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STM32F302C8Y6TR

STMicroelectronics

STM32F302C8Y6TR by STMicroelectronics

STM32F302C8Y6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, offering 11-Ch 12-Bit ADC channels and 1-Ch 12-Bit DAC channel. With a max clock frequency of 32 MHz, it is suitable for industrial applications requiring low power mode and various connectivity options like CAN, I2C, SPI, USART, and USB.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Vyrian

USA . 2,619 parts In-Stock

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2,619

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Anansix

USA . 1,781 parts In-Stock

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1,781

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Digiode

USA . 1,251 parts In-Stock

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1,251

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,374 parts In-Stock

1+ parts

$7.341

100+ parts

-

1k+ parts

$7.047

10k+ parts

$7.047

1,374

$7.341

-

$7.047

$7.047

AZTECH Wire

Italy . 1,087 parts In-Stock

1+ parts

$10.250

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1,087

$10.250

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IDEA Electronic Components Group

UK . 2,298 parts In-Stock

1+ parts

$47.315

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$42.583

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2,298

$47.315

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$42.583

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MKK Technologies

India . 1,680 parts In-Stock

1+ parts

$88.972

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1,680

$88.972

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DigiPath Technology Company

USA . 1,680 parts In-Stock

1+ parts

$88.972

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1,680

$88.972

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QUARKTWIN TECHNOLOGY LTD

USA . 26,383 parts In-Stock

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26,383

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Vigor

Singapore . 1,187 parts In-Stock

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1,187

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Corphita

USA . 914 parts In-Stock

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914

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Parana Technologies

USA . 265 parts In-Stock

1+ parts

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$56.572

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265

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$56.572

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Overview

Unleash the power of innovation with the STM32F302C8Y6TR microcontroller from STMicroelectronics. Designed with cutting-edge technology and precision engineering, this versatile device offers a wide range of applications in various industries. With its advanced features and high-quality construction, customers can expect top-notch performance and reliability. Whether you're looking to streamline your operations or develop groundbreaking solutions, this microcontroller delivers unmatched value and benefits. Elevate your projects to the next level with the STM32F302C8Y6TR and experience the difference that quality craftsmanship makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and resources.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage ensures compatibility with a wide range of power sources.

On Chip Data RAM Width: 8

Wide on-chip data RAM width allows for efficient data processing and storage.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact form factor, saving space on the PCB.

Bit Size: 32

32-bit architecture enables high-performance computing capabilities for complex applications.

DAC Channels: YES

DAC channels allow for analog output capabilities, essential for many control and sensing applications.

No. of Terminals: 49

Large number of terminals provide ample connectivity options for external devices and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch offers high-density packaging and efficient heat dissipation.

Minimum Supply Voltage: 2 V

Low minimum supply voltage ensures compatibility with a wide range of power sources and energy-efficient operation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the product suitable for industrial and harsh environments.

CPU Family: CORTEX-M4

Cortex-M4 CPU family offers high-performance processing capabilities for a wide range of applications.

No. of External Interrupts: 2

Multiple external interrupts allow for efficient handling of real-time events and communication with external devices.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can operate in extreme cold environments without issues.

ADC Channels: YES

ADC channels enable analog input capabilities, essential for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels provide efficient data transfer capabilities, reducing CPU load and improving system performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and integration into system designs.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program data and code.

Maximum Seated Height: 0.585 mm

Low maximum seated height saves space on the PCB and enables compact system designs.

Digital To Analog Convertors: 1-Ch 12-Bit

12-bit DAC provides high-resolution analog output for precise control and signal generation.

Width: 3.151 mm

Compact width dimensions enable space-efficient PCB layouts and system integration.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging during product development and manufacturing.

Peripherals: COMPARATOR(3), DMA(7), POR, PWM(18), RTC, TIMER(7), WDT(2)

A wide range of peripherals including comparators, PWM channels, timers, and DMA controllers enhance the product's functionality and application versatility.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency enables fast processing speeds and real-time operation for time-critical applications.

Length: 3.417 mm

Compact length dimensions enable space-efficient PCB layouts and system integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller-based design with RISC architecture provides efficient and optimized processing capabilities for embedded applications.

No. of Timers: 7

Multiple timers offer precise timing and event scheduling capabilities for various application requirements.

RAM Bytes: 16384

Generous RAM capacity allows for efficient data storage and processing during runtime operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered and noise-sensitive applications.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and PCB mounting, ensuring reliable electrical connections.

Analog To Digital Convertors: 11-Ch 12-Bit

11-channel 12-bit ADC provides high-resolution analog input capabilities for accurate sensor data acquisition.

Maximum Supply Current: 50.1 mA

Low maximum supply current ensures energy-efficient operation and minimal power consumption.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the product within its specified operating range.

No. of DMA Channels: 7

Multiple DMA channels provide efficient data transfer capabilities, reducing CPU load and improving system performance.

PWM Channels: YES

PWM channels enable precise control of digital outputs, essential for applications such as motor control and power management.

Connectivity: CAN, I2C(3), I2S(2), SPI(2), USART(3), USB

Multiple connectivity options including CAN, I2C, SPI, USART, and USB enable seamless communication with external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and reprogramming of firmware, enhancing product flexibility and scalability.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables high-density packaging and efficient PCB layout while ensuring reliable electrical connections.

Format: FLOATING POINT

Floating-point format provides efficient mathematical calculations and data processing capabilities for complex algorithms and calculations.

Speed: 72 rpm

High processing speed of 72 rpm ensures fast and responsive operation for real-time applications and high-performance computing tasks.

Low Power Mode: YES

Low power mode enables energy-efficient operation, prolonging battery life and reducing overall power consumption.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 ensures efficient storage and execution of program code, enhancing overall system performance.

No. of I/O Lines: 37

Multiple I/O lines provide ample interfacing options for external devices and peripherals, enhancing overall system connectivity and versatility.

Technical Specifications

Microcontrollers STM32F302C8Y6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B49

Length:

3.417 mm

Low Power Mode:

YES

No. of DMA Channels:

7

No. of External Interrupts:

2

No. of I/O Lines:

37

No. of Terminals:

49

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

72 rpm

Maximum Supply Current:

50.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.151 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), I2S(2), SPI(2), USART(3), USB

Peripherals:

COMPARATOR(3), DMA(7), POR, PWM(18), RTC, TIMER(7), WDT(2)

Analog To Digital Convertors:

11-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32F302C8Y6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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