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STM32F372RBT6

STMicroelectronics

STM32F372RBT6 by STMicroelectronics

STM32F372RBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4F CPU. It operates at -40 to 85 °C, has 131072 ROM words, and 24576 RAM bytes. Ideal for industrial applications requiring high-speed processing in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Vyrian

USA . 4,463 parts In-Stock

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4,463

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Digiode

USA . 2,775 parts In-Stock

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2,775

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Anansix

USA . 1,810 parts In-Stock

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1,810

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Distributors (Availability)

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Microchip USA

USA . 458 parts In-Stock

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$9.347

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458

$9.347

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AZTECH Wire

Italy . 1,032 parts In-Stock

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$18.470

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$18.470

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IDEA Electronic Components Group

UK . 1,901 parts In-Stock

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$76.596

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$68.936

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1,901

$76.596

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$68.936

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MKK Technologies

India . 402 parts In-Stock

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$144.033

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402

$144.033

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DigiPath Technology Company

USA . 402 parts In-Stock

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$144.033

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402

$144.033

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 2,056 parts In-Stock

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$91.582

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2,056

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$91.582

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Corphita

USA . 1,610 parts In-Stock

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1,610

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Perfect Parts

USA . 487 parts In-Stock

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487

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Overview

Unleash the power of innovation with the STM32F372RBT6 microcontroller by STMicroelectronics. Designed with cutting-edge technology and precision engineering, this device offers unmatched performance and reliability for a wide range of applications. Whether you are working on IoT devices, consumer electronics, or industrial automation, this product delivers superior functionality and efficiency. Experience seamless integration, low power consumption, and high-speed processing to bring your projects to life. Upgrade your designs with the STM32F372RBT6 and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the product more affordable and easier to handle during assembly.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space in the final product.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and processing tasks efficiently.

Power Supplies (V): 2.5/3.3

Supporting multiple power supply options gives flexibility in designing systems and optimizing power consumption.

No. of Terminals: 64

Having 64 terminals allows for more connectivity options and interfaces, enabling a wide range of applications.

Package Style (Meter): FLATPACK

The flatpack style offers a compact form factor, saving space on the PCB and enabling smaller design solutions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand tough industrial environments without overheating.

CPU Family: CORTEX-M4F

The Cortex-M4F architecture provides high performance and energy efficiency, ideal for demanding applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this microcontroller can function reliably in extreme cold conditions.

ROM Words: 131072

The large ROM capacity allows for storing complex code and firmware, essential for advanced applications and functionalities.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this microcontroller can operate in harsh environments with high reliability and durability.

RAM Bytes: 24576

With a generous amount of RAM, this microcontroller can handle multitasking and data storage efficiently.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, improving overall performance.

Terminal Form: GULL WING

The gull wing terminal form is ideal for surface mounting, providing strong solder joints for reliability in assembly.

Maximum Supply Current: 75.7 mA

The low maximum supply current ensures efficient power usage and helps prevent overheating under load.

ROM Programmability: FLASH

The flash programmable ROM allows for easy firmware updates and customization, enhancing the flexibility of the product.

Terminal Pitch: 0.5 mm

With a small terminal pitch, this microcontroller supports high-density packaging, enabling more features in a smaller footprint.

Speed: 72 rpm

Operating at a speed of 72 rpm, this microcontroller delivers fast processing capabilities for real-time applications.

Technical Specifications

Microcontrollers STM32F372RBT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M4F

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

75.7 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STM32F372RBT6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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