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STM32F372V8T6

STMicroelectronics

STM32F372V8T6 by STMicroelectronics

STM32F372V8T6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4F CPU, 65536 ROM words, and 16384 RAM bytes. It operates b/w -40 to 85 °C, suitable for industrial applications requiring high-speed processing at 72 rpm. The package style is flatpack with gull wing terminals in a square shape, making it ideal for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,795 parts In-Stock

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10,795

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Digiode

USA . 4,624 parts In-Stock

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4,624

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Anansix

USA . 1,751 parts In-Stock

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Flip Electronics

USA . 400 parts In-Stock

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400

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Vigor

Singapore . 5,466 parts In-Stock

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$6.070

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5,466

$6.070

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Microchip USA

USA . 153 parts In-Stock

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$8.376

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153

$8.376

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AZTECH Wire

Italy . 1,113 parts In-Stock

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$13.130

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1,113

$13.130

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IDEA Electronic Components Group

UK . 803 parts In-Stock

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$17.398

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$15.658

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803

$17.398

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$15.658

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MKK Technologies

India . 1,807 parts In-Stock

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$32.716

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$32.716

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DigiPath Technology Company

USA . 1,807 parts In-Stock

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$32.716

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1,807

$32.716

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Parana Technologies

USA . 966 parts In-Stock

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$20.802

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Perfect Parts

USA . 790 parts In-Stock

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Corphita

USA . 778 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Unlock endless possibilities with the STM32F372V8T6 microcontroller by STMicroelectronics. Crafted with precision and cutting-edge technology, this powerhouse is designed to redefine innovation across various applications. From IoT devices to consumer electronics, the STM32F372V8T6 offers unmatched performance and reliability. Dive into a world of seamless connectivity, enhanced functionality, and unparalleled efficiency with this game-changing microcontroller. Elevate your projects and push boundaries with the STM32F372V8T6 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square package shape enables efficient use of board space and simplifies the design layout.

Bit Size: 32

32-bit architecture offers enhanced processing power and performance for advanced applications.

Power Supplies (V): 2.5/3.3

Flexible power supply options allow for compatibility with a range of systems and devices.

No. of Terminals: 100

Having 100 terminals provides versatility in connecting to external components and peripherals, expanding the functionality of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and low-profile design, suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family delivers high performance and efficiency, enabling fast and precise data processing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold environments without compromising performance.

Terminal Position: QUAD

Quad terminal position enhances connectivity and facilitates easy integration with other circuit components.

ROM Words: 65536

Large ROM capacity of 65536 words provides ample storage for program data, enabling complex algorithms to be implemented.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in demanding industrial settings.

RAM Bytes: 16384

Generous RAM capacity of 16384 bytes enables efficient data storage and quick access for processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and strong mechanical connections, ensuring reliable performance over time.

Maximum Supply Current: 75.7 mA

Low maximum supply current of 75.7 mA minimizes power consumption, contributing to energy efficiency and longer battery life.

ROM Programmability: FLASH

Flash ROM programmability enables easy updating and customization of firmware, facilitating adaptability to changing requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for compact layout and high-density mounting, ideal for miniaturized electronic devices.

Speed: 72 rpm

With a speed of 72 rpm, the microcontroller can execute instructions quickly and efficiently, enhancing overall system performance.

Technical Specifications

Microcontrollers STM32F372V8T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M4F

JESD-30 Code:

S-PQFP-G100

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

75.7 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STM32F372V8T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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