

Terminal Form: BALL

Uses ball terminal form for secure and reliable connections, ensuring stability and robustness in electronic assemblies.

Analog To Digital Convertors: 10-Ch 12-Bit

Includes multiple analog-to-digital converters with high resolution for accurate and precise analog signal conversion.

Nominal Supply Voltage: 3.3 V

Utilizes a standard nominal supply voltage for compatibility with common power sources and external devices.

PWM Channels: YES

Features pulse-width modulation channels for precise control of analog signals and devices, enabling motor control and power management.

Connectivity: I2C(3), I2S(2), IRDA, LIN, SPI(3), USART(3), USB

Provides a variety of connectivity options including I2C, I2S, IRDA, LIN, SPI, USART, and USB for versatile communication and interfacing capabilities.

ROM Programmability: FLASH

Utilizes flash memory for programmability, allowing for easy and convenient updating of software and firmware.

Terminal Pitch: 0.4 mm

Utilizes a small terminal pitch for compact design and layout, suitable for miniaturized electronic systems and devices.

Speed: 84 rpm

Operates at a high speed of 84 revolutions per minute for efficient processing and operation, suitable for time-sensitive applications.

On Chip Program ROM Width: 8

Features an on-chip program ROM width of 8 bits for storing program instructions and data, enabling efficient program execution.

No. of I/O Lines: 36

Provides a sufficient number of input/output lines for connecting external devices and peripherals, enabling versatile interfacing and communication.

Technical Specifications

Microcontrollers STM32F401CBY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

26 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B49

Length:

2.965 mm

No. of I/O Lines:

36

No. of Terminals:

49

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

84 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.965 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), I2S(2), IRDA, LIN, SPI(3), USART(3), USB

Peripherals:

BOD, DMA(2), POR, TIMER(11)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32F401CBY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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