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STM32F358RCT6

STMicroelectronics

STM32F358RCT6 by STMicroelectronics

STM32F358RCT6 by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 32 MHz and operates b/w 1.65V to 1.95V. It features ADC, DMA, and PWM channels, making it ideal for embedded applications in automation and control systems. Its compact FLATPACK design ensures efficient space utilization in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,225 parts In-Stock

1+ parts

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13,225

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Anansix

USA . 2,659 parts In-Stock

1+ parts

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1k+ parts

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2,659

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Pegasus Components GmbH

Germany . 960 parts In-Stock

1+ parts

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960

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Digiode

USA . 818 parts In-Stock

1+ parts

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818

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,080 parts In-Stock

1+ parts

$3.980

100+ parts

-

1k+ parts

-

10k+ parts

-

1,080

$3.980

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AZTECH Wire

Italy . 1,104 parts In-Stock

1+ parts

$20.180

100+ parts

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1,104

$20.180

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IDEA Electronic Components Group

UK . 113 parts In-Stock

1+ parts

$60.872

100+ parts

-

1k+ parts

$54.785

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113

$60.872

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$54.785

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MKK Technologies

India . 362 parts In-Stock

1+ parts

$114.465

100+ parts

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362

$114.465

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DigiPath Technology Company

USA . 362 parts In-Stock

1+ parts

$114.465

100+ parts

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362

$114.465

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Corphita

USA . 2,625 parts In-Stock

1+ parts

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2,625

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Parana Technologies

USA . 605 parts In-Stock

1+ parts

-

100+ parts

$72.782

1k+ parts

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605

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$72.782

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Overview

Elevate your projects with the STM32F358RCT6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. This powerful 32-bit MCU combines remarkable processing capabilities and energy efficiency, perfect for a variety of applications, from industrial automation to IoT devices. With its reliable performance and robust support, you can unleash creativity while ensuring seamless connectivity and control, making it an invaluable asset for your next breakthrough.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact designs and easy integration into modern electronic circuits.

Maximum Supply Voltage: 1.95 V

Operating at a maximum voltage of 1.95 V ensures energy efficiency, making it suitable for battery-powered applications.

Package Shape: SQUARE

The square package shape optimizes board space and layout flexibility during the design process.

Bit Size: 32

The 32-bit architecture provides ample processing power for complex applications and higher performance.

No. of Terminals: 64

With 64 terminals, this microcontroller supports a greater number of I/O connections and peripherals for versatile applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enables high-density designs and efficient space utilization.

Minimum Supply Voltage: 1.65 V

The minimum supply voltage of 1.65 V allows the IC to operate in low-power scenarios, extending battery life and reducing overall energy consumption.

ADC Channels: YES

Presence of ADC channels expands the capability for analog signal processing, allowing for more complex sensor integrations.

DMA Channels: YES

DMA channels enhance data transfer efficiency, enabling faster data handling without burdening the CPU.

Terminal Position: QUAD

Quad terminal positioning ensures a stable mount and minimizes board space while offering better heat dissipation.

Width: 10 mm

The compact width of 10 mm makes it ideal for space-constrained applications while facilitating easier routing on PCBs.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz permits high-speed processing and quick response times for applications needing real-time performance.

Length: 10 mm

The 10 mm length complements the width, ensuring a compact footprint well-suited for various electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from a simplified instruction set, leading to faster execution and lower power consumption.

Terminal Form: GULL WING

The gull wing terminal form makes soldering easy, aiding in the manufacturing process and improving reliability.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V allows for compatibility with low-power logic levels, making it suitable for modern low-voltage designs.

PWM Channels: YES

Availability of PWM channels enables precise control in applications like motor control and lighting systems.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is ideal for building compact and densely populated circuit boards, which is crucial in modern electronics.

Speed: 72 rpm

The speed specification is relevant for applications requiring synchronous operations, which can enhance overall system performance.

No. of I/O Lines: 51

With 51 I/O lines, this microcontroller provides extensive interfacing options for diverse application needs, enhancing flexibility in design.

Technical Specifications

Microcontrollers STM32F358RCT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

51

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

72 rpm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32F358RCT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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