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STM32F372CCT6

STMicroelectronics

STM32F372CCT6 by STMicroelectronics

STM32F372CCT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4F CPU, 262144 ROM words, and 32768 RAM bytes. Ideal for industrial applications, it operates b/w -40 to 85 °C with power supplies of 2.5/3.3V and max supply current of 75.7mA at a speed of 72rpm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,209 parts In-Stock

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Digiode

USA . 1,571 parts In-Stock

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1,571

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Anansix

USA . 940 parts In-Stock

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940

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Distributors (Availability)

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AZTECH Wire

Italy . 424 parts In-Stock

1+ parts

$12.720

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424

$12.720

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Microchip USA

USA . 320 parts In-Stock

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$34.577

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320

$34.577

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IDEA Electronic Components Group

UK . 1,501 parts In-Stock

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$38.411

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$34.570

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1,501

$38.411

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$34.570

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MKK Technologies

India . 1,154 parts In-Stock

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$72.229

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1,154

$72.229

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DigiPath Technology Company

USA . 1,154 parts In-Stock

1+ parts

$72.229

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1,154

$72.229

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Component Stockers USA

USA . 730 parts In-Stock

1+ parts

$99.990

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730

$99.990

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Vigor

Singapore . 6,291 parts In-Stock

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6,291

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Perfect Parts

USA . 2,556 parts In-Stock

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2,556

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Corphita

USA . 1,134 parts In-Stock

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1,134

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Parana Technologies

USA . 51 parts In-Stock

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100+ parts

$45.926

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51

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$45.926

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Overview

Unleash the power of innovation with the STM32F372CCT6 by STMicroelectronics. Crafted with precision and expertise, this microcontroller is designed to elevate your projects to new heights. Whether you're in the automotive, industrial, or consumer electronics industry, this product offers unmatched value and performance. Experience seamless operation and unparalleled efficiency with the STM32F372CCT6, the ultimate choice for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle more complex calculations and tasks efficiently.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages adds versatility to the product, making it compatible with various systems.

No. of Terminals: 48

Having 48 terminals allows for connecting a wide range of peripherals and components, increasing the product's functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for industrial applications where temperature fluctuations are common.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers high-performance capabilities, making the microcontroller ideal for demanding tasks.

RAM Bytes: 32768

With 32KB of RAM, the microcontroller can efficiently store and access data during operation.

ROM Words: 262144

With 262144 ROM words, the microcontroller can store a large amount of program code for execution.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

ROM Programmability: FLASH

The use of FLASH memory for ROM programmability allows for easy and quick reprogramming of the microcontroller.

Speed: 72 rpm

Operating at 72 RPM, the microcontroller can execute instructions at a fast pace, enhancing overall system performance.

Technical Specifications

Microcontrollers STM32F372CCT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M4F

JESD-30 Code:

S-PQFP-G48

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

75.7 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STM32F372CCT6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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