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STM32F303VEH7

STMicroelectronics

STM32F303VEH7 by STMicroelectronics

STM32F303VEH7 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4F CPU, 24-bit address bus, and 32 MHz clock frequency. It features 86 I/O lines, 39 ADC channels, and connectivity options like CAN, USB, and UART. Ideal for industrial applications requiring high-speed processing and extensive peripheral support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,837 parts In-Stock

1+ parts

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5,837

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Anansix

USA . 2,189 parts In-Stock

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2,189

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Digiode

USA . 944 parts In-Stock

1+ parts

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944

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 6,000 parts In-Stock

1+ parts

$6.670

100+ parts

-

1k+ parts

-

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6,000

$6.670

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AZTECH Wire

Italy . 861 parts In-Stock

1+ parts

$11.190

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861

$11.190

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IDEA Electronic Components Group

UK . 2,187 parts In-Stock

1+ parts

$19.647

100+ parts

-

1k+ parts

$17.682

10k+ parts

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2,187

$19.647

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$17.682

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Microchip USA

USA . 4,972 parts In-Stock

1+ parts

$21.857

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4,972

$21.857

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MKK Technologies

India . 1,212 parts In-Stock

1+ parts

$36.944

100+ parts

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1,212

$36.944

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DigiPath Technology Company

USA . 1,212 parts In-Stock

1+ parts

$36.944

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1,212

$36.944

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Parana Technologies

USA . 1,854 parts In-Stock

1+ parts

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$23.490

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1,854

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$23.490

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Corphita

USA . 1,316 parts In-Stock

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1,316

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Overview

Unlock the power of innovation with the STM32F303VEH7 microcontroller by STMicroelectronics. Designed with precision and expertise, this versatile device offers endless possibilities for your projects. From industrial automation to consumer electronics, the STM32F303VEH7 delivers unparalleled performance and reliability. With advanced features like ADC channels, DMA support, and a wide range of connectivity options, this microcontroller is a game-changer in the world of embedded systems. Explore new horizons and revolutionize your designs with the STM32F303VEH7 - where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, ensuring a long lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, making the product suitable for mass production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, the product can handle a wide range of power inputs, making it versatile for different applications.

Address Bus Width: 24

A wide address bus width allows for efficient memory addressing, enabling the product to handle large amounts of data effectively.

Package Shape: SQUARE

The square package shape offers a compact and space-saving design, ideal for embedded applications with limited space constraints.

Bit Size: 32

A 32-bit architecture provides high processing power and performance capabilities, making the product suitable for complex tasks and computations.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows for flexibility in design and compatibility with different power sources.

No. of Terminals: 100

The high number of terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style ensures secure connections and reliable signal transmission, essential for stable operation.

Minimum Supply Voltage: 2 V

A low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, making it suitable for industrial applications.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers high performance and energy efficiency, allowing for reliable and fast processing of instructions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments, making the product versatile for various applications.

ADC Channels: YES

Analog-to-digital converter channels allow for the digitization of analog signals, providing accurate data acquisition and processing capabilities.

DMA Channels: YES

Direct memory access channels enhance data transfer rates and processing efficiency, enabling high-speed data handling and multitasking capabilities.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting on PCBs, ensuring stable connections and reliable operation.

ROM Words: 524288

With a large ROM capacity, the product offers ample storage for firmware and program code, suitable for versatile and complex applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Digital-to-analog converters provide accurate signal conversion for output devices, enabling precise control and communication with external components.

Width: 7 mm

A compact width allows for space-efficient design and integration, making the product suitable for small form factor applications.

External Data Bus Width: 32

A wide external data bus width enables fast data transfer and processing speeds, essential for handling large datasets and complex computations.

Peripherals: COMPARATOR(7), DMA(12), POR, RTC, TIMER(14)

A versatile range of peripherals enhances functionality and versatility, making the product suitable for a wide range of applications and tasks.

Maximum Clock Frequency: 32 MHz

A high maximum clock frequency allows for fast processing speeds and real-time performance, essential for time-sensitive applications.

Length: 7 mm

A compact length contributes to a space-saving design and efficient integration, ideal for compact and embedded applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments and industrial settings, making the product suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller and RISC architecture offer high efficiency and performance for embedded applications, enabling reliable and fast operation.

RAM Bytes: 65536

A large RAM capacity provides ample space for data storage and processing, enabling efficient multitasking and data handling capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, making the product energy-efficient and cost-effective.

Terminal Form: BALL

Ball terminal form ensures secure connections and reliable signal transmission, essential for stable operation and data integrity.

Analog To Digital Convertors: 39-Ch 12-Bit

A high number of analog-to-digital converter channels provide versatile analog signal processing capabilities, essential for interfacing with various sensors and devices.

Maximum Supply Current: 77.4 mA

With a moderate maximum supply current, the product offers efficient power consumption and compatibility with various power sources.

Nominal Supply Voltage: 3.3 V

A stable nominal supply voltage ensures consistent and reliable operation, essential for long-term performance and system stability.

PWM Channels: YES

Pulse width modulation channels enable precise control of output signals, essential for applications requiring accurate and adjustable voltage levels.

Connectivity: CAN, I2C(3), I2S(2), IRDA, LIN, SPI(4), UART(2), USART(3), USB

A wide range of connectivity options allows for versatile communication and interfacing with external devices, making the product suitable for diverse applications.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility and ease of updating firmware and program code, essential for customization and maintenance.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density connections and space-efficient design, ideal for compact and miniaturized applications.

Speed: 72 rpm

A high speed rating ensures fast data processing and real-time performance, essential for time-critical applications and tasks.

On Chip Program ROM Width: 8

On-chip program ROM width provides ample storage for built-in programs and firmware, enhancing the product's standalone operation capabilities.

No. of I/O Lines: 86

A high number of input/output lines enable versatile connectivity and interfacing options, making the product suitable for diverse and complex applications.

Technical Specifications

Microcontrollers STM32F303VEH7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of I/O Lines:

86

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

77.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), I2S(2), IRDA, LIN, SPI(4), UART(2), USART(3), USB

Peripherals:

COMPARATOR(7), DMA(12), POR, RTC, TIMER(14)

Analog To Digital Convertors:

39-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F303VEH7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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