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STM32F303C8Y6TR

STMicroelectronics

STM32F303C8Y6TR by STMicroelectronics

STM32F303C8Y6TR microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and supports ADC and PWM channels. With 49 terminals and a clock speed of 32 MHz, it's ideal for embedded applications requiring efficient processing. Its compact design makes it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,450 parts In-Stock

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9,450

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Digiode

USA . 3,502 parts In-Stock

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3,502

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Anansix

USA . 2,084 parts In-Stock

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2,084

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Distributors (Availability)

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AZTECH Wire

Italy . 462 parts In-Stock

1+ parts

$9.430

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462

$9.430

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IDEA Electronic Components Group

UK . 1,625 parts In-Stock

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$29.924

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$26.932

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1,625

$29.924

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$26.932

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MKK Technologies

India . 1,697 parts In-Stock

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$56.270

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1,697

$56.270

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DigiPath Technology Company

USA . 1,697 parts In-Stock

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$56.270

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1,697

$56.270

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QUARKTWIN TECHNOLOGY LTD

USA . 14,726 parts In-Stock

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14,726

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Vigor

Singapore . 3,770 parts In-Stock

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3,770

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Corphita

USA . 1,393 parts In-Stock

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1,393

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Parana Technologies

USA . 463 parts In-Stock

1+ parts

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$35.779

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463

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$35.779

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Overview

Unlock the potential of your next project with the STM32F303C8Y6TR microcontroller from STMicroelectronics. Renowned for its exceptional quality and innovation, STMicroelectronics delivers a powerhouse solution designed to enhance performance in embedded systems. With versatile applications ranging from robotics to IoT devices, this microcontroller offers unmatched efficiency, advanced features, and reliability, empowering you to create smarter, more responsive designs that stand out in today's competitive market.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact and efficient PCB layouts, making this microcontroller ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can operate with a wide range of power supplies, providing flexibility in different applications.

Package Shape: RECTANGULAR

The rectangular package shape aids in better layout options for PCBs and optimizes space usage in electronic designs.

Bit Size: 32

The 32-bit architecture allows for faster data processing and better handling of complex tasks, making it suitable for high-performance applications.

No. of Terminals: 49

With 49 terminals, this microcontroller offers extensive connectivity options for peripherals, enhancing versatility in system designs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array design with a thin profile allows for high-density packaging, ideal for modern compact electronic devices.

Minimum Supply Voltage: 2 V

The low minimum supply voltage increases energy efficiency, making this microcontroller suitable for battery-powered devices.

ADC Channels: YES

With ADC channels available, this microcontroller can effectively process analog signals, rendering it suitable for sensor applications.

DMA Channels: YES

DMA channels facilitate efficient data transfer without CPU intervention, improving system performance in data-intensive applications.

Terminal Position: BOTTOM

Bottom terminal positioning provides easier access for soldering in surface mount applications, enhancing manufacturability.

Width: 3.151 mm

The compact width makes it suitable for tight spaces in portable and miniature devices.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz enables fast processing speeds, allowing for real-time applications and efficient operations.

Length: 3.417 mm

The small length contributes to an overall compact design, perfect for space-sensitive projects.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-based microcontroller, it offers low power consumption and high performance, ideal for embedded systems.

Terminal Form: BALL

Ball terminal form enhances soldering reliability and improves electrical connections, making it suitable for high-density assemblies.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V balances performance and energy efficiency, essential for modern electronic applications.

PWM Channels: YES

PWM channels enable precise control of motors and other actuators, making this microcontroller suitable for robotics and automation.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm allows for more compact layouts and higher pin counts within a limited footprint.

Speed: 72 rpm

This speed enables efficient operation in various applications, particularly those involving motion control.

No. of I/O Lines: 37

With 37 I/O lines, this microcontroller offers ample connectivity for interfacing with multiple devices and peripherals, making it highly versatile.

Technical Specifications

Microcontrollers STM32F303C8Y6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

3.417 mm

No. of I/O Lines:

37

No. of Terminals:

49

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

72 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.151 mm

Peripheral IC Type:

Trade Compliance

STM32F303C8Y6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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