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STM32F302VCT7TR

STMicroelectronics

STM32F302VCT7TR by STMicroelectronics

STM32F302VCT7TR by STMicroelectronics is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring high-speed processing and low power consumption. With features like DAC, ADC, and PWM channels, it offers versatile functionality for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 4,000 parts In-Stock

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4,000

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Distributors (In-Stock)

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Vyrian

USA . 7,893 parts In-Stock

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7,893

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Digiode

USA . 4,378 parts In-Stock

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4,378

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Anansix

USA . 2,016 parts In-Stock

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2,016

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Chip Stock

USA . 1,025 parts In-Stock

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1,025

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J2 Sourcing AB

Sweden . 500 parts In-Stock

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500

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Distributors (Availability)

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Vigor

Singapore . 1,384 parts In-Stock

1+ parts

$4.640

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-

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1,384

$4.640

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AZTECH Wire

Italy . 911 parts In-Stock

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$10.310

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-

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911

$10.310

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Microchip USA

USA . 4,121 parts In-Stock

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$16.037

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4,121

$16.037

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IDEA Electronic Components Group

UK . 778 parts In-Stock

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$70.219

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-

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$63.197

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778

$70.219

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$63.197

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MKK Technologies

India . 39 parts In-Stock

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$132.042

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39

$132.042

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DigiPath Technology Company

USA . 39 parts In-Stock

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$132.042

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39

$132.042

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QUARKTWIN TECHNOLOGY LTD

USA . 28,747 parts In-Stock

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28,747

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Eastek

USA . 12,000 parts In-Stock

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Perfect Parts

USA . 6,720 parts In-Stock

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6,720

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Parana Technologies

USA . 1,617 parts In-Stock

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$83.958

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1,617

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$83.958

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Corphita

USA . 1,355 parts In-Stock

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1,355

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Overview

Elevate your projects with the high-quality STM32F302VCT7TR microcontroller by STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics delivers top-notch products that are reliable and efficient. This microcontroller is perfect for a wide range of applications, offering customers value through its advanced features and capabilities. With its 32-bit architecture, DAC and ADC channels, and DMA support, this microcontroller provides unmatched performance and flexibility. Trust STMicroelectronics to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontroller packages due to its durability and ability to protect the integrated circuits from external elements.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, making this microcontroller easier to integrate into circuit boards.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options, making this microcontroller suitable for a variety of applications.

Package Shape: SQUARE

The square package shape helps in efficient use of space on the circuit board, ideal for compact designs.

Bit Size: 32

A 32-bit microcontroller offers improved processing capabilities, making it suitable for complex tasks and applications.

DAC Channels: YES

The presence of DAC channels allows for accurate analog signal generation, making this microcontroller suitable for applications that require precise control.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltage options provides flexibility in design and compatibility with different power sources.

No. of Terminals: 100

A higher number of terminals allows for more connectivity options, enabling the microcontroller to interface with a wide range of external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style helps in space-saving design and efficient heat dissipation, ideal for compact and high-performance applications.

Minimum Supply Voltage: 2 V

The low minimum supply voltage requirement allows for operation in low-power scenarios, making this microcontroller energy-efficient.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures reliable performance even in harsh environmental conditions.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers high performance and advanced features, making this microcontroller suitable for demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for operation in extreme cold environments, expanding the range of applications for this microcontroller.

ADC Channels: YES

The presence of ADC channels enables accurate analog-to-digital conversion, essential for sensor interfacing and data acquisition applications.

DMA Channels: YES

DMA channels improve data transfer efficiency and reduce CPU workload, enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position allows for easy connectivity and efficient layout on the circuit board.

ROM Words: 262144

The large ROM size allows for storage of program code and data, essential for complex applications with extensive software requirements.

Maximum Seated Height: 1.6 mm

The low maximum seated height makes this microcontroller suitable for slim and compact device designs.

Width: 14 mm

The compact width dimension enables space-efficient placement on the circuit board, ideal for size-constrained designs.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency supports rapid data processing and efficient task execution, suitable for high-speed applications.

Length: 14 mm

The compact length dimension facilitates space-saving layout on the circuit board, ideal for compact and integrated designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller offers high performance and efficient execution of instructions, making it suitable for real-time control applications.

RAM Bytes: 32768

The ample RAM capacity enables efficient data storage and processing within the microcontroller, essential for multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and robust electrical connections, ensuring reliable operation in demanding conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides compatibility with standard power sources and enables easy integration into existing circuit designs.

PWM Channels: YES

The presence of PWM channels allows for precise control of pulse-width modulation signals, essential for applications such as motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and software, enabling future enhancements and customization of the microcontroller.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables compact layout on the circuit board and high-density interconnectivity, ideal for space-constrained designs.

Speed: 72 rpm

The high speed capability of 72 rpm allows for rapid data processing and task execution, suitable for time-critical applications.

No. of I/O Lines: 87

The large number of I/O lines provides versatile connectivity options and interfacing capabilities, making this microcontroller suitable for complex systems and applications.

Technical Specifications

Microcontrollers STM32F302VCT7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

87

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32F302VCT7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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