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STM32F378RCT6

STMicroelectronics

STM32F378RCT6 by STMicroelectronics

STM32F378RCT6 microcontroller from STMicroelectronics features a 32-bit architecture, operates at a nominal voltage of 1.8V, and supports up to 51 I/O lines. With a max clock frequency of 32 MHz and integrated ADC/DMA channels, it's ideal for embedded applications. Its compact FLATPACK design ensures efficient space utilization in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,306 parts In-Stock

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8,306

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Anansix

USA . 1,869 parts In-Stock

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1,869

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Pegasus Components GmbH

Germany . 960 parts In-Stock

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960

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Digiode

USA . 841 parts In-Stock

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841

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Distributors (Availability)

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Vigor

Singapore . 4,000 parts In-Stock

1+ parts

$4.530

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4,000

$4.530

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Microchip USA

USA . 4,192 parts In-Stock

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$14.885

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4,192

$14.885

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IDEA Electronic Components Group

UK . 2,044 parts In-Stock

1+ parts

$16.649

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$14.984

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2,044

$16.649

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$14.984

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AZTECH Wire

Italy . 1,007 parts In-Stock

1+ parts

$18.440

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1,007

$18.440

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MKK Technologies

India . 446 parts In-Stock

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$31.308

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446

$31.308

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DigiPath Technology Company

USA . 446 parts In-Stock

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$31.308

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446

$31.308

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Component Stockers USA

USA . 538 parts In-Stock

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$69.790

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538

$69.790

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Parana Technologies

USA . 1,125 parts In-Stock

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$19.907

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1,125

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$19.907

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Perfect Parts

USA . 896 parts In-Stock

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896

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Corphita

USA . 839 parts In-Stock

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839

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Overview

Unlock endless possibilities with the STM32F378RCT6 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for efficiency and versatility, this powerhouse excels in applications ranging from IoT devices to industrial automation, ensuring seamless performance with low power consumption. With its robust features and superior reliability, the STM32F378RCT6 empowers engineers to create cutting-edge solutions that drive success and enhance user experiences, making it the smart choice for your next project.

Feature Benefit Bullets

Surface Mount: YES

This surface mount design allows for compact and efficient PCB layouts, making it ideal for space-constrained applications.

Maximum Supply Voltage: 1.95 V

The low maximum supply voltage increases safety and energy efficiency, reducing the risk of overheating in delicate electronic applications.

Package Shape: SQUARE

The square package shape promotes ease of mounting and improves thermal management, which is essential for high-performance microcontroller applications.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and processes efficiently, making it suitable for advanced applications.

No. of Terminals: 64

A higher number of terminals allows for greater connectivity options, facilitating more extensive interfacing with other components and devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This low-profile package style is advantageous for designs requiring limited vertical space, supporting more compact device designs.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage provides flexibility in power sourcing and can extend battery life in portable applications.

ADC Channels: YES

The inclusion of ADC channels allows for direct sensor interfacing, which is critical in data acquisition applications, enhancing the microcontroller's versatility.

DMA Channels: YES

DMA channels facilitate efficient data transfer without CPU intervention, improving overall system performance, particularly in high-throughput scenarios.

Terminal Position: QUAD

The quad terminal position enhances soldering reliability and improves thermal performance, which is vital for robust electronic designs.

Width: 10 mm

The compact width allows for easy integration into devices with size constraints, making the microcontroller suitable for space-limited applications.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz supports fast processing speeds, enabling the execution of complex tasks more efficiently.

Length: 10 mm

The small length contributes to the overall compact design of electronic devices, particularly beneficial in portable and embedded applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances processing efficiency and performance, making this microcontroller suitable for high-speed applications.

Terminal Form: GULL WING

The gull wing terminal form offers ease of soldering, improving assembly time and reliability in manufacturing processes.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8 V helps reduce power consumption, making it suitable for battery-powered or energy-sensitive applications.

PWM Channels: YES

PWM channels enable control of motors and dimming of LEDs, providing flexibility for a wide range of control applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density performance in compact spaces, which is crucial for modern circuit design.

Speed: 72 rpm

This speed specification suggests suitability for applications where moderate motion control is necessary, contributing to a diversity of use cases.

No. of I/O Lines: 51

A high number of I/O lines allows for extensive interfacing capabilities with various peripherals, enhancing the microcontroller's functionality in diverse applications.

Technical Specifications

Microcontrollers STM32F378RCT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

51

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

72 rpm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32F378RCT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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