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STM32F372VBT6

STMicroelectronics

STM32F372VBT6 by STMicroelectronics

STM32F372VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4F CPU, 131072 ROM words, and 24576 RAM bytes. It operates b/w -40 to 85 °C and has a max supply current of 75.7 mA. Ideal for industrial applications requiring high-speed processing in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,501 parts In-Stock

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4,501

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Anansix

USA . 2,648 parts In-Stock

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2,648

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Digiode

USA . 1,015 parts In-Stock

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1,015

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Flip Electronics

USA . 750 parts In-Stock

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750

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$6.450

100+ parts

-

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2,000

$6.450

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AZTECH Wire

Italy . 765 parts In-Stock

1+ parts

$13.870

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765

$13.870

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Microchip USA

USA . 148 parts In-Stock

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$37.758

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148

$37.758

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IDEA Electronic Components Group

UK . 1,556 parts In-Stock

1+ parts

$47.472

100+ parts

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$42.725

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1,556

$47.472

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$42.725

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MKK Technologies

India . 350 parts In-Stock

1+ parts

$89.268

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350

$89.268

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DigiPath Technology Company

USA . 350 parts In-Stock

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$89.268

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350

$89.268

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Corphita

USA . 2,235 parts In-Stock

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2,235

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 834 parts In-Stock

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834

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GreenTree Electronics

Israel . 745 parts In-Stock

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745

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Parana Technologies

USA . 64 parts In-Stock

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$56.760

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64

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$56.760

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Overview

Unleash the power of innovation with the STM32F372VBT6 microcontroller by STMicroelectronics. This cutting-edge device offers unparalleled quality and reliability, backed by the reputable manufacturer's expertise in the field. Ideal for a wide range of applications, this versatile microcontroller delivers exceptional value, performance, and efficiency to customers. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, the STM32F372VBT6 ensures seamless operation and optimal results. Elevate your projects with this advanced microcontroller and experience the difference it makes in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection to the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Being surface mountable makes it easier to integrate this microcontroller into electronic devices, saving space and allowing for more compact designs.

Bit Size: 32

The 32-bit architecture allows for faster processing and more complex operations, making this microcontroller suitable for demanding applications.

Power Supplies (V): 2.5/3.3

Having multiple power supply options provides flexibility in powering the microcontroller, allowing for compatibility with different voltage systems.

No. of Terminals: 100

With a high number of terminals, this microcontroller offers a wide range of input/output options, making it versatile for various connectivity needs.

Package Style (Meter): FLATPACK

The flatpack package style allows for easy mounting and handling of the microcontroller, simplifying the assembly process.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85 °C ensures reliable performance in challenging thermal conditions.

CPU Family: CORTEX-M4F

Being part of the Cortex-M4F CPU family, this microcontroller offers advanced processing capabilities and features for efficient performance.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40 °C, this microcontroller can function reliably in cold environments or during temperature fluctuations.

ROM Words: 131072

The large ROM capacity of 131072 words allows for storing a significant amount of program data, enabling more complex applications to be run on this microcontroller.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures that this microcontroller is suitable for use in harsh industrial environments where temperature variations are common.

RAM Bytes: 24576

The generous RAM size of 24576 bytes allows for efficient data processing and storage, supporting multitasking and high-performance applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, making this microcontroller energy-efficient and responsive.

Terminal Form: GULL WING

The gull wing terminal form factor facilitates easy soldering and reliable connection to the PCB, ensuring a secure and stable electrical interface.

Maximum Supply Current: 75.7 mA

The maximum supply current of 75.7 mA ensures that the microcontroller can operate within safe power limits, preventing overheating or damage.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and quick reprogramming of the microcontroller, enabling flexibility in updating firmware and software as needed.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this microcontroller offers precise and compact terminal spacing for efficient PCB layout and design.

Speed: 72 rpm

With a speed rating of 72 rpm, this microcontroller can execute instructions and process data quickly, supporting rapid response times in applications.

Technical Specifications

Microcontrollers STM32F372VBT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M4F

JESD-30 Code:

S-PQFP-G100

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

75.7 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STM32F372VBT6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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